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“Thin” Layer Transfer Process
Donor
SiGen’s technology
1
enables the transfer
Cleave
Plane
Formation
of thin layers onto
semiconductor or
other material substrates
1
Cleave Plane Formation.
2
Plasma Bond Step: using a
proprietary plasma-activation
bond process.
3
Cleave Step (rT-CCP™): using
a proprietary cleave process.
4
Surface Finishing Step: using
a proprietary gas-phase noncontact smoothing process.
.
Reclaim
Surface Finish
4
2
3
Cleave
Wafer
Bond
Plasma-Activation Tool
© 2008 Silicon Genesis Corporation. All rights reserved.
DB&C Tool
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