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IL7500B PULSE POWER SUPPLY CONTROL CIRCUIT (functional analogue KA7500B f. «Fairchild Semiconductor») Microcircuit IL7500B pulse-width modulation (PWM) and is intended for application in pulse power sullies. . Index N Key characteristics: DIP-package • • • • • • • • microcircuit supply voltage from 7 to 40V; PWM control circuit; built- in controlled generator; build-in signal error amplifier; built-in reference voltage power supply; adjustable delay time; independent output transistors with current 200mA; output stage control circuit for operation in pushpull or single stage • surge protection; • operating temperature from minus 25 to plus 85 °C. 16 01 Index D SO package 16 16 01 01 Application: pulse voltage converters, voltage invertors, pulse stabilizers and power supplies IL7500BN – 16 – pin plastic DIP package MS-001BB IL7500BD – 16 – pin plastic SO package MS-012AC Figure 1 Microcircuit designation I1p 01 16 I2p I1n 02 15 I2n FB 03 14 REF DTC 04 13 C0 CX 05 12 UCC RX 06 11 C2 GND 07 10 E2 C1 08 09 E1 Figure 2– Designation of pins in package IL7500B_TS_E_v3 06.05.2013 1 IL7500B Table 1 – Description of microcircuit pins in package and chip contact pads Contact pad no. 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 - 20 Pin number Symbol 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 - I1p I1n FB DTC CX RX GND C1 E1 E2 C2 UCC ОС REF I 2n I2p - IL7500B_TS_E_v3 06.05.2013 Description Input1 non- inverted Input 1 inverted Comparator pin Delay time adjusting pin Setting capacitor connection pin Setting resistor connection pin Common “ground pin Output transistor 1 collector pin Output transistor1emitter pin Output transistor 2 emitter pin Output transistor 2 collector pin Voltage supply power pin Operation mode control input Reference voltage output Inverted Input 2 Non- inverted Input 2 Not in use 2 IL7500B А1, А2 – error amplifiers; А3 – control of delay time comparator; А4 – PWM comparator; А5 – А10 – logic elements; Т1 – D-trigger; VT1, VT2 – output transistors Figure 3 – Microcircuit block diagram Table 2 Absolute maximum ratings Symbol Parameter UСС Supply voltage Output collector voltage Output current Amplifier input voltage UOC IОС UI Norm Unit min – max 42 – 42 V – -0,3 250 UСС+0,3 mA V V Table 3 – Recommended operating ranges Symbol Parameter name UСС UOC IОС UI Supply voltage Input collector voltage Output current Amplifier input current IL7500B_TS_E_v3 06.05.2013 Norm min 7 – – 0,3 max 40 40 200 UСС-0,2 Unit V V mA V 3 IL7500B Table 4 – Microcircuit electrical parameters (atUСС = 20 V, if otherwise not specified) Symbol Parameter name UREF Output reference voltage by pin 14 Uregin Input adjustment αUREF Reference voltage perature ratio Uregout Input adjustment IOS tem- Short circuit current by pin 14 max IREF = 1 mA 4,75 5,25 UСС = 7÷40 V - 25 - - 0,03 IREF = 1÷10 mA - 15 UREF = 0 V 10 50 mA 6 14 kHz - 2 % - -10 µA 45 - % - 3,3 Maximum duty cycle 0 - Minimum duty cycle - 4,5 V СT = 0,01 uF αf FC generator frequency temperature ratio СT = 0,01 uF IDTC Offset input current by pin 04 UCC = 15 V 0 V< UDTC < 5,25 V Maximum duty factor UCC = 15 V UDTC = 0 V UCO = UREF Minimum duty cycle UITH041 UITH042 UITH03 Threshold voltage by pin 04 Threshold voltage by pin 03 RT = 12 kΩ RT = 12 kΩ UNit V mV 0÷70 RC generator frequency by pin 04 Ambient temperature °С 25±10 -25 85 min f D(MAX) Norm Measurement condition 25±10 -25 85 %/°C mV V ISINK Input current by pin 03 UFB = 0,7 V 0,3 - mA UIO Zero offset input voltage UFB = 2,5 V - 10 mV IIO Zero offset input voltage UFB = 2,5 V - 250 nA Offset input current UFB = 2,5 V - 1,0 µA IBIAS IL7500B_TS_E_v3 06.05.2013 4 IL7500B Table 4 ( cont.) Symbol UI GVO Parameter Input voltage min max 7 V< UCC < 40 V -0,3 UСС-2 70 - 300 1200 - 1,3 2,5 Gain factor without feed- 0,5 V< UFB < 3,5 V back f1 Single time amplification frequency - UCE(SAT) Junction saturation voltage of collector-emitter in circuit with common emitter UE = 0 V UCС(SAT) Norm Measurement condition IC = 200 mA Ambient temp. °С 25±10 -25 85 Unit V dB kHz V UС = 15 V V Junction saturation voltage of collector-emitter in emitter repeater circuit IЕ = -200 mA - IC(OFF) Collector current in ON state o UСC = 40 V UСE = 40 V - 100 IE(OFF) Emitter current state - -100 - 10 UСC = 20 V - 200 ns UСC = 7; 40 V - 260 ns UСC = 20 V - 200 ns UСC = 7; 40 V - 260 ns UСC = 20 V - 100 ns UСC = 7; 40 V - 130 ns UСC = 20V - 100 ns UСC = 7; 40 V - 130 ns ICC tRCE tRCE1 tREF tREF1 tFCE tFCE1 tFEF tFEF1 Consumption standby state in OFF UСC = UС = 40 V UE = 0 V current in Output voltage rise time in circuit with common emitter Output voltage rise time in emitter repeater circuit Output voltage fall time in circuit with common emitter Output voltage fall time in emitter repeater circuit IL7500B_TS_E_v3 06.05.2013 URX = 5 V UСC = 15 V µA µA mA 5 IL7500B VD1 – diode VT1 - transistor Figure 4 – Typical Application Diagram IL7500B_TS_E_v3 06.05.2013 6 IL7500B D 16 9 E1 8 1 b2 A E C A1 e α c b L 0,25 (0,010) M C Note - Dimension D, E1 does not include flash which should not exceed 0.25 mm (0,010) to side. D E1 A b min 18,93 6,07 0,36 max 19,43 7,11 5,33 0,56 min max 0,355 0,240 b2 e α Millimeters 1,14 0 2,54 1,78 15 Inches 0,014 0,045 0,400 0,280 0,210 0,022 0,070 0,1 L E c A1 2,93 7,62 0,20 0,38 3,81 8,26 0,36 0 0,115 0,300 0,008 0,015 15 0,150 0,325 0,014 Figure 5 –DIP-package MS-001BB dimensions IL7500B_TS_E_v3 06.05.2013 7 IL7500B Note - Dimensions D, E1 do not include flash which should not exceed 0.25 mm(0.010) to side. D E1 A b min 9,80 3,80 1,35 0,33 max 10,00 4,00 1,75 0,51 min max h e α Millimeters 0,25 0 1,27 0,50 8 Inches 0,386 0,150 0,053 0,013 0,010 0,050 0,394 0,157 0,069 0,020 0,020 L H c A1 0,40 5,80 0,19 0,10 1,27 6,20 0,25 0,25 0 0,016 0,228 0,007 0,004 8 0,050 0,244 0,010 0,010 Figure 6 – SO-package MS-012AC dimensions IL7500B_TS_E_v3 06.05.2013 8 IL7500B Technologikal marking Chip thickness 0,35 ± 0,02 mm. Technological marking on chip: IL7500B. Coordinates of technological marking, mm: left bottom corner х = 0,267, у = 0,408 Figure 7 – Contact pads layout diagram Table 5 – Coordinates and dimensions of contact pads. Contact pad number Coordinates (left bottom corner),mm 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 Х 0,109 0,109 0,265 0,452 0,639 0,804 1,209 1,194 1,194 1,194 1,194 0,891 0,709 0,522 0,109 0,109 0,0953 0,0953 0,0953 0,0953 У 0,298 0,169 0,108 0,108 0,108 0,108 0,121 0,275 0,480 0,623 0,828 0,964 0,964 0,964 0,964 0,830 0,721 0,626 0,531 0,436 Notes 1 Coordinates and size of contact pads are shown by layer “Passivation” 2 Dimension of contact pads 01-16 - 0,086 х 0,086 mm, dimension of contact pads 17-20 - 0,060 х 0,056 mm. Nominal Front Metal Composition, Thickness Nominal Back Metal Composition, Thickness IL7500B_TS_E_v3 06.05.2013 Al + 1 % Si 1,4 ± 0,1 m - 9