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Microfluidic components 2017 [email protected] Contents • • • • • Channels Filters Mixers Pumps Valves • • • • Microreactors Surface microfluidics Droplet reactors PCR DNA chips flow control applications Basic geometries:straight channel -separation channel -mixer -microreactor -... Linear microreactor R.M. Tiggelaar et al. / Sensors and Actuators A 119 (2005) 196–205 Basic geometries: X,T,Y,H Applications: •CE injectors •mixers •filters •reactors Particle filtering: H-filter Catalytic microreactor Younes-Metzler et al: Applied Catalysis A: General 284 (2005) 5–10 Catalytic microreactor (2) Younes-Metzler et al: Applied Catalysis A: General 284 (2005) 5–10 Combine basic shapes to devices Injector + separation channel precolumn reaction + separation post-column reaction Meander-shapes Adv. Mater. 2012, DOI: 10.1002/adma.201203252 D. M. Ratner, E. R. Murphy, M. Jhunjhunwala, D. A. Snyder, K. F. Jensen and P. H. Seeberger, Chem. Commun., 2005, 578 Area needed: 6.3 mm * 6.3 mm Pumps • • • • • • • • bubble pumps membrane pumps diffuser pumps rotary pumps electrohydrodynamic electro-osmotic/electrophoretic ultrasonic pumps vacuum pumps Pumps: actuation mechanism Peristaltic pump = 3 valves in series Pumps without moving parts Surface tension driven pump Electro-osmotic pump Nozzle-diffuser pump, Olsson, Stemme 1997 Osmotic pump Thermal ink jet MEMS Handbook Passive • mechanical • geometric • hydrophobic Active valves pneumatic thermopneumatic phase-change electrostatic piezoelectri thermal expansion Membrane valve, pneumatic actuation N=20 matrix chip to perform 400 independent PCR reactions, with in total 2860 in-line microvalves that was controlled by only two independent pneumatic pressure supplies. Liu J, Hansen C, Quake SR. Solving the ‘World-to-Chip’ interface problem with a microfluidic matrix. Anal Chem 2003a;75:4718–23. Microvalves: Piezoelectric actuation, flap valve Thermal expansion actuation, torsion valve Geometric valves (a) (b) Pillar “forest” controls the rate of capillary flow. Rapid constriction of the flow channel will stop the flow. Side channel offers timing of flow. Transducers 2005, p. 1565 (c) Fluidic diode in PDMS Microreactors Small volume good if expensive and/or dangerous chemicals Fast reactions because small diffusion distances Large surface area (either positive or negative effect) Good temperature control and fast ramp rates Besser: J. Vac. Sci. Technol. B 21.2., Mar/Apr 2003 Good flow control because of laminar flow Simple linear microreactor Anodic bonding: silicon and glass Heater electrode Nitride membrane Catalyst underneath Flow channel Bonded to glass wafer Microreactor dimensions Shin & Besser, Cross-flow reactor in silicon Fusion bonding: silicon-tosilicon Electrowetting (EWOD) Hydrophobic coating Electrowetting: electrostatically induced reduction in the contact angle of an electrically conductive liquid droplet on an insulating hydrophobic surface. Droplet movement EWOD ≈ DMF ≈ Digital microfluidics EWOD materials ITO = In:SnO2 transparent conductor Parylene = CVD deposited polymer DMF microreactor PCR DNA copy machine PCR in SU-8 µPCR = rapid thermal ramping Continuos flow PCR Thermocycling PCR Angew. Chem. Int. Ed. 2007, 46, 1 – 5 Simple and complex devices • 1D devices – flow channels • 1.5D devices – flow channels with junctions • 2.x D devices – flat objects on surface (height << lateral dimension) • 2.5D objects – height lateral size; open top • 3D objects – closed spaces (access holes) Electronic vs. Fluidic • • • • • planar (2D) small (cm2) complex 109 elements 15-30 litho steps • 1-10 $/cm2 • few materials 3D anything (mm2 => 100 cm2) simple few elements 1-5 steps typical (13 highest so far) highly variable novel and exotic materials Integration; component level • many operations performed on a chip increased automation, easier handling smaller signals can be handled less waste different functions combined on chip Integration: fluidics • fabrication yield low (as with early transistors) • more difficult design (as with early ICs) • no more jobs for analytical chemists (this was predicted for electronics engineers in 1960 !)