Survey
* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project
The New Single-silicon TFTs Structure for Kinkcurrent Suppression with Symmetric Dual-Gate by Three Split Floating N+ Zones Supervised by Man Young Sung (Korea Univ.) Dept. of Electrical Engineering, Korea Univ. Dae Yeon Lee 2 Contents Introduction Background Proposal Simulation & Results Conclusion Semiconductor & CAD Lab. Dae Yeon Lee 3 Introduction The Conventional Single-Gate TFT The Conventional Dual-Gate TFT * High On-current * Low On-current * High Electric Field at the Channel/Drain Junction * Low Electric Field at the Channel/Drain Junction * Kink-Effect * Stable I-V Characteristic by Kink-Effect Suppression Premature Breakdown ! High On-Current + Reduction of Kink-Effect Goal is the Mixing of The Merit the each two TFTs 1. Kink-Effect Suppression 2. Improved On-Current Semiconductor & CAD Lab. Dae Yeon Lee 4 Back Ground Lowering the Electric Field by having Dual-Gate Structure Lowering the Impact Ionization at the Channel/Drain Junction Lowering the Generated Holes flowed to Source/Channel Junction Defense Floating N+ region recombines with the Holes PBT action Parasitic Bipolar Transistor Defense the lowering the Electrostatic Potential Barrier at the Source/Channel Junction by the Holes Proposed TFT structure achieved the reduction of the Kink-Effect so that stable Drain Current in the Saturation Region Semiconductor & CAD Lab. Dae Yeon Lee 5 Proposal The Dual-Gate TFT with Floating N+ channel - Off-Set Region Electrons inject at the Forward Bias 3um Mo Lowering the Electric Field Middle N+ region length < 1.51 um Gate 400nm Mo Gate 700nm 100nm Source N+ P 1um oxide N+ 1.65um P N+ 1.65um P 0.7um 2um N+ 2um Drain P 1um 400nm N+ 110nm 16um Total channel length=10um Semiconductor & CAD Lab. Dae Yeon Lee 6 Design Rules Semiconductor & CAD Lab. Dae Yeon Lee 7 Simulation & Results Electrostatic Potential Hole concentration Electric Field Drain Current – Drain Voltage Output Characteristics Output Conductance Semiconductor & CAD Lab. Dae Yeon Lee 8 Electrostatic Potential VG = 7 V, VD = 12 V Conventional Conventional Proposed Single-gate TFT Dual-gate TFT Dual-gate TFT Lowering potential barrier at the source causes the kink effect. Proposed TFT’s potential barrier enhanced the potential barrier 5 times than Single - gate TFT and enhanced 18 % that of conventional dual-gate TFT. Semiconductor & CAD Lab. Dae Yeon Lee 9 Electrostatic Potential (Zoom In) VG = 7 V, VD = 12 V Channel Source The channel region starts from 4.3 um point The Potential Barrier value for the each TFTs Value is 0.5 V, 2.3 V, 2.8 V at a 5 um point which starts floating n+ region Semiconductor & CAD Lab. Dae Yeon Lee 10 Hole Concentration VG = 7 V, VD = 12 V > 1017 Conventional Conventional Proposed Single-gate TFT Dual-gate TFT Dual-gate TFT High Electric field at Drain Junction causes Impact Ionization so that holes flow to the source junction through channel -> PBT action Floating N+ regions recombine with holes so that hole concentration at the source junction can be reduce. Semiconductor & CAD Lab. Dae Yeon Lee 11 Hole Concentration (Zoom In) Source VG = 7 V, VD = 12 V Channel The channel region starts from 4.3 um point The Hole concentration value for the each TFTs Value is 1017 /cm3, 101 /cm3, 10-1 /cm3 at a 5 um point which starts floating n+ region Semiconductor & CAD Lab. Dae Yeon Lee 12 Electric Field VG = 7 V, VD = 12 V Conventional Conventional Proposed Single-gate TFT Dual-gate TFT Dual-gate TFT High Electric field at Drain Junction causes kink effect. The usual approach to reduce this effect is to limit the impact ionization contribution decreasing the electric field at the drain junction. Semiconductor & CAD Lab. Dae Yeon Lee 13 Electric Field (Zoom In) VG = 7 V, VD = 12 V Channel Drain The channel region starts from 12.9 um point The electric field value of each TFT is approximately 105 V, 2.8×102 V, and 2.9×102 V. Semiconductor & CAD Lab. Dae Yeon Lee 14 Drain Current – Drain Voltage Output Characteristics 1.611 mA 0.870 mA 0.522 mA VG = 7 V, VD = 12 V The on-current of the proposed dual-gate TFT is 0.870 mA while that of the conventional dual-gate TFT is 0.522 mA This result shows a 67 % enhancement in on-current Semiconductor & CAD Lab. Dae Yeon Lee 15 Drain Current – Drain Voltage Output Characteristics Conventional Single-gate TFT Conventional Dual-gate TFT Proposed Dual-gate TFT VG=5 V VD=10V 0.824 mA 0.325 mA 0.508 mA VG=5 V VD=12V 1.078 mA 0.330 mA 0.522 mA VG=7 V VD=10V 1.257 mA 0.508 mA 0.862 mA VG=7 V VD=12V 1.611 mA 0.522 mA 0.870 mA W/L = 2 Semiconductor & CAD Lab. Dae Yeon Lee 16 Drain Current – Drain Voltage Output Characteristics The on-current of the proposed dual – gate TFT at different gate voltage Semiconductor & CAD Lab. Dae Yeon Lee 17 Output Conductance Characteristics VG = 7 V, VD = 12 V Kink starting point Reduction of the Output conductance means the reduction of the kink effect so that we can get a stable drain current in the saturation region. The output conductance of the conventional single-gate increases about 8.3 V. Semiconductor & CAD Lab. Dae Yeon Lee 18 Conclusion Lowering the High electric Field at the Drain junction by Dual – Gate TFT structure Improved Electrostatic Potential Reduction of the Hole concentration by the holes recombine with the Floating N+ region in the channel region On-Current is 0.870 mA in the saturation region while that of the conventional dual – gate TFT is 0.522 mA at VG = 7 , VD = 12 V A stable Output Conductance is accomplished by the reduction of the kink effect Semiconductor & CAD Lab. Dae Yeon Lee