Download Lecture 5 - Auburn University

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Document related concepts
no text concepts found
Transcript
Low-Power Design and Test
Gate-Level Power Optimization
Vishwani D. Agrawal
Srivaths Ravi
Auburn University, USA
Texas Instruments India
[email protected]
[email protected]
Hyderabad, July 30-31, 2007
http://www.eng.auburn.edu/~vagrawal/hyd.html
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
1
Components of Power
 Dynamic
 Signal transitions
 Logic activity
 Glitches
 Short-circuit
 Static
 Leakage
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
2
Power of a Transition
isc
R
VDD
Dynamic Power
Vo
Vi
= CLVDD2/2 + Psc
CL
R
Ground
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
3
Dynamic Power
 Each transition of a gate consumes CV 2/2.
 Methods of power saving:
 Minimize load capacitances
 Transistor sizing
 Library-based gate selection
 Reduce transitions
 Logic design
 Glitch reduction
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
4
Glitch Power Reduction
 Design a digital circuit for minimum transient
energy consumption by eliminating hazards
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
5
Theorem 1
 For correct operation with minimum energy
consumption, a Boolean gate must produce
no more than one event per transition.
Output logic state changes
One transition is necessary
Copyright Agrawal & Srivaths, 2007
Output logic state unchanged
No transition is necessary
Low-Power Design and Test, Lecture 5
6
Event Propagation
Single lumped inertial delay modeled for each gate
PI transitions assumed to occur without time skew
Path P1
1
0
13
P2
0
2
0
Copyright Agrawal & Srivaths, 2007
1
3
2
246
Path P3
5
Low-Power Design and Test, Lecture 5
7
Inertial Delay of an Inverter
Vin
dHL+dLH
d = ────
dHL
2
dLH
Vout
time
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
8
Multi-Input Gate
A
DPD: Differential path delay
Delay = d
C
B
A
DPD
B
C
Copyright Agrawal & Srivaths, 2007
d
d Hazard or glitch
Low-Power Design and Test, Lecture 5
9
Balanced Path Delays
A
DPD
Delay buffer
Delay = d
C
B
A
B
C
Copyright Agrawal & Srivaths, 2007
d No glitch
Low-Power Design and Test, Lecture 5
10
Glitch Filtering by Inertia
A
Delay ≥ DPD
C
B
A
DPD
B
d =DPD
C
Copyright Agrawal & Srivaths, 2007
Filtered glitch
Low-Power Design and Test, Lecture 5
11
Theorem 2
 Given that events occur at the input of a gate
with inertial delay d at times, t1 ≤ . . . ≤ tn , the
number of events at the gate output cannot
exceed
tn – t1
min ( n , 1 + -------d
)
tn - t1
t1
Copyright Agrawal & Srivaths, 2007
t2
t3
tn
Low-Power Design and Test, Lecture 5
time
12
Minimum Transient Design
 Minimum transient energy condition for a Boolean
gate:
| t i - tj | <
d
Where ti and tj are arrival times of input
events and d is the inertial delay of gate
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
13
Balanced Delay Method
 All input events arrive simultaneously
 Overall circuit delay not increased
 Delay buffers may have to be inserted
1
1
1
1
1
No increase in
critical path
delay
3
1
Copyright Agrawal & Srivaths, 2007
1
1
1
Low-Power Design and Test, Lecture 5
1
14
Hazard Filter Method
 Gate delay is made greater than maximum input path
delay difference
 No delay buffers needed (least transient energy)
 Overall circuit delay may increase
Copyright Agrawal & Srivaths, 2007
1
1
1
1
1
1
1
1
1
3
Low-Power Design and Test, Lecture 5
15
Designing a Glitch-Free Circuit
 Maintain specified critical path delay.
 Glitch suppressed at all gates by
 Path delay balancing
 Glitch filtering by increasing inertial delay of gates
 A linear program optimally combines all objectives.
Delay = d1
Delay = d2
Copyright Agrawal & Srivaths, 2007
|d1 – d2| < D
D
Low-Power Design and Test, Lecture 5
16
Benchmark Circuits
Normalized Power
Average
Peak
Circuit
Max-delay
(gates)
No. of
Buffers
ALU4
7
15
5
0
0.80
0.79
0.68
0.67
C880
24
48
62
34
0.68
0.68
0.54
0.52
C6288
47
94
294
120
0.40
0.36
0.36
0.34
c7552
43
86
366
111
0.44
0.42
0.34
0.32
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
17
Four-Bit ALU
maxdelay
Buffers inserted
7
10
12
15
5
2
1
0
Maximum Power Savings (zero-buffer design):
Peak = 33 %, Average = 21 %
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
18
ALU4: Original and Low-Power
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
19
C7552 Circuit: Spice Simulation
Power Saving: Average 58%, Peak 68%
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
20
References
 R. Fourer, D. M. Gay and B. W. Kernighan, AMPL: A Modeling Language
for Mathematical Programming, South San Francisco: The Scientific
Press, 1993.
 M. Berkelaar and E. Jacobs, “Using Gate Sizing to Reduce Glitch Power,”
Proc. ProRISC Workshop, Mierlo, The Netherlands, Nov. 1996, pp. 183188.
 V. D. Agrawal, “Low Power Design by Hazard Filtering,” Proc. 10th Int’l
Conf. VLSI Design, Jan. 1997, pp. 193-197.
 V. D. Agrawal, M. L. Bushnell, G. Parthasarathy and R. Ramadoss,
“Digital Circuit Design for Minimum Transient Energy and Linear
Programming Method,” Proc. 12th Int’l Conf. VLSI Design, Jan. 1999, pp.
434-439.
 M. Hsiao, E. M. Rudnick and J. H. Patel, “Effects of Delay Model in Peak
Power Estimation of VLSI Circuits,” Proc. ICCAD, Nov. 1997, pp. 45-51.
 T. Raja, V. D. Agrawal and M. L. Bushnell, “Minimum Dynamic Power
CMOS Circuit Design by a Reduced Constraint Set Linear Program,” Proc.
16th Int’l Conf. VLSI Design, Jan. 2003, pp. 527-532.
 T. Raja, V. D. Agrawal and M. L. Bushnell, “Variable Input Delay CMOS
Logic for Low Power Design,” Proc. 18th Int’l Conf. VLSI Design, Jan.
2005, pp. 596-603.
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
21
Components of Power
 Dynamic
 Signal transitions
 Logic activity
 Glitches
 Short-circuit
 Static
 Leakage
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
22
Subthreshold Conduction
Ids
Vgs – Vth
-Vds
I0 exp( ───── ) × (1– exp ── )
nVT
VT
=
Ids
Subthreshold
region
1mA
100μA
10μA
1μA
100nA
10nA
1nA
100pA
10pA
Sunthreshold slope
Vth
0
Copyright Agrawal & Srivaths, 2007
Saturation region
0.3
0.6
0.9
1.2
Low-Power Design and Test, Lecture 5
1.5
1.8 V
Vgs
23
Thermal Voltage, vT
VT = kT/q = 26 mV, at room temperature.
When Vds is several times greater than VT
Ids
Copyright Agrawal & Srivaths, 2007
=
Vgs – Vth
I0 exp( ───── )
nVT
Low-Power Design and Test, Lecture 5
24
Leakage Current
Leakage current equals Ids when Vgs= 0
Leakage current, Ids = I0 exp(-Vth/nVT)
At cutoff, Vgs = Vth , and Ids = I0
Lowering leakage to 10-bI0
Vth = bnVT ln 10 = 1.5b × 26 ln 10 = 90b mV
 Example: To lower leakage to I0/1,000
Vth = 270 mV




Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
25
Threshold Voltage
 Vth = Vt0 + γ[(Φs+Vsb)½- Φs½]
 Vt0 is threshold voltage when source is at
body potential (0.4 V for 180nm process)
 Φs = 2VT ln(NA /ni ) is surface potential
 γ = (2qεsi NA)½tox /εox is body effect
coefficient (0.4 to 1.0)
 NA is doping level = 8×1017 cm-3
 ni = 1.45×1010 cm-3
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
26
Threshold Voltage, Vsb = 1.1V







Thermal voltage, VT = kT/q = 26 mV
Φs = 0.93 V
εox = 3.9×8.85×10-14 F/cm
εsi = 11.7×8.85×10-14 F/cm
tox = 40 Ao
γ = 0.6 V½
Vth = Vt0 + γ[(Φs+Vsb)½- Φs½] = 0.68 V
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
27
A Sample Calculation
 VDD = 1.2V, 100nm CMOS process
 Transistor width, W = 0.5μm
 OFF device (Vgs = Vth) leakage
 I0 = 20nA/μm, for low threshold transistor
 I0 = 3nA/μm, for high threshold transistor
 100M transistor chip
 Power = (100×106/2)(0.5×20×10-9A)(1.2V) = 600mW
for all low-threshold transistors
 Power = (100×106/2)(0.5×3×10-9A)(1.2V) = 90mW
for all high-threshold transistors
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
28
Dual-Threshold Chip
 Low-threshold only for 20% transistors on
critical path.
 Leakage power = 600×0.2 + 90×0.8
= 120 + 72
= 192 mW
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
29
Dual-Threshold CMOS Circuit
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
30
Dual-Threshold Design
 To maintain performance, all gates on the
critical path are assigned low Vth .
 Most of the other gates are assigned high
Vth . But,
 Some gates on non-critical paths may
also be assigned low Vth to prevent those
paths from becoming critical.
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
31
Integer Linear Programming (ILP) to
Minimize Leakage Power
 Use dual-threshold CMOS process
 First, assign all gates low Vth
 Use an ILP model to find the delay (Tc) of the
critical path
 Use another ILP model to find the optimal Vth
assignment as well as the reduced leakage
power for all gates without increasing Tc
 Further reduction of leakage power possible by
letting Tc increase
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
32
ILP -Variables
For each gate i define two variables.
 Ti : the longest time at which the output
of gate i can produce an event after the
occurrence of an input event at a primary
input of the circuit.
 Xi : a variable specifying low or high Vth
for gate i ; Xi is an integer [0, 1],
1  gate i is assigned low Vth ,
0  gate i is assigned high Vth .
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
33
ILP - objective function
Leakage power:
Pleak  Vdd  I leaki
i
minimize the sum of all gate leakage currents, given by
Min   X i  I Li  1  X i   I Hi 
i
 ILi is the leakage current of gate i with low Vth
 IHi is the leakage current of gate i with high Vth
 Using SPICE simulation results, construct a leakage
current look up table, which is indexed by the gate type
and the input vector.
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
34
ILP - Constraints
 For each gate
(1)
Gate i
Ti  T j  X i  DLi  1  X i   DHi
Ti
output of gate j is fanin of gate i
(2)
Gate j
0  Xi 1
Tj
 Max delay constraints for primary outputs (PO)
(3)
Ti  Tmax
Tmax is the maximum delay of the critical path
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
35
ILP Constraint Example
0
1
2
3
Ti  T j  X i  DLi  1  X i   DHi
 Assume all primary input (PI) signals on the left arrive at the
same time.
 For gate 2, constraints are
T2  T0  X 2  DL 2  1  X 2   DH 2
T2  0  X 2  DL2  1  X 2   DH 2
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
36
ILP – Constraints (cont.)
 DHi is the delay of gate i with high Vth
 DLi is the delay of gate i with low Vth
 A second look-up table is constructed and
specifies the delay for given gate type and
fanout number.
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
37
ILP – Finding Critical Delay
Ti  Tmax
 Tmax can be specified or be the delay of longest path (Tc).
 To find Tc , we change constraints (2) to an equation,
assigning all gates low Vth
0  Xi 1
Xi 1
 Maximum Ti in the ILP solution is Tc.
 If we replace Tmax with Tc , the objective function minimizes
leakage power without sacrificing performance.
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
38
Power-Delay Tradeoff
1
0.9
Normalized Leakage Power
0.8
C432
0.7
C880
0.6
C1908
0.5
0.4
0.3
0.2
0.1
1
1.1
1.2
1.3
1.4
1.5
Normalized Critical Path Delay
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
39
Power-Delay Tradeoff
 If we gradually increase Tmax from Tc , leakage
power is further reduced, because more gates
can be assigned high Vth .
 But, the reduction trends to become slower.
 When Tmax = (130%) Tc , the reduction about
levels off because almost all gates are assigned
high Vth .
 Maximum leakage reduction can be 98%.
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
40
Leakage & Dynamic Power Optimization 70nm
CMOS c7552 Benchmark Circuit @ 90oC
900
800
Microwatts
700
600
500
Leakage power
Dynamic power
Total power
400
300
200
100
0
Original circuit
Copyright Agrawal & Srivaths, 2007
Optimized
design
Low-Power Design and Test, Lecture 5
Y. Lu and V. D. Agrawal, “CMOS
Leakage and Glitch
Minimization for PowerPerformance Tradeoff,” Journal
of Low Power Electronics
(JOLPE), vol. 2, no. 3, pp. 378387, December 2006.
41
Summary
 Leakage power is a significant fraction of the
total power in nanometer CMOS devices.
 Leakage power increases with temperature; can
be as much as dynamic power.
 Dual threshold design can reduce leakage.
 Reference: Y. Lu and V. D. Agrawal, “CMOS Leakage
and Glitch Minimization for Power-Performance
Tradeoff,” J. Low Power Electronics, Vol. 2, No. 3, pp.
378-387, December 2006.
 Access other paper at
http://www.eng.auburn.edu/~vagrawal/TALKS/talks.html
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
42
Problem: Leakage Reduction
Following circuit is designed in 65nm CMOS technology using low threshold
transistors. Each gate has a delay of 5ps and a leakage current of 10nA.
Given that a gate with high threshold transistors has a delay of 12ps and
leakage of 1nA, optimally design the circuit with dual-threshold gates to
minimize the leakage current without increasing the critical path delay.
What is the percentage reduction in leakage power? What will the leakage
power reduction be if a 30% increase in the critical path delay is allowed?
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
43
Solution 1: No Delay Increase
Three critical paths are from the first, second and third inputs to the last
output, shown by a dashed line arrow. Each has five gates and a delay of
25ps. None of the five gates on the critical path (red arrow) can be
assigned a high threshold. Also, the two inverters that are on four-gate long
paths cannot be assigned high threshold because then the delay of those
paths will become 27ps. The remaining three inverters and the NOR gate
can be assigned high threshold. These gates are shaded grey in the circuit.
The reduction in leakage power = 1 – (4×1+7×10)/(11×10) = 32.73%
Critical path delay = 25ps
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
44
Solution 2: 30% Delay Increase
Several solutions are possible. Notice that any 3-gate path can have 2 high
threshold gates. Four and five gate paths can have only one high threshold
gate. One solution is shown in the figure below where six high threshold
gates are shown with shading and the critical path is shown by a dashed
red line arrow.
The reduction in leakage power = 1 – (6×1+5×10)/(11×10) = 49.09%
Critical path delay = 29ps
Copyright Agrawal & Srivaths, 2007
Low-Power Design and Test, Lecture 5
45
Related documents