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Semiconductor Device Physics Lecture 9 Dr.-Ing. Erwin Sitompul President University http://zitompul.wordpress.com President University Erwin Sitompul SDP 9/1 Chapter 9 Optoelectronic Diodes Photodiodes Reverse current due to carriers swept by the E-field Electron-hole pair generation due to light I I dark I L I L qA( LN W LP )GL President University Erwin Sitompul SDP 9/2 Chapter 9 Optoelectronic Diodes I–V Characteristics and Spectral Response Open circuit voltage voc Upper limit ~ highest wavelength ~ lowest frequency ~ lowest energy I L GL Short circuit current isc President University Erwin Sitompul SDP 9/3 Chapter 9 Optoelectronic Diodes p-i-n Photodiodes p-i-n : positive–intrinsic– negative W ≈ Wi-region most carriers are generated in the depletion faster response time (~10 GHz operation) President University Reverse biased • current arises mostly in the totally • • depleted i-region, not in quasineutral region as in pn diode generated carriers do not need to diffuse into the depletion region before they are swept by the E-field enhanced frequency response Erwin Sitompul SDP 9/4 Chapter 9 Optoelectronic Diodes Forward bias Increasing EG Light Emitting Diodes (LEDs) LEDs are typically made of compound semiconductors (direct semiconductors with band-to-band recombination) It releases energy by dissipating light / emitting photon President University Erwin Sitompul SDP 9/5 Chapter 10 BJT Fundamentals Bipolar Junction Transistors (BJTs) Over the past decades, the higher layout density and lowpower advantage of CMOS (Complementary Metal–Oxide– Semiconductor) has eroded away the BJT’s dominance in integrated-circuit products. Higher circuit density better system performance BJTs are still preferred in some digital-circuit and analog-circuit applications because of their high speed and superior gain Faster circuit speed (+) Larger power dissipation (–) • Transistor: current flowing between two terminals is controlled by a third terminal President University Erwin Sitompul SDP 9/6 Chapter 10 BJT Fundamentals Introduction There are two types of BJT: pnp and npn. VEB VE VB VCB VC VB VEC VE VC VEB VCB VBE VB VE VBC VB VC VCE VC VE VCB VEB The convention used in the textbook does not follow IEEE convention, where currents flowing into a terminal is defined as positive. We will follow the normal convention: . . . . . . President University Erwin Sitompul SDP 9/7 Chapter 10 BJT Fundamentals Circuit Configurations Common-Emitter I–V Characteristics Most popular configuration Active Mode Saturation Mode IC < IB President University IC dc IB 100 In active mode, dc is the common emitter dc current gain Erwin Sitompul SDP 9/8 Chapter 10 BJT Fundamentals Modes of Operation Common-Emitter Output Characteristics Mode E-B Junction C-B Junction Saturation forward bias forward bias Active/Forward forward bias reverse bias Inverted reverse bias forward bias Cutoff reverse bias reverse bias President University Erwin Sitompul SDP 9/9 Chapter 10 BJT Fundamentals BJT Electrostatics Under equilibrium and normal operating conditions, the BJT may be viewed electrostatically as two independent pn junctions. N AE N DB N AC WCB WEB W WB xnEB xnCB W : quasineutral base width President University Erwin Sitompul SDP 9/10 Chapter 10 BJT Fundamentals BJT Electrostatics Electrostatic potential, V(x) Electric field, E(x) Charge density, ρ(x) President University Erwin Sitompul SDP 9/11 Chapter 10 BJT Fundamentals BJT Design Important features of a good transistor: Injected minority carriers do not recombine in the neutral base region short base, W << Lp for pnp transistor Emitter current is comprised almost entirely of carriers injected into the base rather than carriers injected into the emitter the emitter must be doped heavier than the base pnp BJT, active mode President University Erwin Sitompul SDP 9/12 Chapter 10 BJT Fundamentals Base Current (Active Bias) The base current consists of majority carriers (electrons) supplied for: 1. Recombination of injected minority carriers in the base 2. Injection of carriers into the emitter 3. Reverse saturation current in collector junction 4. Recombination in the base-emitter depletion region EMITTER COLLECTOR BASE 1 iCB0 4 p-type President University 2 n-type Erwin Sitompul 3 p-type SDP 9/13 Chapter 10 BJT Fundamentals BJT Performance Parameters (pnp) IEn ICn Negligible compared to holes injected from emitter ICp IEp Emitter Efficiency I Ep I Ep IE I Ep I En Decrease 5 relative to Base Transport Factor T Decrease 1 and 2 to increase efficiency I Cp I Ep 1 relative to 2 to increase transport factor Common base dc current gain: President University Erwin Sitompul dc T SDP 9/14 Chapter 10 BJT Fundamentals Collector Current (Active Bias) The collector current is comprised of: Holes injected from emitter, which do not recombine in the base 2 Reverse saturation current of collector junction 3 I C αdc I E I CB0 ICB0 :collector current when IE = 0 I C αdc ( I C I B ) I CB0 I CB0 α dc I CB0 IC IB 1 α dc 1 α dc I C βdc I B I CE0 Common emitter dc current gain: dc IC dc 1 dc I B President University Erwin Sitompul SDP 9/15 Chapter 11 BJT Static Characteristics Notation (pnp BJT) Minority carrier constants N E N AE DE DN E n LE LN nE0 np0 ni2 N E President University N B N DB DB DP B p LB LP pB0 pn0 ni2 N B Erwin Sitompul N C N AC DC DN C n LC LN nC0 np0 ni2 N C SDP 9/16 Chapter 11 BJT Static Characteristics Emitter Region Diffusion equation: d 2 nE nE 0 DE 2 dx E Boundary conditions: nE ( x ) 0 nE ( x 0) nE0 (e qVEB President University kT 1) Erwin Sitompul SDP 9/17 Chapter 11 BJT Static Characteristics Base Region Diffusion equation: d 2 pB pB 0 DB 2 dx B Boundary conditions: pB (0) pB0 (eqVEB kT 1) qVCB kT pB (W ) pB0 (e 1) President University Erwin Sitompul SDP 9/18 Chapter 11 BJT Static Characteristics Collector Region Diffusion equation: d 2 nC nC 0 DC 2 dx C Boundary conditions: nC ( x ' ) 0 nC ( x ' 0) nC0 (e qVCB President University kT 1) Erwin Sitompul SDP 9/19 Chapter 11 BJT Static Characteristics Ideal Transistor Analysis Solve the minority-carrier diffusion equation in each quasineutral region to obtain excess minority-carrier profiles n ( x), Each region has different set of boundary conditions E pB ( x), Evaluate minority-carrier diffusion currents at edges of nC ( x) depletion regions d pB d nE I Ep qADB I En qADE dx x 0 dx x0 d pB d nC I Cp qADB I Cn qADC dx x W dx x0 Add hole and electron components together terminal currents is obtained IC IE IB President University Erwin Sitompul I E I Ep I En I C I Cp I Cn IB I E IC SDP 9/20 Chapter 11 BJT Static Characteristics Emitter Region Solution d 2 nE nE 0 DE 2 dx E Diffusion equation: General solution: x LE x LE nE ( x ) A1e A2e nE ( x ) 0 nE ( x 0) nE0 (e qVEB kT 1) Boundary conditions: nE ( x) nE0 (e qVEB Solution I En d nE qADE dx President University kT 1)e x LE DE qA nE0 (e qVEB LE x0 Erwin Sitompul kT 1) SDP 9/21 Chapter 11 BJT Static Characteristics Collector Region Solution d 2 nC nC 0 DC 2 dx C Diffusion equation: General solution: nC ( x) A1e x LC A2e x LC nC ( x ) 0 nC ( x 0) nC0 (e qVCB kT 1) Boundary conditions: nC ( x) nC0 (eqVCB Solution I Cn kT 1)e x LC DC d nC qVCB qA n ( e qADC C0 L dx x0 C President University Erwin Sitompul kT 1) SDP 9/22 Chapter 11 BJT Static Characteristics Base Region Solution Diffusion equation: General solution: d 2 nB pB 0 DB 2 dx B pB ( x) A1e x LB A2e x LB Boundary conditions: p (0) p (eqVEB B B0 pB (W ) pB0 (eqVCB Solution kT kT 1) 1) (W x ) LB (W x ) LB e e qVEB kT pB ( x) pB0 (e 1) W LB W LB e e x LB x LB e e qVCB kT pB0 (e 1) W LB W LB e e President University Erwin Sitompul SDP 9/23 Chapter 11 BJT Static Characteristics Base Region Solution e e Since sinh( ) 2 (W x ) LB (W x ) LB e e qVEB kT We can write pB ( x) pB0 (e 1) W LB W LB e e x LB x LB e e qVCB kT pB0 (e 1) W LB W LB e e as pB ( x) pB0 (e qVEB kT pB0 (eqVCB President University Erwin Sitompul 1) kT sinh (W x) LB sinh(W LB ) sinh( x LB ) 1) sinh(W LB ) SDP 9/24 Chapter 11 BJT Static Characteristics Base Region Solution d d e e sinh( ) Since d d 2 I Ep I Cp e e cosh( ) 2 d pB qADB dx x 0 cosh(W LB ) qVEB DB qA pB0 (e LB sinh(W LB ) d pB qADB dx x W DB 1 qA pB0 (e qVEB LB sinh(W LB ) President University kT kT 1 1) (e qVCB sinh(W LB ) cosh(W LB ) qVCB 1) (e sinh(W LB ) Erwin Sitompul kT kT SDP 9/25 1) 1) Chapter 11 BJT Static Characteristics Terminal Currents Since I E I En I Ep , I C I Cn I Cp Then DE DB cosh(W LB ) qVEB I E qA nE0 pB0 (e LB sinh(W LB ) LE DB qVCB kT 1 pB0 1) (e sinh(W LB ) LB D qVEB kT 1 B I C qA p (e 1) L B0 sinh W L B B DC DB cosh(W LB ) qVCB nC0 pB0 (e LB sinh(W LB ) LC kT kT 1) 1) IB IE IC President University Erwin Sitompul SDP 9/26 Chapter 11 BJT Static Characteristics Simplified Relationships To achieve high current gain, a typical BJT will be constructed so that W << LB. Using the limit value lim sinh( ) 0 lim cosh( ) 1 0 2 2 Due to VEB We will have x pB ( x) pB0 (e 1) 1 W x qVCB / kT pB0 (e 1) W qVEB / kT x pB ( x) pB (0) pB0 (W ) pB (0) W President University Erwin Sitompul Due to VCB SDP 9/27 Chapter 11 BJT Static Characteristics Performance Parameters For specific condition of “Active Mode”: emitter junction is forward biased and collector junction is reverse biased W << LB, nE0/pB0 NB/NE 1 DE N B W 1 DB N E LE dc T 1 DE N B W 1 W 1 DB N E LE 2 LB President University 2 , dc Erwin Sitompul 1 1W 1 2 LB 2 1 DE N B W 1 W DB N E LE 2 LB SDP 9/28 2 Chapter 6 pn Junction Diodes: I-V Characteristics Homework 7 1. (10.17) Consider a silicon pnp bipolar transistor at T = 300 K with uniform dopings of NE = 5×1018 cm–3, NB = 1017 cm–3, and NC = 5×1015 cm–3 . Let DB = 10 cm2/s, xB = 0.7 μm, and assume xB << LB. The transistor is operating in saturation with JP = 165 A/cm2 and VEB = 0.75 V. Determine: (a) VCB, (b) VEC(sat), (c) the number/cm2 of excess minority carrier holes in the base, and (d) the number/cm2 of excess minority carrier electrons in the long collector, take LC = 35 μm. 2. Problem 10.4, Pierret’s “Semiconductor Device Fundamentals”. Deadline: 07.04.2011, at 07:30 am. President University Erwin Sitompul SDP 9/29 (10.14)