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ESD Precautions for Handling Electronics R. Schnee (11/8/05) Based on document by T. Perera Procedures • All CMOS chips (e.g. ADC or memory) should be transported to your work station in insulating foam or ESD-safe plastic container. • Before removing chips from insulator, put on the wrist strap connected to the ESD mat. All work with CMOS chips should be done with the wrist strap on. As an added precaution before first touching a chip, you should touch a finger to a grounded metal surface such as the shell of one of the BNC connectors on your RALboard. • If using a DMM, its outside should be in contact with the ground of the ESD mat, and both leads shorted to this ground before use. General Principles • The main cause for electrostatic charge on materials is triboelectric generation, or the unequal sharing of surface charge when two materials brought together and separated. Charge can also build up due to external electric fields. • It is easy to generate voltages > 100V by the simple act of walking over a carpet. ESD occurs when the charged object is connected to ground or an object at a different potential. No visible spark will be evident unless the voltage is much larger, say 10000 V, but 100V ESD may destroy chips. • A device may experience ESD due to the human body or other object discharging onto it, the device being charged up and discharging to the human body or conductor, or due to varying external fields. For reference, the human body may be modeled as a 100 pF capacitor with the resistance of the contact between it and the device modeled as a 1.5 kOhm resistor. • The guidelines above are based on the fact that a chip and its future environment are usually at different potentials unless explicitly connected together. For this reason, the chip must be brought to the potential of its environment. This must be done slowly, to prevent large currents from causing device failure. • This slow discharge is accomplished through static dissipative materials. ESD mats and wrist straps are made of these materials that have higher resistance than conductors but lower resistance than insulators. The surface resistance of a static dissipative material is in the range 105 -1012 Ohms/square (resistivity: 104-1011 Ohm-cm). • The guidelines will also help maintain a device and its environment at the same potential. • A good website for further ESD information is: http://www.esda.org/aboutesd.html 2