Download Optical Links

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project

Document related concepts
no text concepts found
Transcript
Experience with Parallel Optical Link
for the CDF Silicon Detector
S. Hou for the DOIM group
Academia Sinica, Taiwan
VERTEX 2002
Introduction
DOIM: Dense Optical Interface Module
Byte-wide parallel optical link
8-bits + clock
53 Mbyte/sec, BER10-12
Transmitter :
Laser-diode array
ASIC driver chip
Receiver :
PIN-diode array
ASIC receiver chip
Multi-mode fiber ribbon
Laser, Electrical characteristics
Bit-error rate test
Aging test
Radiation Hardness
Implementation in CDF
VERTEX 2002
Transmitter: Laser diode
InGaAs/InP Edge-emitting laser diode :
1550 nm wavelength
12-ch diode array (9 used)
250 m pitch
20 mA/channel
Cleaved mirrors
Facet coating
Bare laser power:
1 mW/ch @20mA
Insertion to fiber:
200 ~ 800 W/ch
Fabrication by
Chunghwa Telecom
Telecommunication Laboratories
VERTEX 2002
Transmitter: driver ASIC
Custom design, biCMOS 0.8 m,AMS
bipolar transistors only
Inputs :
Diff. ECL or LVDS signals compatible
differential 100 mV
Enable by TTL low
Nine channels :
Vcc-VLD across
output transistor, 50 , laser
control current consumption
At 3V, 20mA/ch nominal
~2mA/0.1V adjustable slope
VERTEX 2002
Transmitter assembly
Die-bond / Wire bond
laser-diode array on BeO submount
driver chip on substrate
fibers on V-groove
Alignment
fibers to laser emitting facets
VERTEX 2002
Receiver : PIN & ASIC
InGaAs/InP PIN diode :
12-ch array, matching laser diode wavelength
by TL, Chunghwa Telecom.
Operation condition :
50 ~ 800 W on, 10 W off
1.1 W/module
Outputs :
differential ECL, nine independent channels
VERTEX 2002
Receiver assembly
Die-bond / Wire bond
PIN-diode array on Al2O3 submount
driver chip on substrate
fibers on V-groove
Alignment, fibers to PIN-diodes
VERTEX 2002
Assembly procedure
VERTEX 2002
Transmitter characteristics
Transmitter tests :
L-I-V and temperature
50 MHz diff. Inputs, 2.5V common mode 100 mV, 50% +Dcyc
Laser light MT-12ST fanout & Tek O/E probe
VERTEX 2002
Laser diode: L-I-V
Laser light at 20, 30, 40oC
water-bath chiller precision ~0.1oC
measured at substrate
I-V
little temperature dependence
approximately linear
L-V
Drop with temperature
Duty cycle
diff. Input 50%
stable, little offset to 50%
VERTEX 2002
Laser diode: temperature
Light power vs. Temperature
Measured in stable
cooling/heating process
Temperature at substrate
precision ~0.1oC
Approximately linear drop
to temperature
VERTEX 2002
Receiver response
Receiver connected to a Transmitter
Light power chosen for
wide distribution
Light pulse width are consistent
Receiver ECL outputs
by a Tektronix diff. probe
Consistent duty cycles in favored
operation range (2.8~3.2V)
Saturates for high light level
VERTEX 2002
Transmitter uniformity : light outputs
Production transmitters
light from pigtail at 30oC
wide deviation channel-by-channel
mainly due to insertion efficiency
Span within ~400 W
 ~72 W to the mean/module
Effect operation dynamic range in
threshold, saturation limit
VERTEX 2002
Transmitter uniformity : light pulse widths
Ch-Ch Light power deviation
Is approximately a const. scaling factor
L-V linear fit, normalized slope to L(3V) indep. of light power
Light pulse width is uniform, ~1%, indep. of light power
VERTEX 2002
Receiver uniformity : ECL duty cycles
Two production batches
monitored at 550 W & 970 W
light pulse width 45%
ECL duty cycle is uniform
48.1% at 550 W, (2nd batch)
=0.7%
4% wider in 1st batch
due to chip tuning
Wide light input range
Saturation monitored at 970 W
VERTEX 2002
Receiver uniformity : duty cycle deviation
Input lights
~950 W, width 45%
for all channels
ECL outputs of a module
deviation to the mean
~1.5%
for both batches
VERTEX 2002
Bit-Error Rate test
BERT by Fermilab
PC ISA boards TTL to
Tbert, Rbert boards
At 63 MHz,
minimum BER 10 –12
Burn-in
3-days on ASICs, diodes
1-day BERT
 reject devices infant mortality
bad components fail quickly
VERTEX 2002
Accelerated Aging test
4 transmitters at 60oC, 330 days
Wear-out degradation
0.15 0.08 W/day at 60oC
no failure
Accelerating factor
F=exp(Ea/ kb) (1/T1 –1/T2)
F=29 for T= – 5oC
Failure due to light degradation
Min transmitter spec 200 W
down below receiver threshold 50 W
~100 days at 60oC, or 8 years at – 5oC
90% C.L. for 0 failure, P=0.064
upper limit = 40 ch. In 3 years
VERTEX 2002
INER 30 MeV proton Irradiation
CDF requirement : 200 kRad tolerance
INER test beam : transmitter in DC mode.
fiber connection out of beam area, measuring L, T versus dose.
VERTEX 2002
Bulk damage, annealing
Bulk damage dominant, linear dep. to dose
Ratio of light drop is consistent for a module, indep. of light power
Degradation 10% for 200 kRad
VERTEX 2002
UC Davis 63.3 MeV proton
UC Davis test beam : 10 transmitters on two Port Cards
Examined after 200, 400 kRad, for L I, V measurements
Light degradation ~10% for 200 kRad
Similar I-V, L-V characteristics after irradiation,
slope for L vs. V degrades similarly.
VERTEX 2002
DOIM implementation : transmitters
Transmitters on Port Cards
Total 570 transmitters
128 Port Cards,
5 transmitter each board
VERTEX 2002
DOIM implementation : receivers
Receivers on FTM
10 receivers on each board, reading 2 Port Cards
VERTEX 2002
Status
570 pairs implemented
~10 % bit-error flagged
excess light at -5oC
optical reflection, contact
electrical pin contact
2% has fatal damage
is improving
VERTEX 2002
Summary
DOIM, a byte-wide optical link is implemented in CDF
Edge-emitting laser light  linear to I-V and T
Laser-diode array coupling to pigtail fibers
large deviation  a major disadvantage
Radiation tolerance is high
bulk-damage dominant  linear degradation to dose
VERTEX 2002