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Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 © Digital Integrated Circuits2nd Devices Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models for SPICE simulation Analysis of secondary and deep-submicron effects Future trends © Digital Integrated Circuits2nd Devices The Diode B A Al SiO2 p n Cross-section of pn-junction in an IC process A p Al A n B One-dimensional representation B diode symbol Mostly occurring as parasitic element in Digital ICs © Digital Integrated Circuits2nd Devices Depletion Region hole diffusion electron diffusion (a) Current flow. n p hole drift electron drift Charge Density x Distance + - Electrical Field (b) Charge density. x (c) Electric field. V Potential -W 1 © Digital Integrated Circuits2nd W2 x (d) Electrostatic potential. Devices Diode Current © Digital Integrated Circuits2nd Devices pn (W2) Forward Bias pn0 Lp np0 p-region -W1 0 W2 n-region x diffusion Typically avoided in Digital ICs © Digital Integrated Circuits2nd Devices Reverse Bias pn0 np0 p-region -W1 0 W2 x n-region diffusion The Dominant Operation Mode © Digital Integrated Circuits2nd Devices Models for Manual Analysis + ID = IS(eV D/T – 1) VD ID + + VD – (a) Ideal diode model © Digital Integrated Circuits2nd – VDon – (b) First-order diode model Devices Junction Capacitance © Digital Integrated Circuits2nd Devices Diffusion Capacitance © Digital Integrated Circuits2nd Devices Secondary Effects ID (A) 0.1 0 –0.1 –25.0 –15.0 –5.0 0 5.0 VD (V) Avalanche Breakdown © Digital Integrated Circuits2nd Devices Diode Model RS + VD ID CD - © Digital Integrated Circuits2nd Devices SPICE Parameters © Digital Integrated Circuits2nd Devices What is a Transistor? A Switch! An MOS Transistor VGS V T |VGS| Ron S © Digital Integrated Circuits2nd D Devices The MOS Transistor Polysilicon © Digital Integrated Circuits2nd Aluminum Devices MOS Transistors Types and Symbols D D G G S S NMOS Enhancement NMOS Depletion D G G S PMOS Enhancement © Digital Integrated Circuits2nd D B S NMOS with Bulk Contact Devices Threshold Voltage: Concept + S VGS - D G n+ n+ Depletion Region n-channel p-substrate B © Digital Integrated Circuits2nd Devices The Threshold Voltage © Digital Integrated Circuits2nd Devices The Body Effect 0.9 0.85 0.8 0.75 VT (V) 0.7 0.65 0.6 0.55 0.5 0.45 0.4 -2.5 -2 -1.5 -1 V BS © Digital Integrated Circuits2nd -0.5 0 (V) Devices Current-Voltage Relations A good ol’ transistor 6 x 10 -4 VGS= 2.5 V 5 Resistive Saturation 4 ID (A) VGS= 2.0 V 3 VDS = VGS - VT 2 VGS= 1.5 V 1 0 Quadratic Relationship VGS= 1.0 V 0 0.5 1 1.5 2 2.5 VDS (V) © Digital Integrated Circuits2nd Devices Transistor in Linear VGS VDS S G n+ – V(x) ID D n+ + L x p-substrate B MOS transistor and its bias conditions © Digital Integrated Circuits2nd Devices Transistor in Saturation VGS VDS > VGS - VT G D S n+ - VGS - VT + n+ Pinch-off © Digital Integrated Circuits2nd Devices Current-Voltage Relations Long-Channel Device © Digital Integrated Circuits2nd Devices A model for manual analysis © Digital Integrated Circuits2nd Devices Current-Voltage Relations The Deep-Submicron Era 2.5 x 10 -4 VGS= 2.5 V Early Saturation 2 VGS= 2.0 V ID (A) 1.5 VGS= 1.5 V 1 0.5 0 Linear Relationship VGS= 1.0 V 0 0.5 1 1.5 2 2.5 VDS (V) © Digital Integrated Circuits2nd Devices u n (m/s) Velocity Saturation usat = 105 Constant velocity Constant mobility (slope = µ) c = 1.5 © Digital Integrated Circuits2nd (V/µm) Devices Perspective ID Long-channel device VGS = VDD Short-channel device V DSAT © Digital Integrated Circuits2nd VGS - V T VDS Devices ID versus VGS -4 6 x 10 -4 x 10 2.5 5 2 4 linear quadratic ID (A) ID (A) 1.5 3 1 2 0.5 1 0 0 quadratic 0.5 1 1.5 VGS(V) Long Channel © Digital Integrated Circuits2nd 2 2.5 0 0 0.5 1 1.5 2 2.5 VGS(V) Short Channel Devices ID versus VDS -4 6 -4 x 10 VGS= 2.5 V x 10 2.5 VGS= 2.5 V 5 2 Resistive Saturation ID (A) VGS= 2.0 V 3 VDS = VGS - VT 2 1 VGS= 1.5 V 0.5 VGS= 1.0 V VGS= 1.5 V 1 0 0 VGS= 2.0 V 1.5 ID (A) 4 VGS= 1.0 V 0.5 1 1.5 VDS(V) Long Channel © Digital Integrated Circuits2nd 2 2.5 0 0 0.5 1 1.5 2 VDS(V) Short Channel Devices 2.5 A unified model for manual analysis G S D B © Digital Integrated Circuits2nd Devices Simple Model versus SPICE 2.5 x 10 -4 VDS=VDSAT 2 Velocity Saturated ID (A) 1.5 Linear 1 VDSAT=VGT 0.5 VDS=VGT 0 0 0.5 Saturated 1 1.5 2 2.5 VDS (V) © Digital Integrated Circuits2nd Devices A PMOS Transistor -4 0 x 10 VGS = -1.0V -0.2 VGS = -1.5V ID (A) -0.4 -0.6 -0.8 -1 -2.5 VGS = -2.0V Assume all variables negative! VGS = -2.5V -2 -1.5 -1 -0.5 0 VDS (V) © Digital Integrated Circuits2nd Devices Transistor Model for Manual Analysis © Digital Integrated Circuits2nd Devices The Transistor as a Switch VGS V T Ron S ID V GS = VD D D Rmid R0 V DS VDD/2 © Digital Integrated Circuits2nd VDD Devices The Transistor as a Switch 7 x 10 5 6 Req (Ohm) 5 4 3 2 1 0 0.5 1 1.5 V DD © Digital Integrated Circuits2nd 2 2.5 (V) Devices The Transistor as a Switch © Digital Integrated Circuits2nd Devices MOS Capacitances Dynamic Behavior © Digital Integrated Circuits2nd Devices Dynamic Behavior of MOS Transistor G CGS CGD D S CGB CSB CDB B © Digital Integrated Circuits2nd Devices The Gate Capacitance Polysilicon gate Source Drain xd n+ xd Ld W n+ Gate-bulk overlap Top view Gate oxide tox n+ L n+ Cross section © Digital Integrated Circuits2nd Devices Gate Capacitance G G CGC CGC D S G Cut-off CGC D S Resistive D S Saturation Most important regions in digital design: saturation and cut-off © Digital Integrated Circuits2nd Devices Gate Capacitance CG C WLC ox WLC ox CGC B C G CS = CG CD 2 VG S Capacitance as a function of VGS (with VDS = 0) © Digital Integrated Circuits2nd WLC ox CG C 2WLC ox CG CS WLC ox 2 3 CGCD 0 VDS /(VG S-VT) 1 Capacitance as a function of the degree of saturation Devices Measuring the Gate Cap 3 102 16 10 I 9 Gate Capacitance (F) V GS 8 7 6 5 4 3 2 2 2 2 1.5 2 1 2 0.5 0 0.5 1 V GS (V) © Digital Integrated Circuits2nd 1.5 2 Devices Diffusion Capacitance Channel-stop implant N A1 Side wall Source ND W Bottom xj Side wall LS © Digital Integrated Circuits2nd Channel Substrate N A Devices Junction Capacitance © Digital Integrated Circuits2nd Devices Linearizing the Junction Capacitance Replace non-linear capacitance by large-signal equivalent linear capacitance which displaces equal charge over voltage swing of interest © Digital Integrated Circuits2nd Devices Capacitances in 0.25 mm CMOS process © Digital Integrated Circuits2nd Devices The Sub-Micron MOS Transistor Threshold Variations Subthreshold Conduction Parasitic Resistances © Digital Integrated Circuits2nd Devices Threshold Variations VT VT Long-channel threshold L Threshold as a function of the length (for low VDS ) © Digital Integrated Circuits2nd Low VDS threshold VDS Drain-induced barrier lowering (for low L) Devices Sub-Threshold Conduction The Slope Factor -2 10 Linear -4 I D ~ I 0e 10 -6 Quadratic , n 1 CD Cox S is DVGS for ID2/ID1 =10 ID (A) 10 qVGS nkT -8 10 -10 Exponential -12 VT 10 10 0 0.5 1 1.5 2 2.5 Typical values for S: 60 .. 100 mV/decade VGS (V) © Digital Integrated Circuits2nd Devices Sub-Threshold ID vs VGS I D I 0e qVGS nkT qV DS 1 e kT VDS from 0 to 0.5V © Digital Integrated Circuits2nd Devices Sub-Threshold ID vs VDS I D I 0e qVGS nkT qV DS 1 e kT 1 VDS VGS from 0 to 0.3V © Digital Integrated Circuits2nd Devices Summary of MOSFET Operating Regions Strong Inversion VGS > VT Linear (Resistive) VDS < VDSAT Saturated (Constant Current) VDS VDSAT Weak Inversion (Sub-Threshold) VGS VT Exponential in VGS with linear VDS dependence © Digital Integrated Circuits2nd Devices Parasitic Resistances Polysilicon gate LD G Drain contact D S RS W VGS,eff RD Drain © Digital Integrated Circuits2nd Devices Latch-up © Digital Integrated Circuits2nd Devices Future Perspectives 25 nm FINFET MOS transistor © Digital Integrated Circuits2nd Devices