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Paper TA-4-1 presented in IEEE Nanotechnology Materials and Devices Conference (IEEE NMDC 2013), October 7-9, 2013, National Cheng Kung University, Tainan, Taiwan. Silicon Quantum Dot Devices for Future Electronics Shunri Oda, Tokyo Institute of Technology O-Okayama, Meguro-ku, Tokyo 152-8552, Japan, [email protected] ( invited talk ) Quantum dot structures, where electrons are confined Electron transport in coupled Si quantum dots prepared by three-dimensionally in sub-10 nm scale, show characteristics EB lithography is also investigated in detail. We observed quite different from conventional bulk structures. Recent characteristic transport of triple quantum dots [14] and progress in the fabrication technology of silicon nanostructures successfully controlled electrostatic coupling of electrons using has made possible observations of novel electrical and optical gate electrodes [15]. Precise control of charge states in the properties of silicon quantum dots, such as single electron multiple-coupled quantum dots is essential for spin based tunneling quantum information processing [16]. We also observed [1], ballistic transport [2,3], visible photo- luminescence [4] and high-efficiency electron emission [5]. spin-blockade in coupled Si dots [17]. Nanocrystalline silicon (nc-Si) particles with size less than [1] 10 nm were prepared by VHF plasma-enhanced decomposition [2] of silane gas. Pulsed gas plasma processing, in which the [3] nucleation and the growth period were controlled precisely, [4] was turned out to be effective for the preparation of monodispersed nanocrystalline silicon particles [6]. High [5] density integration and assembly of Si nanodots are [6] investigated using solution methods [7,8]. [7] MOS and NEMS hybrid devices are promising for logic, memory and sensing applications, since new functions with [8] [9] ultralow power consumption are expected. Further scaling of NEMS devices may provide novel functions based on unique [10] phonon dispersion characteristics in nm-scale. [11] We proposed novel memory devices based on Nano [12] Electro-Mechanical Systems [9,10]. Mechanical systems are fast in nano-scale and low-power consumption. An optimized [13] NEMS-gate which eliminate the problem of back ground [14] charges was designed and studied using accurate 3D calculation [11]. We also prepared Si nano-bridge transistors with [15] suspended channel structures [12] and observed unique [16] transport characteristics presumably due to phonons confined in [17] nano structures [13]. A. Dutta, S. Oda, Y. Fu and M. Willander, Jpn. J. Appl. Phys., 39, (2000) 4647. K. Nishiguchi and S. Oda, Appl. Phys. Lett., 76, (2000) 2922. K. Nishiguchi and S. Oda, J. Appl. Phys., 92, (2002) 1399. K. Arai, J. Omachi, K. Nishiguchi and S. Oda, Mat. Res. Soc. Symp. Proc., 664, (2001) A20.6. K. Nishiguchi, X. Zhao and S. Oda, J. Appl. Phys., 92, (2002) 2748. T. Ifuku, M. Otobe, A. Itoh and S. Oda, Jpn. J. Appl. Phys., 36 (1997) 4031. A. Tanaka, Y. Tsuchiya, K. Usami, H. Mizuta and S. Oda, Current Appl. Phys. 6 (2006) 344. A. Tanaka, Y. Tsuchiya, K. Usami, H. Mizuta and S. Oda, Jpn. J. Appl. Phys. 47 (2008) 3731. Y. Tsuchiya, K. Takai, N. Momo, S. Yamaguchi, T. Shimada, S. Koyama, K. Takashima, Y. Higo, H. Mizuta and S. Oda, J. Appl. Phys. 100 (2006). 094306 T. Nagami, Y. Tsuchiya, K. Uchida, H. Mizuta, and S. Oda., Jpn. J. Appl. Phys. (2010) 044304. B. Pruvost, K. Uchida, H. Mizuta, S. Oda, IEEE Trans. Nanotechnology, 8, (2009) 174. J. Ogi, Y. Tsuchiya, H. Mizuta, and S. Oda, Microelectronics Engineering, 85, (2008) 1410. J. Ogi, T. Ferrus, T. Kodera, Y. Tsuchiya, K. Uchida, D. A. Williams, S. Oda, and H. Mizuta, Jpn. J. Appl. Phys. 49 (2010) 045203. G. Yamahata, Y. Tsuchiya, H. Mizuta, K. Uchida, S. Oda, Solid-State Electronics, 53, (2009) 779. G. Yamahata, T. Kodera, H. Mizuta, K. Uchida, S. Oda, Applied Physics Express, 2, (2009) 095002. K. Horibe, T. Kodera, T. Kambara, K. Uchida, and S. Oda, J. Appl. Phys., 111, (2012) 093715. G. Yamahata, T. Kodera, H. O. H. Churchill, K. Uchida, C. M. Marcus, and S. Oda, Phys. Rev, B86, 115322.