Download GTLP in Live Insertion Applications

Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
GTLP in Live Insertion
Applications
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
Ernest Cox - Texas Instruments
Jose M. Soltero - Texas Instruments
Timothy R. Minnick - Tyco Electronics
Protection
Levels
• Electrical Protection Levels
GTLP
Technology
• GTLP Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
• Nanosecond Discontinuity Impact
– Simulation vs. Measurement
– Live Insertion Systems
• Related Technologies
• Conclusion
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
• Level 0 Isolation –
– No protection circuitry
– Power down all components
• Level 1 Isolation – Partial Power Down
– IOFF circuitry
– Enables for system power to remain
• Level 2 Isolation – Hot Insertion
– IOFF and PU3S circuitry
– Prevents driver conflict (no bus contention)
• Level 3 Isolation – Live Insertion
– IOFF, PU3S and pre-charge circuitry
– No data corruption during insertion/removal
OFF
VCC
Protection
Levels
GTLP
Technology
VCC
Upper
P-channel
Nanosecond
Discontinuity
VCC
Blocking
Diode
Parasitic
Diode
Blocking
Diode
Parasitic
Diode
Parasitic
Diode
Parasitic
Diode
Out
Simulation
vs Measure
Hot-Plug
Systems
VCC
Parasitic
Diode
Lower
N-channel
Parasitic
Diode
In
Related
Technologies
Conclusion
Typical CMOS
Output with IOFF
Typical CMOS
Input with Bus-hold
and IOFF
Protection
Levels
C
GTLP
Technology
Pre-charge
Circuitry
Nanosecond
Discontinuity
Bias VCC
Output
Input
Simulation
vs Measure
Hot-Plug
Systems
Output
N-channel
PU3S
Related
Technologies
Conclusion
Typical GTLP Output and Input Structures
VREF
Protection
Levels
Voltage
GTLP
Technology
Power Supply
VCC
High Output
Impedance
Nanosecond
Discontinuity
Simulation
vs Measure
Test for
IOZPU
Test for
IOZPD
Active
Region
High Output
Impedance
VTT = 1.5 V
GTLP Output
Hot-Plug
Systems
VOL
Time
0V
VTT
Related
Technologies
Pre-charge
Circuitry
RTT
I/O
Conclusion
GTLP
Input
Protection
Levels
High Logic Level on Bus
GTLP
Technology
Nanosecond
Discontinuity
High Logic Level on Bus
Low Logic Level on Bus
Low Logic Level on Bus
Volts
Volts
VHIGH
VHIGH
VTHRESHOLD
VTHRESHOLD
Simulation
vs Measure
VLOW
VLOW
0V
Hot-Plug
Systems
Time
Point of Live Insertion
During High on Bus
Point of Live Insertion
During Low on Bus
0V
Time
Point of Live Insertion
During High on Bus
Point of Live Insertion
During Low on Bus
Related
Technologies
Conclusion
Possible Data Corruption Scenarios w/ and
w/o Pre-charge Circuitry
Protection
Levels
No Pre-charge
circuitry
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Pre-charge circuitry
Related
Technologies
Pre-charge level
Conclusion
Protection
Levels
BIAS
BIAS Vcc
Vcc Precharge
Precharge Circuit
Circuit
VCC
GTLP
Technology
Nanosecond
Discontinuity
BIAS VCC
GTLP
Simulation
vs Measure
Hot-Plug
Systems
Precharge
Circuit
I/O
VCC
Output
Stage
GND
Related
Technologies
Socket
Conclusion
Socket
Pin
vcc
GND
I/O BIAS VCC
• BIAS VCC charges
I/O capacitance
prior to making
contact with I/O
pins
Nanosecond Discontinuity Impact
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
• Nanosecond Discontinuity Development
– rapid electrical connections/disconnections
– bussed, live insertion systems
– highly conductive interface (i.e. connector)
– microscopic material irregularities at low
normal force point of contact
– inconsistent/erratic existence
• Simulations identify worst-case transients
Conclusion
• Difficult with physical test equipment
Daughtercards
Protection
Levels
GTLP
Technology
1.0"
1.0"
1.0"
1.0"
1.0"
1.5 V
1.5 V
Nanosecond
Discontinuity
Backplane
33 Ohm
Simulation
vs Measure
Slot 2
0.75"
Hot-Plug
Systems
Related
Technologies
Conclusion
Slot 1
•
•
•
33 Ohm
0.94"
0.94"
0.94"
Slot 3
Rear Termination Cards
ATM Applications
Bus-Type Architecture
Hot-Swap Capability
Slot 19
0.75"
Slot 20
Protection
Levels
2.0
slot 1 driver
slot 2 receiver
slot 20 receiver
GTLP
Technology
1.6
Nanosecond
Discontinuity
1.2
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
0.8
0.4
Conclusion
0.0
70
90
110
130
150
Time (ns)
170
190
210
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Latch
Clock and
Master
Data ports
Data
group
ports
Hot-Plug
Systems
Related
Technologies
Conclusion
GTLP
devices
Fully-Loaded System Measurement
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
Lightly-Loaded Hot-Swap System
Hot-Swap Card
Protection
Levels
Driver
Receiver
GTLP
Technology
Daughtercards
1.0"
1.0"
Nanosecond
Discontinuity
1.0"
1.5 V
1.5 V
33 Ohm
0.94"
0.94"
0.94"
Simulation
vs Measure
Slot 2
Slot 3
Slot 15
0.94"
0.94"
Slot 16
Slot 17
Slot 18
0.75"
Slot 1
Related
Technologies
Rear Termination Card
Conclusion
•
•
•
Slot 19
Backplane
0.75"
Hot-Plug
Systems
33 Ohm
0.94"
0.94"
Slot 20
Rear Termination Card
Worst-case System Impact
Increased Energy Transients
Additional SI Requirements
Lightly-Loaded System Simulation
Protection
Levels
2.0
slot 1 driver
slot 2 receiver
GTLP
Technology
slot 20 receiver
1.6
Nanosecond
Discontinuity
1.2
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
0.8
0.4
Conclusion
0.0
70
90
110
130
150
Time (ns)
170
190
210
Lightly-Loaded System Measurement
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Systems
Related
Technologies
Conclusion
Data
Transition
Bus
Driver
Receiver
Card
Hot-Swap
Card
Nanosecond
Discontinuity
Event
(pre-charge re-establishing)
Pre-Charge
Established
1st Connection
1st Break
2nd Connection
High-to-Low Discontinuity Simulation
Protection
Levels
GTLP
Technology
3.5
3.0
slot 1 driver
slot 15 receiver
receiver begins
to transition
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Systems
slot 16 hot-plug card
slot 15 receiver output
2.5
2.0
re-engagement of
hot-swap card
1.5
bus signal in
threshold region
1.0
Related
Technologies
0.5
Conclusion
0.0
85
90
95
100
105
Time (ns)
110
115
120
125
High-to-Low Simulation w/Resistance
Protection
Levels
3.5
GTLP
Technology
3.0
Nanosecond
Discontinuity
2.5
slot 1 driver
slot 15 receiver
slot 16 hot-plug card
slot 15 receiver output
2.0
re-engagement of
hot-swap card
Simulation
vs Measure
1.5
acceptable low
level voltage
Hot-Plug
Systems
Systems
1.0
Related
Technologies
Conclusion
gradual energy transient
onto backplane
0.5
0.0
85
90
95
100
105
Time (ns)
110
115
120
125
Quiet MateTM Connector Influence
Protection
Levels
GTLP
Technology
Data
Transition
Bus
Driver
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Systems
Related
Technologies
Conclusion
Receiver
Card
& Quiet Mate Contacts
Hot-Swap
Card
Nanosecond
Discontinuity
Event
(pre-charge re-establishing)
Pre-Charge
Established
Hot-Swap Card &
Quiet Mate Contacts
1st Connection
1st Break
2nd Connection
Protection
Levels
Unmated Receptacle and Pin
A
E
Resistive Coating
GTLP
Technology
Nanosecond
Discontinuity
B C D
Receptacle
Pin
Simulation
vs Measure
Hot-Plug
Systems
Systems
Sufficient Normal Force Engagement Position
A
B C D
E
Related
Technologies
Conclusion
Receptacle
Pin
TM
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Systems
Related
Technologies
Conclusion
Low-to-High Discontinuity Simulation
Protection
Levels
3.5
GTLP
Technology
3.0
receiver falsely switches to
opposite logic level!!!
slot 1 driver
Nanosecond
Discontinuity
2.5
slot 15 receiver
slot 16 hot-plug card
slot 15 receiver output
2.0
Simulation
vs Measure
1.5
Hot-Plug
Systems
Systems
1.0
bus signal 100 mV
below threshold level
Related
Technologies
0.5
re-engagement of
hot-swap card
Conclusion
0.0
130
135
140
145
150
Time (ns)
155
160
165
170
Low-to-High Simulation w/Resistance
Protection
Levels
3.5
slot 1 driver
GTLP
Technology
Nanosecond
Discontinuity
slot 15 receiver
3.0
slot 16 hot-plug card
slot 15 receiver output
2.5
acceptable high
level voltage
2.0
Simulation
vs Measure
1.5
Hot-Plug
Systems
Systems
1.0
gradual energy transient
onto backplane
Related
Technologies
0.5
re-engagement of
hot-swap card
Conclusion
0.0
130
135
140
145
150
Time (ns)
155
160
165
170
Nanosecond Discontinuity Measurement
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Systems
Related
Technologies
Conclusion
approaches threshold /
noise margin reduction
1.185 V
disengagement point
re-engagement
of hot-swap card
Protection
Levels
Daughtercards
GTLP
Technology
1.0"
1.0"
1.0"
1.0"
1.0"
3.3 V
3.3 V
Nanosecond
Discontinuity
Backplane
86 Ohm
Slot 2
Simulation
vs Measure
0.75"
Slot 1
86 Ohm
0.94"
0.94"
0.94"
Slot 3
Rear Termination Cards
Slot 19
0.75"
Slot 20
120 Ohm
120 Ohm
Hot-Plug
Systems
= 2mm HM connector
GND
GND
Related
Technologies
Conclusion
• Thevenin termination
• Typically used for totem-pole outputs
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
ABT, LVT, and VME
(soon to be released)
product simulations
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
Fully loaded and
Partially loaded
systems
Protection
Levels
No Pre-charge
GTLP
Technology
No noise margin
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Pre-charge
Related
Technologies
Pre-charge level
Conclusion
Increased noise margin
Denotes upper input threshold for
product family
Protection
Levels
No Pre-charge
GTLP
Technology
Noise margin
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Pre-charge
Related
Technologies
Pre-charge level
Conclusion
Increased noise margin
Denotes upper input threshold for
product family
Protection
Levels
No Pre-charge
GTLP
Technology
Negative noise margin
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Pre-charge
Related
Technologies
Pre-charge level
Increased noise margin
Conclusion
Denotes upper input threshold for
product family
Protection
Levels
No Pre-charge
GTLP
Technology
Noise margin
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Pre-charge
Pre-charge level
Increased noise margin
Conclusion
Denotes upper input threshold for
product family
Protection
Levels
Input
Threshold
Type
Normal
Dynamic
VOH(min)
Dynamic
VOH(min) due to
Live Insertion
Upper
Noise
Margin
Reduction
Upper
Noise
Margin
ABT no pre-charge
pre-charge *
LVTTL
(0.8 V to 2 V)
2.38 V
2.39 V
2.0 V
2.16 V
380 mV
230 mV
0V
160 mV
ABTE no pre-charge
pre-charge
ETL
(1.5 V ±50 mV)
2.35 V
2.32 V
2.05 V
2.24 V
300 mV
80 mV
550 mV
740 mV
LVTTL
(0.8 V to 2 V)
2.16 V
2.15 V
1.95 V
2.1 V
210 mV
50 mV
-50 mV
100 mV
Pseudo-ETL
(1/2 VCC ±50 mV)
2.5 V
2.5 V
2.22 V
2.4 V
280 mV
100 mV
520 mV
700 mV
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
Hot-Plug
Systems
Related
Technologies
Conclusion
LVT
no pre-charge
pre-charge *
VME no pre-charge
pre-charge
Protection
Levels
GTLP
Technology
Nanosecond
Discontinuity
Simulation
vs Measure
• GTLP Technology Supports Live Insertion
– Provides Isolation Levels 0 - 3
• Quiet MateTM Contacts Control the Energy
Transients of Nanosecond Discontinuities
Hot-Plug
Systems
Related
Technologies
Conclusion
• Similar Impacts to Related Systems and
Technologies
– VME, CompactPCI
– ABT, ABTE, LVT, VME (new)