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Chapter 3
VLSI Design
The Devices
March 28, 2003
© Digital Integrated Circuits2nd
Devices
Goal of this chapter

Present intuitive understanding of device
operation

Introduction of basic device equations

Introduction of models for manual analysis

Introduction of models for SPICE simulation

Analysis of secondary and deep-sub-micron
effects

Future trends
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Devices
The Diode
B
A
Al
SiO2
p
n
Cross-section of pn-junction in an IC process
A
p
Al
A
n
B
One-dimensional
representation
B
diode symbol
Mostly occurring as parasitic element in Digital ICs
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Devices
Depletion Region
hole diffusion
electron diffusion
(a) Current flow.
n
p
hole drift
electron drift
Charge
Density

x
Distance
+
-
Electrical
Field
(b) Charge density.

x
(c) Electric field.
V
Potential
-W 1
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
W2
x
(d) Electrostatic
potential.
Devices
Diode Current
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Devices
Models for Manual Analysis
+
ID = IS(eV D/T – 1)
VD
ID
+
+
VD
–
(a) Ideal diode model
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–
VDon
–
(b) First-order diode model
Devices
Junction Capacitance
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Devices
Secondary Effects
ID (A)
0.1
0
–0.1
–25.0
–15.0
–5.0
0
5.0
VD (V)
Avalanche Breakdown
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Devices
Diode Model
RS
+
VD
ID
CD
-
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Devices
SPICE MODELS
• SPICE: Simulation Program with Integrated Circuit
Emphasis, by UCB in early 1970’s.
• Level 1: Long Channel Equations - Very Simple
• Level 2: Physical Model - Includes Velocity Saturation
and Threshold Variations
• Level 3: Semi-empirical - Based on curve fitting to
measured devices
• Level 4 (Berkeley Short-Channel IGFET Model,
BSIM3v3): Empirical - Simple and Very Popular,.
• Full-fledged BSIM3v3 model (denoted as LEVEL 49)
covers over 200 parameters.
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Devices
SPICE Parameters
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Devices
What is a Transistor?
A Switch!
An MOS Transistor
VGS  V T
|VGS|
Ron
S
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D
Devices
The MOS Transistor
Polysilicon
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Aluminum/Cu
Devices
MOS Transistors Types and Symbols
D
D
G
G
S
S
NMOS Enhancement NMOS Depletion
D
G
G
S
PMOS Enhancement
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D
B
S
NMOS with
Bulk Contact
Devices
Threshold Voltage: Concept
+
S
VGS
-
D
G
n+
n+
Depletion
Region
n-channel
p-substrate
B
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Devices
The Threshold Voltage
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The Body Effect
0.9
0.85
0.8
0.75
VT (V)
0.7
0.65
0.6
0.55
0.5
0.45
0.4
-2.5
-2
-1.5
-1
V
BS
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-0.5
0
(V)
Devices
Current-Voltage Relations
6
x 10
-4
VGS= 2.5 V
5
Resistive
Saturation
4
ID (A)
VGS= 2.0 V
3
VDS = VGS - VT
2
VGS= 1.5 V
1
0
Quadratic
Relationship
VGS= 1.0 V
0
0.5
1
1.5
2
2.5
VDS (V)
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Devices
Transistor in Linear
VGS
VDS
S
G
n+
–
V(x)
ID
D
n+
+
L
x
p-substrate
B
MOS transistor and its bias conditions
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Devices
Transistor in Saturation
VGS
VDS > VGS - VT
G
D
S
n+
-
VGS - VT
+
n+
Pinch-off
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Devices
Current-Voltage Relations
Long-Channel Device
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Devices
A model for manual analysis
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Devices
Current-Voltage Relations
The Deep-Submicron Era
2.5
x 10
-4
VGS= 2.5 V
Early Saturation
2
VGS= 2.0 V
ID (A)
1.5
VGS= 1.5 V
1
0.5
0
Linear
Relationship
VGS= 1.0 V
0
0.5
1
1.5
2
2.5
VDS (V)
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Devices
u n (m/s)
Velocity Saturation
usat = 105
Constant velocity
Constant mobility (slope = µ)
c = 1.5
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 (V/µm)
Devices
Perspective
ID
Long-channel device
VGS = VDD
Short-channel device
V DSAT
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VGS - V T
VDS
Devices
ID versus VGS
-4
6
x 10
-4
x 10
2.5
5
2
4
linear
quadratic
ID (A)
ID (A)
1.5
3
1
2
0.5
1
0
0
quadratic
0.5
1
1.5
VGS(V)
Long Channel
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2
2.5
0
0
0.5
1
1.5
2
2.5
VGS(V)
Short Channel
Devices
ID versus VDS
-4
6
-4
x 10
VGS= 2.5 V
x 10
2.5
VGS= 2.5 V
5
2
Resistive Saturation
ID (A)
VGS= 2.0 V
3
VDS = VGS - VT
2
1
VGS= 1.5 V
0.5
VGS= 1.0 V
VGS= 1.5 V
1
0
0
VGS= 2.0 V
1.5
ID (A)
4
VGS= 1.0 V
0.5
1
1.5
VDS(V)
Long Channel
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2
2.5
0
0
0.5
1
1.5
2
VDS(V)
Short Channel
Devices
2.5
A unified model
for manual analysis
G
S
D
B
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Devices
Simple Model versus SPICE
2.5
x 10
-4
VDS=VDSAT
2
Velocity
Saturated
ID (A)
1.5
Linear
1
VDSAT=VGT
0.5
VDS=VGT
0
0
0.5
Saturated
1
1.5
2
2.5
VDS (V)
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Devices
A PMOS Transistor
-4
0
x 10
VGS = -1.0V
-0.2
VGS = -1.5V
ID (A)
-0.4
-0.6
-0.8
-1
-2.5
VGS = -2.0V
Assume all variables
negative!
VGS = -2.5V
-2
-1.5
-1
-0.5
0
VDS (V)
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Devices
Transistor Model
for Manual Analysis
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Devices
The Transistor as a Switch
VGS  V T
Ron
S
D
ID
V GS = VD D
Rmid
R0
V DS
VDD/2
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VDD
Devices
The Transistor as a Switch
7
x 10
5
6
Req (Ohm)
5
4
3
2
1
0
0.5
1
1.5
V
DD
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2
2.5
(V)
Devices
The Transistor as a Switch
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MOS Capacitances
Dynamic Behavior
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Dynamic Behavior of MOS Transistor
G
CGS
CGD
D
S
CGB
CSB
CDB
B
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The Gate Capacitance
Polysilicon gate
Source
Drain
xd
n+
xd
Ld
W
n+
Gate-bulk
overlap
Top view
Gate oxide
tox
n+
L
n+
Cross section
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Devices
Gate Capacitance
Cutoff
Triode
G
Saturation
G
CGC
CGC
D
S
G
Cut-off
CGC
D
S
Resistive
D
S
Saturation
Most important regions in digital design: saturation and cut-off
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Gate Capacitance
CG C
WLC ox
WLC ox
CGC B
C G CS = CG CD
2
VG S
Capacitance as a function of VGS
(with VDS = 0)
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WLC ox
CG C
2WLC ox
CG CS
WLC ox
2
3
CGCD
0
VDS /(VG S-VT)
1
Capacitance as a function of the
degree of saturation
Devices
Measuring the Gate Cap
3 102 16
10
I
9
Gate Capacitance (F)
V GS
8
7
6
5
4
3
2
2 2 2 1.5 2 1 2 0.5 0 0.5 1
V GS (V)
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1.5 2
Devices
Diffusion Capacitance
Channel-stop implant
N A1
Side wall
Source
ND
W
Bottom
xj
Side wall
LS
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Channel
Substrate N A
Devices
Capacitances in 0.25 mm CMOS
process
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The Sub-Micron MOS Transistor
 Threshold
Variations
 Subthreshold Conduction
 Parasitic Resistances
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Threshold Variations
VT
VT
Long-channel threshold
L
Threshold as a function of
the length (for low VDS )
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Low VDS threshold
VDS
Drain-induced barrier lowering
(for low L)
Devices
Sub-Threshold Conduction
The Slope Factor
-2
10
Linear
-4
I D ~ I 0e
10
-6
Quadratic
, n  1
CD
Cox
S is DVGS for ID2/ID1 =10
ID (A)
10
qVGS
nkT
-8
10
-10
Exponential
-12
VT
10
10
0
0.5
1
1.5
2
2.5
Typical values for S:
60 .. 100 mV/decade
VGS (V)
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Sub-Threshold ID vs VGS
I D  I 0e
qVGS
nkT
qV
 DS

1  e kT






VDS from 0 to 1.0V
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Sub-Threshold ID vs VDS
I D  I 0e
qVGS
nkT
qV
 DS

1  e kT



1    VDS 


VGS from 0 to 0.3V
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Summary of MOSFET Operating
Regions
Strong Inversion VGS > VT
 Linear (Resistive)
VDS < VDSAT
 Saturated (Constant Current)
VDS  VDSAT
 Weak Inversion (Sub-Threshold) VGS  VT
 Exponential in VGS with linear VDS dependence

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Parasitic Resistances
Polysilicon gate
LD
G
Drain
contact
D
S
RS
W
VGS,eff
RD
Drain
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Latch-up (Effect of Parasitic Resistance)
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SPICE Transistors Parameters
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MAIN MOS SPICE PARAMETERS
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SPICE Parameters for Parasitics
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SPICE Model for NMOS and PMOS
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SPICE Deck for a CMOS Inverter
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SPICE Simulation Result
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Future Perspectives
25 nm FINFET MOS transistor
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Summary

Transistor Modeling is important for CMOS circuit
design (updated by IC manufacturing companies
based on ongoing technologies).

SPICE parameters provide a good link between
manufacturer and designers.

SPICE model/parameters need to be updated to
reflect the behavior of the MOS in deep sub-micron
technology.

Recently, capacitor/inductor modeling become
important for Radio-frequency (RF) designs.
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