Download Senior project - Clark Haynie Walters

California University of Pennsylvania
Department of Applied Engineering & Technology
Electrical Engineering Technology
Sound Source Localization System
EET 450
Senior Design Project
Final Report
By
Benjamin Clark
Samantha Haynie
Clifford Walters III
May 2, 2014
Sound Source Localization System
by
Benjamin Clark
Samantha Haynie
Clifford Walters III
Project Report Submitted to the
Department of Applied Engineering & Technology
At
California University of Pennsylvania
In fulfillment of the requirements for the
Senior Design Project in the
Electrical Engineering Technology
Professor Jim Means, Course Instructor
California, Pennsylvania
2014
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Table of Contents
Abstract ...................................................................................................................... 5
Introduction ................................................................................................................ 6
Design......................................................................................................................... 6
Math ....................................................................................................................... 7
Difference in Arrival Time ................................................................................. 7
Cross Correlation................................................................................................ 7
Difference in distance......................................................................................... 8
Sound position .................................................................................................... 8
Hardware ................................................................................................................ 9
Software ............................................................................................................... 10
Functional Specifications ......................................................................................... 12
Requirements ........................................................................................................ 12
Specifications ....................................................................................................... 12
Project proposed timeline ..................................................................................... 13
Final Project Development Phases ....................................................................... 14
Testing and Results .................................................................................................. 14
Summary .................................................................................................................. 15
Appendices ............................................................................................................... 17
Appendix A – Math .............................................................................................. 17
Appendix B – Programming ................................................................................ 26
Appendix C – Schematics .................................................................................... 28
Appendix D – Datasheets ..................................................................................... 31
Appendix E – Pictures .......................................................................................... 62
Appendix F – Bill of Materials ............................................................................ 66
References ............................................................................................................ 67
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List of Figures
Figure 1 - Ideal Microphone locations ....................................................................... 6
Figure 2 - Difference in Arrival Times ...................................................................... 7
Figure 3 - Gantt Chart .............................................................................................. 13
Figure 4 - Project Phases .......................................................................................... 14
Figure 5 - LabVIEW Block Diagram a .................................................................... 26
Figure 6 - LabVIEW Block Diagram b .................................................................... 26
Figure 7 - LabVIEW Block Diagram c .................................................................... 27
Figure 8 - LabVIEW Block Diagram d .................................................................... 27
Figure 9 - LabVIEW Block Diagram e .................................................................... 27
Figure 10 - Microphone Amplification Circuit ........................................................ 28
Figure 11 - Filter circuit ........................................................................................... 29
Figure 12 - Mixer and Temperature Sensor ............................................................. 30
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Abstract
Sound source localization is the utilization of trig functions applied to sound
samples acquired from strategically placed microphones to locate the origin of a sound
within a given distance. Within that given distance, precise equations can be modeled to
give the exact position of a sound with an unknown origin. The uses for this system
encompass a magnitude of both civilian and military applications. These applications
include weather tracking of tornados, mapping lightning strikes or gunshot mapping for
police reports or military counter strikes.
This system can feasibly be used in any
application where a client wishes to know the location of a specific sound. There are
numerous ways to apply this theory, depending on the amount of precision required and
economic funding available to provide for it.
The team researched how temperature, pressure and humidity correlate to the speed
of sound and how that affects the distance calculation. In the development of this project,
the team members made, bought, scavenged, and borrowed the equipment required to take
sound samples, feed that information into a simulated environment and rapid prototype a
proof of concept.
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Introduction
Sound Source Localization is the method by which the origin point of a sound is
mathematically derived using a combination of hardware and software components. The
goal of this project was to prove that a sound wave could be tracked and used to calculate
the originating point of the sound. The approach used in this project was to use an array of
five microphones to capture the sound as it reached each microphone. This data along with
the time each microphone recorded the sound wave was recoded and used to determine the
time differences between the four outer microphones and the center microphone. The time
differences were then used in an algorithm to calculate the origin of the sound.
Design
The physical and program design of this project was developed using the
mathematical functions described below. Since the location algorithm is dependent on four
delta times, these deltas dictated the physical layout of the microphone array. Therefore,
the microphones were laid out in a grid along the Cartesian coordinate system with the
center microphone on the origin and the other four microphones on the positive and
negative X and Y axis. As long as the microphones are in line along the axis, the distance
between the center and outer microphones does not matter, provided that distance is known
and the positive and negative distances are equal.
Figure 1 - Ideal Microphone locations
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Math
In order for the system to find the location of the sound, several mathematical
calculations must be completed. The difference in the time of arrival must be calculated to
determine the location of the sound source. The most important and intensive calculation
is cross correlation. The results of the cross correlation provide the difference in arrival
time between the center microphone and each of the outer microphones. Using the data
from the difference in arrival time and the speed of sound, the difference in distance to the
sound is determined. The difference in distances is then used in the source position
equation to determine the coordinates of the sound. Each of these calculations is explained
below.
Difference in Arrival Time
Each microphone receives the sound at a different time. Knowing the difference in
the arrival time is vital to determining the location of the sound. The figure below shows
how the sound arrives at each microphone at different times. These values are determined
by cross correlation, explained in the next section.
Figure 2 - Difference in Arrival Times
Cross Correlation
With two waveforms, similarities between them can be measured using cross
correlation. The calculation is designed to compare two similar signals and determine the
lag of one signal with respect to the other. The signals are represented as a set of N
samples. This is represented mathematically as:
𝑁−1
𝑅𝑖𝑗 (𝜏) = ∑ 𝑥𝑖 [𝑛]𝑥𝑗 [𝑛 − 𝜏]
𝑛=0
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Where 𝑥𝑖 [𝑛] is the signal received by microphone 𝑖 and 𝜏 is the correlation lag in samples.
𝑅𝑖𝑗 (𝜏) is at a maximum whenever 𝜏 is equal to the offset between the two signals. Once the
offset is determined, the delay can be determined by the argument of the maximum,
represented as:
𝜏𝑑𝑒𝑙𝑎𝑦 = 𝑎𝑟𝑔 max((𝑓 ⋆ 𝑔)(𝑡))
𝑡
Difference in distance
The time delay, as determined by the cross correlation, is used to calculate the
difference in distance between the center microphone and each outer microphone. The
calculation is:
𝐷𝑖𝑓𝑓𝑒𝑟𝑒𝑛𝑐𝑒 𝑖𝑛 𝐷𝑖𝑠𝑡𝑎𝑛𝑐𝑒 =
𝑠𝑝𝑒𝑒𝑑 𝑜𝑓 𝑠𝑜𝑢𝑛𝑑
𝑑𝑖𝑓𝑓𝑒𝑟𝑒𝑛𝑐𝑒 𝑖𝑛 𝑎𝑟𝑟𝑖𝑣𝑎𝑙 𝑡𝑖𝑚𝑒
Since the speed of sound is not constant, it must also be calculated for the difference in
distance to be accurate. The speed of sound is affected by many variables including
temperature, humidity, and barometric pressure. Humidity and pressure, though affecting
the system, do not have a significant affect to be considered in this application. The
temperature, however, must be considered. The speed of sound based on temperature is
computed by:
𝑐𝑎𝑖𝑟 = 20.0457 ∗ √𝜗 + 273.15
Where c is the speed of sound and 𝜗is the temperature.
Sound position
The location of the sound is determined using the sound source position equation.
The equation uses the difference in distance for each microphone determined in the
previous equation. The equation relies on the microphone being placed in a plus sign, as
shown in Figure-1. The equations to find x, y, and z are as follows (for equation derivation
see appendix A:
𝑿𝟐 [(∆𝟏) − (∆𝟑)] − (∆𝟑)𝟐 (∆𝟏) + (∆𝟏)𝟐 (∆𝟑)
𝒙=
𝟐𝑿[(∆𝟑) + (∆𝟏)]
𝒚=
𝒀𝟐 [(∆𝟐) − (∆𝟒)] − (∆𝟒)𝟐 (∆𝟐) + (∆𝟐)𝟐 (∆𝟒)
𝟐𝒀[(∆𝟒) + (∆𝟐)]
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𝑨=
(𝑿𝟐 − 𝟐𝒙𝑿)
∆𝟐
((𝟐 ∗ ∆𝟐) − 𝟐 )
𝒛 = √𝑨𝟐 − 𝒙𝟐 − 𝒚𝟐
Where X and Y are the distance from the center microphone top the outer microphone and
Δ1 – Δ4 representing the difference in distance between each microphone and the center
microphone. Where 1 is –x, 2 is –y, 3 is +x and 4 is +y.
Hardware
In order to keep microphones in a stable position an array was built to hold them in
position. The array was constructed from angle iron, wood, and 0.5 inch PVC pipe. Two
wood blocks 5.75 inches square where mounted vertically to each other 4.25 inches apart
using angle brackets mounted on the outer face of the blocks. This created the foundation
for the center hub (See Appendix E for further detail). The outlying microphones were
mounted on mobile PVC legs to allow for an array of variable size. While this left the thin
wire exposed, it was found to be not to be an issue. The array was raised a significant
distance from the ground to prevent echo.
The microphones used in this project were POM-2246P-C33-Rs they are low
voltage and omnidirectional.
Omnidirectional microphones were necessary since the
direction of the desired target sound would be unknown. The sound desired in this project
was an impulse of some unknown frequency and amplitude. The TL074 is a quad op amp
made up of four integrated TL071 op amps. These op amps where chosen for their J-FET
low noise input transistors. The digital acquisition device chosen for this project was the
NI-DAQ -USB-6259. This was readily available and after some investigation was found to
be appropriate and the project utilized seven of the thirty-two analog channels available.
An initial concern with this DAQ was that it was a multiplexed read from the five
microphone channels. This was dismissed as negligible after designing an array size that
was larger than the delay incurred from multiplexing. The LM35DT precision centigrade
temperature sensor allowed for accurate relative temperature for use in calculating speed of
sound.
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The disturbance from the microphone was fed into the first TL071 op amp set up
for positive gain to allow for easier manipulation of the wave. This was then fed into the
second TL071 setup as a voltage follower with the purpose of preventing loading on the
filter circuit. The third TL071 was designed as a high pass filter with its input drawing
from the voltage follower. The final TL071 was set up as a low pass filter drawing from
the output of the high pass filter. These two filters in series resulted in a band pass filter,
which was then transmitted to the DAQ through a modified RS-232 serial cable.
A trigger circuit was designed to minimize data point collection preventing
overflow events. The circuit utilizes two TL071 op amps with tunable gain with the first
op amp on the receiving side of all 5 microphones. This trigger would not need to be read
all the time but simply read until a microphone peaked.
This triggered the DAQ to start
reading, resulting in the multiplexed read from the individual channels. The band pass
filter was designed to allow all frequencies between 200 Hz and 2 KHz through. This
threshold was chosen after research showed that gunshots were located in the 200 Hz range
and hands clapping in the 2 KHz range. Testing showed that this was an effective threshold
where popping balloons simulated gunshots effectively, when clapping was not loud
enough.
Software
LabVIEW (Laboratory Virtual Instrumentation Engineering Workbench) is a
development environment for measurement and control systems geared toward high
productivity. LabVIEW has the capability to interface with the physical world using data
acquisition devices. This allows for the testing and manipulation of real world signals and
data.
The visual programing provides the ability to see how data flows from the
acquisition device to the final output allowing for easy manipulation of signal processing
and equations.
LabVIEW was chosen for this project because of the ease with which it can analyze
real world signals. This is accomplished by using a data acquisition device exterior to the
computer, LabVIEW can then use that data for many different applications ranging from
basic signal processing and graphing to more complex functions like cross-correlation and
for control systems. These capabilities made LabVIEW the best choice for the necessary
signal manipulations in sound localizing applications.
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There are two interfaces in the program, a real-time interface and a playback
analysis interface. Two interfaces gives the ability to see the data in nearly real time while
also allowing later playback of the data to analyze how the waveforms change with
different temperature conditions.
For the real time implementation of the software, the raw data from the NI-DAQ is
amplified by a factor of ten and then the desired part of the signal is extracted and
displayed on the Front Panel. After extraction, all five signals are cross correlated to the
center signal to determine the delta t’s. The speed of sound is also calculated at this time
based on a reading from the NI-DAQ. Then the differences are calculated in a MathScript
Node. A MathScript Node is the easiest way to compute large mathematical functions in
LabVIEW. The required variables are then printed to the Front Panel, and written to the
log file.
For the playback analysis software, logged data is read from the log file. The
program proceeds as for the real time implementation, however, the speed of sound is
provided by the user instead of being calculated by the program and the data is no longer
logged. Along with the mixed wave form graph an individual signal graph is displayed for
each microphone.
In the real-time interface, data collected from the NI-DAQ is shown on the front
panel of LabVIEW as five separate colored waveforms on a Time-Amplitude graph. There
are also six indicators showing the Cartesian and Spherical coordinates of the origin of the
recorded sound.
For the playback analysis interface, in addition to the large graph there are five
smaller graphs.
These graphs are placed in a digital representation of the physical
placement of each microphone showing the waveform each one saw. Since the speed of
sound is so important to the location algorithm there is a control box to input the speed
based on the desired conditions. Finally there are the same six indicators as in the realtime interface with the addition of a control box for the X and Y microphone placements
and three other types of indicators. These indicators show the delta t values, delta d values,
and the maximum indices.
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Functional Specifications
The purpose of this senior project was to create a system that determined the origin
of a sound. The location of the sound was displayed to the user and logged, so that the user
may reanalyze the data. The time and date the sound occurred were provided as well.
With playback software the logged data could be reanalyzed by a user.
Requirements



Acquire data automatically
Ability for system
o Display Cartesian coordinates of sound
o Display spherical coordinates of sound
o Display waveform of data
o Log data
Ability of playback software
o Display Cartesian coordinates of logged data
o Display spherical coordinates of logged
o Display waveform of data
o Display time difference of sounds
o Modify speed of sound
Specifications
Hardware:




Microphone array
Microphone amplification
Filter out noise
Data acquisition trigger
LabVIEW:



Sound arrival time difference
Location of sound
Log data
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Project proposed timeline
With any project time allocation is important. In order to ensure that the project
was completed on time a preliminary timeline was developed. The timeline is displayed in
Figure 3.
Figure 3 - Gantt Chart
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Final Project Development Phases
Project Phase
Comments
Completion Date
Status
1/20/2014
Completed
3/14/2014
Completed
4/17/2014
Completed
4/30/2014
Completed
5/2/2014
Completed
Determine
Phase I: Lab
requirements and
Requirements
specifications from
professor
Phase II: Hardware
Design and construct
setup
hardware
Phase III: LabVIEW
Development of
implementation
LabVIEW program
Phase IV: System
Test sound source
Testing and Revision
system for errors
Phase V: Presenting
Get professor’s input to
System
determine completion
Figure 4 - Project Phases
Testing and Results
With any new system the only way to know if it will function as expected is to
conduct tests. Throughout the project the individual sections of the system were tested to
ensure that the system as a whole would act as expected. Various results were encountered
throughout the construction of the system with any unexpected results being remedied.
To test the functionality of the completed system, tests were conducted in various
conditions and locations.
The main results were that with the system set up in an
uncontrolled environment with a lot of noise, a signal acquisition trigger did not occur.
These results showed that the filters were operating correctly. The amplitude of the sound
source was also varied as to ensure that the amplification circuits were operating correctly
as well.
Once the component parts tests confirmed the system was working, the remainder
of testing involved creating a sound at a known distance from the microphone array and
ensuring that the calculated and actual values matched. Tests were also conducted by
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making a sound at a random point and measuring to see if the value the system gave was
accurate.
Summary
Sound Source Localization is the method of finding the origination point of a sound
wave. This position is obtained through raw data collected from hardware, software signal
processing and a series of complex trigonometric equations. Error accumulation can be
caused by even small inaccuracies in any of the hardware or software areas. The most
important area to monitor is the speed of sound calculation. The speed of sound is affected
by temperature, humidity and pressure and these variables are used in the calculation.
Temperature was witnessed to have the most effect on the calculations, however, it should
be noted that all three do have an impact on the actual speed. The second most important
area to look for incurred error is the accurate placement of the microphone array. If any of
the array legs are out of position by even a centimeter the error incurred is logarithmic in
scale the as the generated sound moves farther away from the Cartesian origin. This error
accumulates even faster if multiple legs are out of position, giving false readings of where
the sound originated. Finally, error is incurred if the signals gathered have too large of a
settling time. Because the settling time on each microphone varies in length, usually due to
air currents or complex angles from the transmission medium creating false peaks that are
cross correlated incorrectly.
This was remedied through dynamic algorithmic signal
processing.
The specifications of the hardware are dependent on the required sampling speed.
This speed is derived from the minimum phase shift between the leg microphone and the
center. Filtering was included in the design to prevent false triggering, which sometimes
occurs regardless; however, filtering helped to exclude unwanted data.
The intended
frequency of the target sound was taken into consideration while evaluating acquisition
hardware, preventing testing of a system incapable of recording an accurate representation
of the sound.
With appropriate vetting of equipment for a predetermined design, the amount of
difficulty becomes manageable. The initial testing was done in a large room with a
controlled environment, minimizing ambient noise and complex angling due to air current.
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The actual source of the sound was repeatable, establishing a consistent wave pattern for
diagnostic purposes. Using all of these factors and specifications, the proof concept was
built and tested.
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Appendices
Appendix A – Math
Sound Source
Locator
Equations for 5
Microphone Array
17
The sound locator array consists of a total of five microphones. They are located at the
following locations:

(0,0)

(X,0)

(-X,0)

(0,Y)

(0,-Y)
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Let D0 be the distance from the source to the origin.
D0 = √𝑥 2 + 𝑦 2 + 𝑧 2
Let D1 be the distance from the source to (-X,0)
D1 = √(x − (−X))2 + y 2 + 𝑧 2
D1 = √(x + X)2 + y 2 + 𝑧 2
𝐷1 = √𝑋 2 + 2𝑥𝑋 + 𝑥 2 + 𝑦 2 + 𝑧 2
D1 − D0 = √𝑋 2 + 2𝑥𝑋 + 𝑥 2 + y 2 + 𝑧 2 − √𝑥 2 + 𝑦 2 + 𝑧 2
D1 − D0 + √𝑥 2 + 𝑦 2 + 𝑧 2 = √𝑋 2 + 2𝑥𝑋 + 𝑥 2 + y 2 + 𝑧 2
(𝐷1 − 𝐷0)2 + 2(𝐷1 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 + 𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑋 2 + 2𝑥𝑋 + 𝑥 2 + y 2 + 𝑧 2
(𝐷1 − 𝐷0)2 + 2(𝐷1 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑋 2 + 2𝑥𝑋
2(𝐷1 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 2𝑥𝑋 + 𝑋 2 − (𝐷1 − 𝐷0)2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
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2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
−
2(𝐷1 − 𝐷0)
2
Again, let D0 be the distance from the source to the origin.
𝐷0 = √𝑥 2 + 𝑦 2 + 𝑧 2
Let D3 be the distance from the source to (X,0)
D3 = √(x − X)2 + y 2 + 𝑧 2
𝐷3 = √𝑋 2 − 2𝑥𝑋 + 𝑥 2 + 𝑦 2 + 𝑧 2
D3 − D0 = √𝑋 2 − 2𝑥𝑋 + 𝑥 2 + y 2 + 𝑧 2 − √𝑥 2 + 𝑦 2 + 𝑧 2
D3 − D0 + √𝑥 2 + 𝑦 2 + 𝑧 2 = √𝑋 2 − 2𝑥𝑋 + 𝑥 2 + y 2 + 𝑧 2
(𝐷3 − 𝐷0)2 + 2(𝐷3 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 + 𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑋 2 − 2𝑥𝑋 + 𝑥 2 + y 2 + 𝑧 2
(𝐷3 − 𝐷0)2 + 2(𝐷3 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑋 2 − 2𝑥𝑋
2(𝐷3 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑋 2 − 2𝑥𝑋 − (𝐷1 − 𝐷0)2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
20
𝑋 2 − 2𝑥𝑋
(𝐷3 − 𝐷0)
−
2(𝐷3 − 𝐷0)
2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
−
2(𝐷1 − 𝐷0)
2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
𝑋 2 − 2𝑥𝑋
(𝐷3 − 𝐷0)
−
2(𝐷3 − 𝐷0)
2
2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
𝑋 2 − 2𝑥𝑋
(𝐷3 − 𝐷0)
−
=
−
2(𝐷1 − 𝐷0)
2
2(𝐷3 − 𝐷0)
2
(2𝑥𝑋 + 𝑋 2 )(𝐷3 − 𝐷0) − (𝐷1 − 𝐷0)2 (𝐷3 − 𝐷0) = (𝑋 2 − 2𝑥𝑋)(𝐷1 − 𝐷0) − (𝐷3 − 𝐷0)2 (𝐷1 − 𝐷0)
𝑥2𝑋(𝐷3 − 𝐷0) + 𝑋 2 (𝐷3 − 𝐷0) − (𝐷1 − 𝐷0)2 (𝐷3 − 𝐷0) = −𝑥2𝑋(𝐷1 − 𝐷0) + 𝑋 2 (𝐷1 − 𝐷0) − (𝐷3 − 𝐷0)2 (𝐷1 − 𝐷0)
𝑥2𝑋(𝐷3 − 𝐷0) + 𝑥2𝑋(𝐷1 − 𝐷0) = 𝑋 2 (𝐷1 − 𝐷0) − 𝑋 2 (𝐷3 − 𝐷0) − (𝐷3 − 𝐷0)2 (𝐷1 − 𝐷0) + (𝐷1 − 𝐷0)2 (𝐷3 − 𝐷0)
2𝑋{(𝐷3 − 𝐷0) + (𝐷1 − 𝐷0)} = 𝑋 2 (𝐷1 − 𝐷0) − 𝑋 2 (𝐷3 − 𝐷0) − (𝐷3 − 𝐷0)2 (𝐷1 − 𝐷0) + (𝐷1 − 𝐷0)2 (𝐷3 − 𝐷0)
𝑥 = ((𝐷1 − 𝐷0) − 𝑋 2 (𝐷3 − 𝐷0) − (𝐷3 − 𝐷0)2 (𝐷1 − 𝐷0) + (𝐷1 − 𝐷0)2 (𝐷3 − 𝐷0))/2𝑋((𝐷3 − 𝐷0) + (𝐷1 − 𝐷0)
𝑋 2 (𝐷1 − 𝐷0) − 𝑋 2 (𝐷3 − 𝐷0) − (𝐷3 − 𝐷0)2 (𝐷1 − 𝐷0) + (𝐷1 − 𝐷0)2 (𝐷3 − 𝐷0)
𝑥=
2𝑋{(𝐷3 − 𝐷0) + (𝐷1 − 𝐷0)}
𝑥=
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𝑋 2 {(∆1) − (∆3)} − (∆3)2 (∆1) + (∆1)2 (∆3)
2𝑋{(∆3) + (∆1)}
Again, let D0 be the distance from the source to the origin.
𝐷0 = √𝑥 2 + 𝑦 2 + 𝑧 2
Let D2 be the distance from the source to (0,-Y)
D2 = √x 2 + (y − (−Y))2 + 𝑧 2
D2 = √x 2 + (y + Y)2 + 𝑧 2
𝐷2 = √𝑥 2 + 𝑌 2 + 2𝑦𝑌 + 𝑦 2 + 𝑧 2
D2 − D0 = √𝑥 2 + 𝑌 2 + 2𝑦𝑌 + 𝑦 2 + 𝑧 2 − √𝑥 2 + 𝑦 2 + 𝑧 2
D2 − D0 + √𝑥 2 + 𝑦 2 + 𝑧 2 = √𝑥 2 + 𝑌 2 + 2𝑦𝑌 + 𝑦 2 + 𝑧 2
(𝐷2 − 𝐷0)2 + 2(𝐷2 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 + 𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑌 2 + 2𝑦𝑌 + 𝑥 2 + y 2 + 𝑧 2
(𝐷2 − 𝐷0)2 + 2(𝐷2 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑌 2 + 2𝑦𝑌
2(𝐷2 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 2𝑡𝑌 + 𝑌 2 − (𝐷2 − 𝐷0)2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
22
2𝑦𝑌 + 𝑌 2
(𝐷2 − 𝐷0)
−
2(𝐷2 − 𝐷0)
2
Again, let D0 be the distance from the source to the origin.
𝐷0 = √𝑥 2 + 𝑦 2 + 𝑧 2
Let D4 be the distance from the source to (0,Y)
D4 = √x 2 + (y − Y)2 + 𝑧 2
𝐷4 = √𝑥 2 + 𝑌 2 − 2𝑦𝑌 + 𝑦 2 + 𝑧 2
D4 − D0 = √𝑥 2 + 𝑌 2 − 2𝑦𝑌 + 𝑦 2 + 𝑧 2 − √𝑥 2 + 𝑦 2 + 𝑧 2
D4 − D0 + √𝑥 2 + 𝑦 2 + 𝑧 2 = √𝑥 2 + 𝑌 2 − 2𝑦𝑌 + 𝑦 2 + 𝑧 2
(𝐷4 − 𝐷0)2 + 2(𝐷4 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 + 𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑌 2 − 2𝑦𝑌 + 𝑥 2 + y 2 + 𝑧 2
(𝐷4 − 𝐷0)2 + 2(𝐷4 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑌 2 − 2𝑦𝑌
2(𝐷4 − 𝐷0)√𝑥 2 + 𝑦 2 + 𝑧 2 = 𝑌 2 − 2𝑦𝑌 − (𝐷4 − 𝐷0)2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
23
𝑌 2 − 2𝑦𝑌
(𝐷4 − 𝐷0)
−
2(𝐷4 − 𝐷0)
2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
2𝑦𝑌 + 𝑌 2
(𝐷2 − 𝐷0)
−
2(𝐷2 − 𝐷0)
2
√𝑥 2 + 𝑦 2 + 𝑧 2 =
𝑌 2 − 2𝑦𝑌
(𝐷4 − 𝐷0)
−
2(𝐷4 − 𝐷0)
2
(𝐷2 − 𝐷0)
2𝑦𝑌 + 𝑌 2
𝑌 2 − 2𝑦𝑌
(𝐷4 − 𝐷0)
−
=
−
2(𝐷2 − 𝐷0)
2
2(𝐷4 − 𝐷0)
2
(2𝑦𝑌 + 𝑌 2 )(𝐷4 − 𝐷0) − (𝐷2 − 𝐷0)2 (𝐷4 − 𝐷0) = (𝑌 2 − 2𝑦𝑋)(𝐷2 − 𝐷0) − (𝐷4 − 𝐷0)2 (𝐷2 − 𝐷0)
𝑦2𝑌(𝐷3 − 𝐷0) + 𝑋 2 (𝐷4 − 𝐷0) − (𝐷2 − 𝐷0)2 (𝐷4 − 𝐷0) = −𝑦2𝑌(𝐷2 − 𝐷0) + 𝑋 2 (𝐷2 − 𝐷0) − (𝐷4 − 𝐷0)2 (𝐷2 − 𝐷0)
𝑦2𝑌(𝐷4 − 𝐷0) + 𝑦2𝑌(𝐷2 − 𝐷0) = 𝑌 2 (𝐷2 − 𝐷0) − 𝑋 2 (𝐷4 − 𝐷0) − (𝐷4 − 𝐷0)2 (𝐷2 − 𝐷0) + (𝐷2 − 𝐷0)2 (𝐷4 − 𝐷0)
2𝑌{(𝐷4 − 𝐷0) + (𝐷2 − 𝐷0)} = 𝑌 2 (𝐷2 − 𝐷0) − 𝑋 2 (𝐷4 − 𝐷0) − (𝐷4 − 𝐷0)2 (𝐷4 − 𝐷0) + (𝐷4 − 𝐷0)2 (𝐷4 − 𝐷0)
𝑌 = ((𝐷2 − 𝐷0) − 𝑋 2 (𝐷4 − 𝐷0) − (𝐷4 − 𝐷0)2 (𝐷2 − 𝐷0) + (𝐷2 − 𝐷0)2 (𝐷4 − 𝐷0))/2𝑋((𝐷4 − 𝐷0) + (𝐷2 − 𝐷0))
𝑌 2 (𝐷2 − 𝐷0) − 𝑌 2 (𝐷4 − 𝐷0) − (𝐷4 − 𝐷0)2 (𝐷2 − 𝐷0) + (𝐷2 − 𝐷0)2 (𝐷4 − 𝐷0)
𝑦=
2𝑌{(𝐷4 − 𝐷0) + (𝐷2 − 𝐷0)}
𝑦=
24
𝑌 2 {(∆2) − (∆4)} − (∆4)2 (∆2) + (∆2)2 (∆4)
2𝑌{(∆4) + (∆2)}
√𝑥 2 + 𝑦 2 + 𝑧 2 =
2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
−
2(𝐷1 − 𝐷0)
2
2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
𝑥 +𝑦 +𝑧 = {
−
}
2(𝐷1 − 𝐷0)
2
2
2
2
2
2
2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
𝑧 ={
−
} − 𝑥2 − 𝑦2
2(𝐷1 − 𝐷0)
2
2
2
𝑧 = √{
25
2𝑥𝑋 + 𝑋 2
(𝐷1 − 𝐷0)
−
} − 𝑥2 − 𝑦2
2(𝐷1 − 𝐷0)
2
Appendix B – Programming
Figure 5 - LabVIEW Block Diagram a
Figure 6 - LabVIEW Block Diagram b
26
Figure 7 - LabVIEW Block Diagram c
Figure 8 - LabVIEW Block Diagram d
Figure 9 - LabVIEW Block Diagram e
27
Appendix C – Schematics
Figure 10 - Microphone Amplification Circuit
28
Figure 11 - Filter circuit
29
Figure 12 - Mixer and Temperature Sensor
30
Appendix D – Datasheets
31
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A, TL074B
SLOS080L – SEPTEMBER 1978 – REVISED
FEBRUARY 2014
1
TL07x Low-Noise JFET-Input Operational
Features Amplifiers
2
•
Low Power Consumption
Description
The JFET-input operational amplifiers in
the TL07x series are similar to the TL08x series,
with low input bias and offset currents and fast slew
rate. The low harmonic distortion and low noise
make the TL07x series ideally suited for high-fidelity
and audio preamplifier applications. Each amplifier
features JFET inputs (for high input impedance)
coupled with bipolar output stages integrated on a
single monolithic chip.
• Wide Common-Mode and Differential
Voltage Ranges
• Low Input Bias and Offset
Currents
Output
Short-Circuit
•
Protection
•
Low Total Harmonic Distortion:
•
0.003% Typ Low Noise
• Vn = 18 nV/√Hz Typ at f = 1 kHz
• High Input Impedance: JFET Input
Stage Internal Frequency Compensation
•
Latch-Up-Free
•
Operation High Slew Rate:
• Typ
13 V/μs
Common-Mode Input Voltage Range
Includes
3 VCC+
Terminal
Out Drawings
D, P, OR PS
OF
PACKAGE
(TOP VIEW)
TL071,
TL071A, TL071B
N
1
8
FSET N1
2
7
IN−
IN+
VC
3
6
4
5
C
VCC+
OUT
OF
FSET N2
The C-suffix devices are characterized for
operation from 0°C to 70°C. The I-suffix devices
are characterized for operation from −40°C to 85°C.
The M-suffix devices are characterized for operation
over the full military temperature range of −55°C to
125°C.
TL072,
TL072A,
D, TL072B
JG, P, PS, OR PW
PACKAGE
(TOP VIEW)
11
OUT
2
7
3
6
4
5
1
IN−
IN+
CC+
2OUT
2
TL IN+
IN−
NC – No internal
connection
IN+
N
2
9
3
8
41
7
CC+
5
6
2OUT
1
IN+
V
C
11
14
2
13
3
12
4
IN−
072
U
V
PACKAGE
CC−
VIEW)
NC (TOP
1
10
1OU
T
OUT
IN−
2
1
C−
V
8
TL074A,
TL074B
D, J, N, NS, OR PW PACKAGE
TL074 . . . D, J, N, NS, PW,
OR W PACKAGE
(TOP VIEW)
1
5
4
OUT
4
11
IN−
10
61
9
7
8
4
IN+
VCC+
2IN+
V
CC−
3IN+
2
V
3
IN−
IN−
2
2
3
OUT
IN−
OUT
2
IN+
CC−
32
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical
applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A,
TL074B
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SLOS080L – SEPTEMBER 1978 – REVISED
FEBRUARY 2014
ww.ti.com
Table
Contents
1 Features
.................................................................
1
2
Description
3
............................................................ 1
4
Terminal
Out
Drawings
5
........................................ 1
6. 6 Absolute Maximum Ratings .....................................
1
5 Revision
History
6.
of
6.5 Operating Characteristics ........................................ 7
7 Parameter Measurement Information
8
................. 8
9
Typical
Characteristics
1
........................................
9
10.
Related Links .......................................................
0
Handling Ratings ......................................................
...................................................
2
2
5
6.
Electrical
Characteristics
..........................................
Terminal
Configuration
and Functions
3
6
...............
3
6.
Electrical Characteristics ..........................................
4
7 Specifications
4
1
1
17
Application
Information
10.
Trademarks ..........................................................
2
17
.....................................
15
10.
Electrostatic Discharge Caution ...........................
and Documentation
Support
1 17Device Packaging,
Mechanical,
and
Orderable
3
Information .......................................................... 17
................
17 ...............................................................
10.
Glossary
4
17
Revision History
........................................................
5
NOTE: Page numbers for previous
revisions may differ from page numbers in the
current version.
Changes from Revision J (March 2005) to
Revision K
•
Updated
document
to
new
TI
........................................................................ 1
•
Added
P
datasheet
format
-
no
specification
ESD
age
changes.
warning.
........................................................................................................................................................... 17
Changes from Revision K (January 2014) to
Revision L
• Moved
Tstg
to
Handling
Ratings
•
...................................................................................................................................
5
missing
Electrical
Characteristics
• Added
.....................................................................................................................
6
•
Added
Device
and
Documentation
P
age
table.
table.
Support
section.
........................................................................................................... 17
Added
Mechanical,
Packaging,
and
Orderable
Information
section.
................................................................................... 17
2
33
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Feedback
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TL074A TL074B
Copyright © 1978–2014, Texas Instruments
TL071A
TL071B TL072 Incorporated
TL072A TL072B
TL074
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A, TL074B
SLOS080L – SEPTEMBER 1978 – REVISED
w
FEBRUARY 2014
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Terminal Configuration and
T
5
6
7
2
8
7
1
6
1
5
1
9 10 11 12 13 4
4
IN−
OUT
4
IN+
NC
V
CC−
3
1
8
1
2
IN+
N
4
1
OUT
NC
IN−
1
C
C
2OUT
NC
2IN−
3 2 1 20 19
4
NC
IN+
IN−
3
C
NC
3OUT
C
1IN+
NC
VCC+
NC
IN−
C
N
OUT
NC
FSET N2
N
7
5
1
8N
9 10 11 12 13 4
N
NC
V CC−
NC
OF
7
1
6
1
NC
V CC−
C
5
6
FK
PACKAGE
(TOP VIEW)
2
VCC+
NC
OUT
5
1
8 N
9 10 11 12 13 4
1
8
1
4
N
NC
1IN−
N
NC
1IN+
C
7
1
6
1
7
74
3 2 1 20 19
1
8
1
5
6
CC+
OP VIEW)
3 2 1 20 19
4
V
N
C
1OU
T NC
NC
OFFSET N1
NC
NC
NC
OP VIEW)
NC
IN−
NC
IN+
TL0
L072 FK
PACKAGE
(T
FK TL071
PACKAGE
(T
C
2IN+
NC
5
Functions
NC − No internal
connection
S
ymbols
T
L071
TL072 (each
O
FFSET N1
amplifier)
TL074 (each
I
+
N+
N−
O
I
−
I
amplifier)
+
I
−
N+
UT
N−
O
UT
O
FFSET N2
34
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Copyright © 1978–2014, Texas Instruments
Incorporated
Product Folder Links: TL071
TL074A TL074B
TL071A
TL071B TL072
Feedback
TL072A TL072B
TL074
3
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A,
TL074B
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SLOS080L – SEPTEMBER 1978 – REVISED
ww.ti.com
FEBRUARY 2014
Schematic
Amplifier)
V
(Each
CC+
I
N+
I
N−
Ω
64
Ω
1
28
O
UT
64 Ω
C
1
1
8 pF
1080 Ω
1080 Ω
V
CC−
O
O
FFSET
FFSET
N
N
1
2
TL0
71 Only
All component values shown are
nominal.
COMPONENT COUNT†
COMPONENT
TYPE
Resistors
Transistors
JFET
Diodes
Capacitors
epi-FET
T
L071
11
14
2
1
1
1
L072
22
28
4
2
2
2
T
T
L074
44
56
6
4
4
4
†
Includes bias and trim
circuitry
4
35
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TL074A TL074B
Copyright © 1978–2014, Texas Instruments
TL071A
TL071B TL072 Incorporated
TL072A TL072B
TL074
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A, TL074B
SLOS080L – SEPTEMBER 1978 – REVISED
w
FEBRUARY 2014
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6
Specifications
6.1 Absolute Maximum Ratings (1)
over
operating
free-air
temperature
range
(unless
V
otherwise noted)
18
ALUE
U
CC+
V
Supply voltage (2)
V
CC–
V
ID
Differential input voltage (3)
±30
V
Input voltage (2) (4)
±15
V
VI
Duration of output short
θJA
θJC
TJ
(
1
)
(
2
)
(
3
()
6
(
)(4
7
)
)(
(5
9
)
8
)
NIT
V
–18
circuit (5)
Unlimited
Package thermal impedance (6) (7)
Package thermal impedance (8) (9)
D package (8 pin)
97
D package (14 pin)
86
N package
80
NS package
76
P package
85
PS package
95
PW package (8 pin)
149
PW package (14 pin)
113
U package
185
FK package
5.61
J package
15.05
JG package
14.5
W package
14.65
Operating virtual junction temperature
°C/W
°C/W
150
°C
Case temperature for 60 seconds
FK package
260
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10
seconds
J, JG, or W package
300
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and
VCC−. Differential voltages are at IN+, with respect to IN−.
The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the
dissipation rating is not exceeded.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with MIL-STD-883.
6.2
Ratings
R Tstg
Handling
PARAMETE
DEFINITION
Product Folder Links: TL071
TL074A TL074B
U
°C
NIT
Submit Documentation
Copyright © 1978–2014, Texas Instruments
Incorporated
V
–65
to 150
ALUE
Storage temperature range
TL071A
TL071B TL072
Feedback
TL072A TL072B
TL074
36
5
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A,
TL074B
w
SLOS080L – SEPTEMBER 1978 – REVISED
FEBRUARY 2014
6.3
Characteristics
VCC±
=
PARA
otherwise noted)
METER
Electrical
±15
V
(unless
T
T
EST
ONDITIONS
T
C
A
(2)
(1)
IN2
VI
ut offset
oltage
O
Inp
v
VO
nput offset
age I
I
ut offset
urrent
O
=
0,
R = 50 Ω
T
emperature
α
V
coefficient of i
IO
VO
=
0,
B
oltage
B1
plification
ity-gain
andwidth
r
I
MRR
SVR
C
O1/VO 2
(
1
)
(
2
)
(
3
)
VO = 0
AX
IN6
5°C
Full
range
RL≥ 2 kΩ
12
2
5°C
LFull
range
am
Util
b
t
1
±
ut resistance
C
C
ommon-mode
VICRmin,
rejection ratio
S
upply-voltage
k
to ±15 V,
rejection ratio
(ΔVCC±/ΔVIO)
Su
IC
(e
pply current
ach amplifier)
V
C
rosstalk
D
attenuation
VIC
=
O
2
VCC = =±9 0,
V
V
R = 50 Ω
VO
== 0,
0,
V
O
R
S = 50 Ω
No
load
2
1.4
5°C
5°C
±
12
2
00
0
00
1
5
2
00
t
1
V
±
V
5
0
2
00
V
25
3
/mV
M
3
Hz
12
Ω
1
10
1
7
5
00
0
00
1
1
8
2
1.4
1
n
A
±10
7
5
00
0
00
1
d
B
1
d
B
2
1.4
.5
1
1
8
2
1.4
.5
20
.5
1
120
20
20
d
B
37
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TL074A TL074B
Copyright © 1978–2014, Texas Instruments
TL071A
TL071B TL072 Incorporated
TL072A TL072B
TL074
m
A
All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise
specified. Full range is TA = 0°C to 70°C for TL07_C,TL07_AC, TL07_BC and is TA = –40°C to 85°C for TL07_I.
Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as
shown in Figure 4. Pulse techniques must be used that maintain the junction temperature as close to the ambient temperature as
possible.
6
p
012
8
2
2
13.5 ±12
25
7
5
±
±
n
A
7
–
12
o
5
11
±13
±12
1
.5
2
AV = 100
t
1
3
1
7
00
±
012
7
0
.5
25
00
2
65
00
p
A
A
7
±10
1
2
5°C
12
0
3
1
–
12
o
5
11
±
00
012
0
±
t
1
µ
5
2
2
00
±
5
0
2
2
S
2
V
V/°C
00
65
7
±10
2
1
2
13.5 ±12
15
5°C
5°C
12
00
2
5°C
Inp
5
–
12
o
5
11
±10
5
6
8
1
00
65
00
±
±
AX
18
1
7
13.5 ±12
2
VO = ±10 V,
YP 3
NIT M
T
5
5
00
65
00
2
RL≥ 10 kΩ
IN
3
U
M
8
–
RL= 10 kΩ
AX
1
1
5°C
Full
range
5°C
YP 2
M
m
5
12
o
5
T
7.5
00
10
2
11
T
L071I
TL072I
TL074I
8
5°C
Full
range
R ≥ 2 kΩ
D
1 YP 3
L071BC
TL072BC
TL074BC
M
M
T
1
2
M
aximum
peak
V
output voltage
swing
L
arge-signal
AV
v
differential
OM
IN
8
VO = 0
Co
V
inp
mmon-mode
ut voltage
ran
ge
ICR
AX
Full
S
range
volt
Inp
c
T
YP 3
T
L071AC
TL072AC
TL074AC
M
M
0
13
R = 50 Ω
Inp
c
T
L071C
TL072C
TL074C
M
5°C
SFull
range
2
II
ut bias
urrent (3)
ww.ti.com
TL071, TL071A, TL071B
TL072, TL072A, TL072B, TL074, TL074A, TL074B
SLOS080L – SEPTEMBER 1978 – REVISED
w
FEBRUARY 2014
ww.ti.com
6.4
Characteristics
VCC±
=
otherwise noted)
Electrical
±15
V
(unless
T
L071M
TL072M
MIN
TA (2)
TEST
PARAMETER
CONDITIONS (1)
VIO
voltage
αV
IO
coefficient
Input
offset
Temperature
of
input
offset voltage
IIO
Input
VO = 0, RS =
50 Ω
VO = 0, SR
=
50 Ω
offset
VO = 0
5°C
Input
VI
Commonvo
current
bias
ltage range
Maximum
VO
vo
M
peak
output
ltage swing
A
RL ≥ 2 kΩ
Large-signal
Input
resistance
Common-
CMRR
VO = ±10 V, RL
mode
V/°C
5
p
A
n
2
6
6
A
p
200
20
A
n
–12 to
A
5
±11
2
±12
200
50
5
–12 to 15
±11
15
±13.5
±12
±12
Full
35
V
±13.5
±12
±10
2
5°C
V
±10
200
35
15
200
V
15
3
/mV
3
1012
M
Ω
Hz
2
2
rejection ratio 50 Ω
SupplyVCC = ±9
kS
ratio
V to ±15 V, VO = 0,
VR
voltage
rejection
RS = 50 Ω
Supply
(ΔV
)
IC CC±/ΔVIO
VO = 0, No
(ea
C
current
load
ch
VO1amplifier)
/VO2 Crosstalk
AVD = 100
5°C
attenuation
5°C
(
1
)
(
2
)
5
101
VIC = VICRmin,
VO = 0, RS =
μ
18
100
20
range
≥ 2 kΩ
voltage
Unity-gain
bandwidth ri
5°C
m
V
100
20
5°C
RL ≥ 10 kΩ
3
Full
5°C
RL = 10 kΩ
differential
VD
B1
amplification
2
NIT
9
15
1
8
2
CR
mode
input
U
TYP
MAX
3
Full
range
VO = 0
MIN
6
9
Full
range
current
IIB
range
TYP
MAX
2
5°C
TL074M
80
86
80
d
86
B
2
80
86
80
d
86
5°C
B
2
5°C
1.
4
2
1.
2.5
12
4
120
m
2.5
A
0
d
B
Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as
shown in Figure 4. Pulse techniques must be used that will maintain the junction temperature as close to the ambient temperature as
possible.
All characteristics are measured under open-loop conditions with zero common-mode voltage, unless otherwise specified. Full range is
TA = –55°C to 125°C.
6.5
Characteristics
Operating
VCC± = ±15 V, TA= 25°C
PARAMETE
SR
t
V
In
THD
R
Slew rate at unity
gain
Rise-time overshoot
rfact
or
Equivalent input noise
n
voltag
e
Equivalent input noise
curre
nt
Total harmonic
distortion
TL07xM
TEST CONDITIONS
VI = 10 V,
CL = 100 pF,
RL = 2 kΩ,
See Figure 1
VI = 20 V,
CL = 100 pF,
RL = 2 kΩ,
See Figure 1
f = 1 kHz
R = 20 Ω
S
MIN
5
f = 1 kHz
VIrms = 6 V,
RL ≥ 2
f=
1 kHz,
kΩ,
AVD = 1,
RS ≤ 1
kΩ,
Product Folder Links: TL071
TL074A TL074B
U
TYP
MAX
13
0.1
0.1
μs
20
20
%
18
18
nV/√Hz
4
4
μV
0.01
0.01
pA/√Hz
0.003
0.003
%
MAX
13
8
Submit Documentation
Copyright © 1978–2014, Texas Instruments
Incorporated
ALL
MIN
OTHERS
NIT
V/μs
f = 10 Hz to 10 kHz
RS = 20 Ω,
TYP
TL071A
TL071B TL072
Feedback
TL072A TL072B
TL074
38
7
Technical Sales
United States
(866) 531-6285
[email protected]
Requirements and Compatibility | Ordering Information | Detailed Specifications | Pinouts/Front Panel Connections
For user manuals and dimensional drawings, visit the product page resources tab on ni.com.
Last Revised: 2011-10-21 10:33:08.0
High-Speed M Series Multifunction DAQ for USB - 16-Bit, up to 1.25 MS/s, up to 80 Analog Inputs
Up to 80 analog inputs at 16 bits, 1.25 MS/s (1 MS/s or 750
Analog and digital triggering supported; power supply included
kS/s scanning) Up to 4 analog outputs at 16 bits, 2.86 MS/s
NI-PGIA 2 and NI-MCal calibration technology for improved measurement accuracy
NI signal streaming for 4 high-speed data streams on USB
Up to 48 TTL/CMOS digital I/O lines (up to 32 hardware-timed at up to 1 MHz)
NI-DAQmx driver software and LabVIEW SignalExpress LE
included
Two 32-bit, 80 MHz counter/timers
Overview
With recent bandwidth improvements and new innovations from National Instruments, USB has evolved into a core bus of choice for measurement and automation applications. NI M Series
high-speed devices for USB deliver high-performance data acquisition in an easy-to-use and portable form factor through USB ports on laptop computers and
other portable computing platforms. NI created NI signal streaming, an innovative patent-pending technology that enables sustained bidirectional high-speed
data streams on USB. The new technology, combined with advanced external synchronization and isolation, helps engineers and scientists achieve highM
Series high-speed
multifunction
acquisition (DAQ) modules for USB are optimized for superior accuracy at fast sampling rates. They provide an onboard NI-PGIA 2 amplifier designed for fast
performance
applications
ondata
USB.
settling times at high scanning rates, ensuring 16-bit accuracy even when measuring all available channels at maximum speed. All high-speed devices have a minimum of 16 analog inputs, 24 digital
I/O lines, seven programmable input ranges, analog and digital triggering, and two counter/timers. USB M Series devices are ideal for test, control, and design applications including portable data
logging, field monitoring, embedded OEM, in-vehicle data acquisition, and academic. High-speed NI USB-625x M Series devices have an extended two-year calibration interval.
Back to
Top
Requirements and Compatibility
Driver Information
OS Information
Windows 2000/XP
Software Compatibility
ANSI C/C++
NI-DAQmx
Windows 7
Windows Vista x64/x86
LabVIEW
SignalExpress
Visual C#
Visual Studio .NET
Back to Top
Comparison Tables
Family
Connector
Analog Inputs
USB-6251
Screw/68-pin
USB-6259
Screw/68-pin SCSI
SCSI
USB-6255
Screw/68-pin SCSI
Resolution
Max Rate
Analog Outputs
16 SE/8 DI
16 bits
1.25 MS/s
2
32 SE/16
DI
16
bits
1.25
MS/s
4
80 SE/40 DI
16 bits
1.25 MS/s
2
Resolution
Max Rate
Digital I/O
Counter/ Timer
16 bits
2.86 MS/s
24 (8 clocked)
2
16
bits
2.86
MS/s
48 (32
clocked)
2
16 bits
2.86 MS/s
24 (8 clocked)
2
39
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1/18
www.ni.com
Application and Technology
NI Signal Streaming
Unlike typical multifunction USB data acquisition devices, NI USB M Series DAQ devices incorporate NI signal streaming, a patent-pending technology that combines three innovative hardware- and
software-level design elements to enable sustained high-speed and bidirectional data streams over USB. NI signal streaming, along with the error correction, noise rejection, power management, and
power distribution inherent in the USB protocol, yields a robust, secure, and reliable bus. Without NI signal streaming, a multifunction data acquisition device could sustain only a single high-speed
data stream, effectively making it a single-function device. For more information, visit ni.com/usb.
USB M Series for Test
For test, you can use the M Series high-speed analog inputs and 10 MHz digital lines with NI signal conditioning for applications including test, component characterization, and sensor measurement.
High-speed USB-625x M Series devices are compatible with the NI SCC signal conditioning platform, providing amplification filtering and power for virtually every type of sensor. This platform is also
compliant with IEEE 1451.4 smart transducer electronic data sheet (TEDS) sensors, which offer digital storage for sensor data sheet information. USB M Series multifunction DAQ devices also
complement existing test systems that need additional measurement channels. For higher-channel-count signal conditioning on USB, consider the NI CompactDAQ or NI SCXI platform.
USB M Series for Control
USB M Series digital lines can drive 24 mA for relay and actuator control. By clocking the digital lines as fast as 10 MHz (with onboard regeneration), you can
use these lines for pulse-width modulation (PWM) to control valves, motors, fans, lamps, and pumps. With four waveform analog outputs, two 80 MHz
counter/timers, and four high-speed data streams on USB, M Series devices can execute multiple control loops simultaneously. High-speed USB-625x M
Series devices also offer direct support for encoder measurements, protected digital lines, and digital debounce filters. With up to 80 analog inputs, 32 clocked
You can also create a complete custom motion controller by combining USB M Series devices with the NI
digital
lines,Development
and four analog
outputs, you can execute multiple control loops with a single device.
SoftMotion
Module.
USB M Series for Design
For design applications, you can use a wide range of I/O – from 80 analog inputs to 48 digital lines – to measure and verify prototype designs. USB M Series devices and NI LabVIEW SignalExpress
interactive measurement software deliver benchtop measurements to the PC. With LabVIEW SignalExpress, you can quickly create design verification tests. The fast acquisition and generation rates
of high-performance USB M Series high-speed devices along with LabVIEW SignalExpress provide fast design analysis. You can convert your tested and verified LabVIEW SignalExpress projects to
LabVIEW applications for immediate M Series DAQ use, and bridge the gap between test, control, and design applications.
USB M Series for OEMs
Shorten your time to market by integrating National Instruments OEM products in your design. Board-only versions of USB M Series DAQ devices are available for OEM applications, with competitive
quantity pricing and software customization. The NI OEM Elite Program offers free 30-day trial kits for qualified customers. Visit ni.com/oem for more information.
Recommended Software
National Instruments measurement services software, built around NI-DAQmx driver software, includes intuitive application programming interfaces, configuration tools, I/O assistants, and other tools
designed to reduce system setup, configuration, and development time. National Instruments recommends using the latest version of NI-DAQmx driver software for application development in NI
LabVIEW, LabVIEW SignalExpress, LabWindows™/CVI, and Measurement Studio. To obtain the latest version of NI-DAQmx, visit ni.com/support/daq/versions. NI measurement services software
speeds up your development with features including:
A guide to create fast and accurate measurements with no programming using the DAQ Assistant
Automatic code generation to create your application in LabVIEW; LabWindows/CVI; LabVIEW SignalExpress; and Visual Studio .NET, ANSI C/C++, C#, or Visual Basic using Measurement Studio
Multithreaded streaming technology for 1,000 times performance improvements
Automatic timing, triggering, and synchronization routing to make advanced applications easy
More than 3,000 free software downloads to jump-start your project available at ni.com/zone
Software configuration of all digital I/O features without hardware switches/jumpers
Single programming interface for analog input, analog output, digital I/O, and counters on hundreds of multifunction DAQ hardware devices
M Series devices are compatible with the following versions (or later) of NI application software – LabVIEW, LabWindows/CVI, or Measurement Studio versions 7.x or LabVIEW SignalExpress 2.x.
Recommended Accessories
(Mass-Termination Versions)
Signal conditioning is required for sensor measurements or voltage inputs greater than 10 V. NI SCC products, which are designed to increase the performance and reliability of your data acquisition
system, are up to 10 times more accurate than using terminal blocks alone. For more information, visit ni.com/sigcon.
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Ordering Information
For a complete list of accessories, visit the product page on ni.com.
Products
Part Number
Recommended Accessories
Part Number
Board-Only Devices for Embedded Systems and OEM
USB-6255 OEM (Quantity 1)
197201-01
No accessories required.
USB-6251 OEM (Quantity 1)
19492903
194929-01
No accessories
required.
No accessories required.
USB-6259 OEM (Quantity 1)
NI High-Performance M Series Multifunction DAQ for USB
USB-6255 Mass Term
Requires: 2 Cable s, 2 Connector
Block s
7799590P
Connector 0:
Cable: Shielded - SH68-68-EPM Noise Rejecting, Shielded Cable, 1 m
199006-01
**Also Available: Unshielded
Connector Block: Screw Terminal - SCB-68 Shielded I/O Connector Block for DAQ Devices
**Also Available: Unshielded, BNC Termination
Connector 1:
Cable: Shielded - SH68-68-S Noise Rejecting, Shielded Cable, 1m
2/18
776844-01
40
185262-01
www.ni.com
**Also Available: Unshielded
Connector Block: Shielded - SCB-68 Shielded I/O Connector Block for DAQ Devices
**Also Available: BNC Termination, Unshielded
USB-6255 Screw Term
7799580P
779695-0P
USB-6259 Mass Term
77684401
No accessories required.
Connector 0:
Requires: 2 Cable s, 2 Connector
Block s
Cable: Shielded - SH68-68-EPM Noise Rejecting, Shielded Cable, 1
m
19900601
**Also Available: Unshielded, BNC Termination
776844-01
Connector Block: Shielded - SCB-68 Shielded I/O Connector Block for DAQ Devices
Connector
1:
**Also Available:
Unshielded
Cable: Shielded - SH68-68-EPM Noise Rejecting, Shielded Cable, 1
m
19900601
**Also Available: Unshielded
776844-01
Connector Block: Shielded - SCB-68 Shielded I/O Connector Block for DAQ Devices
No**Also
accessories
required.
Available:
Unshielded, BNC Termination
USB-6259 Screw Term
779628-0P
USB-6251 Screw Term
7796270P
No accessories required.
779694-0P
**Also Available: Unshielded
USB-6251 Mass Term
Requires: 1 Cable , 1 Connector Block
Cable: Shielded - SH68-68-EPM Noise Rejecting, Shielded Cable, 1 m
Connector Block: Shielded - SCB-68 Shielded I/O Connector Block for DAQ Devices
199006-01
776844-01
**Also Available: Unshielded, BNC Termination
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Top
Software Recommendations
LabVIEW
Professional
Development System for
Windows
Advanced software tools for large project development
Automatic code generation using DAQ Assistant and
SignalExpress for Windows
Quickly configure projects without programming
Control over 400 PC-based and stand-alone instruments
Instrument I/O Assistant
Log data from more than 250 data acquisition devices
Perform basic signal processing, analysis, and file I/O
Scale your application with automatic LabVIEW code
Tight integration with a wide range of
hardware
Advanced measurement analysis and
digital signal processing
Open connectivity with DLLs, ActiveX, and
.NET objects
generation
Create custom reports or easily export data to LabVIEW,
DIAdem or Microsoft Excel
Capability to build DLLs, executables, and MSI installers
NI LabWindows™/CVI for
Windows
Real-time advanced 2D graphs and charts
NI Measurement Studio
Professional Edition
Complete hardware compatibility with IVI, VISA, DAQ,
GPIB, and serial
Analysis tools for array manipulation, signal processing
Customizable graphs and charts for WPF, Windows
Forms, and ASP.NET Web Forms UI design
Analysis libraries for array operations, signal generation,
windowing, filters, signal processing
Measurement Studio .NET tools (included in
Hardware integration support with native
.NET data
acquisition and instrument control libraries
Automatic code generation for all NIDAQmx data acquisition hardware
LabWindows/CVI Full only)
The mark LabWindows is used under a license from
Intelligent and efficient data-logging libraries for
streaming measurement data to disk
Microsoft Corporation.
Support for Microsoft Visual Studio .NET
2012/2010/2008
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statistics, and curve fitting
Simplified cross-platform communication with
network
variables
Support and Services
Calibration
NI measurement hardware is calibrated to ensure measurement accuracy and verify that the device meets its published specifications. To ensure the ongoing accuracy of your measurement
hardware, NI offers basic or detailed recalibration service that provides ongoing ISO 9001 audit compliance and confidence in your measurements. To learn more about NI calibration services or to
locate a qualified service center near you, contact your local sales office or visit ni.com/calibration.
Technical Support
Get answers to your technical questions using the following National Instruments resources.
Support - Visit ni.com/support to access the NI KnowledgeBase, example programs, and tutorials or to contact our applications engineers who are located in NI sales offices around the world and
speak the local language.
Discussion Forums - Visit forums.ni.com for a diverse set of discussion boards on topics you care about.
41
Online Community - Visit community.ni.com to find, contribute, or collaborate on customer-contributed technical content with users like you.
3/18
www.ni.com
Repair
While you may never need your hardware repaired, NI understands that unexpected events may lead to necessary repairs. NI offers repair services performed by highly trained technicians who
quickly return your device with the guarantee that it will perform to factory specifications. For more information, visit ni.com/repair.
Training and Certifications
The NI training and certification program delivers the fastest, most certain route to increased proficiency and productivity using NI software and hardware.
Training builds the skills to more efficiently develop robust, maintainable applications, while certification validates your knowledge and ability.
Classroom training in cities worldwide - the most comprehensive hands-on training taught by engineers.
On-site training at your facility - an excellent option to train multiple employees at the same time.
Online instructor-led training - lower-cost, remote training if classroom or on-site courses are not possible.
Course kits - lowest-cost, self-paced training that you can use as reference guides.
Training memberships and training credits - to buy now and schedule training later. Visit
ni.com/training for more information.
Extended Warranty
NI offers options for extending the standard product warranty to meet the life-cycle requirements of your project. In addition, because NI understands that your requirements may change, the
extended warranty is flexible in length and easily renewed. For more information, visit ni.com/warranty.
OEM
NI offers design-in consulting and product integration assistance if you need NI products for OEM applications. For information about special pricing
and services for OEM customers, visit ni.com/oem.
Alliance
Our Professional Services Team is comprised of NI applications engineers, NI Consulting Services, and a worldwide National Instruments Alliance Partner program of more than 700 independent
consultants and integrators. Services range from start-up assistance to turnkey system integration. Visit ni.com/alliance.
Back to Top
Detailed Specifications
Specifications listed below are typical at 25 °C unless otherwise noted. Refer to the M Series User Manual for more
information about NI 625x devices.
Analog Input
Number of
channels
NI 6250/6251
8 differential or 16 single ended
NI
6254/6259
NI
6255
ADC
resolution
16 differential or 32 single
ended
40 differential or 80 single
ended
16
bits
IN
L
Sampling
rate
Refer to the AI Absolute Accuracy Table
DNL
No missing codes guaranteed
Maximum
1.25 MS/s single channel,
NI
6250/6251/6254/625
9
NI
6255
1.00 MS/s multi-channel (aggregate)
1.25 MS/s single channel
750 kS/s multi-channel (aggregate)
Minimum
No minimum
Timing
accuracy
Timing
resolution
Input
coupling
Input
range
Maximum working voltage for analog inputs (signal +
common mode)
50 ppm of sample
rate
50
ns
D
C
±10 V, ±5 V, ±2 V, ±1 V, ±0.5 V, ±0.2
V, ±0.1 V
±11 V of AI
GND
Input
impedance
Device
on
AI+ to AI
GND
>10 GΩ in parallel with
100 pF
CMRR (DC to 60 Hz)
100 dB
42
>10 GΩ in parallel with 100 pF
AI- to AI GND
4/18
www.ni.com
Device
off
AI+ to AI
GND
AI- to AI
GND
820
Ω
820
Ω
Input bias current
±100 pA
Crosstalk (at 100 kHz)
Adjacent channels
-75 dB
Non-adjacent
channels
-90 dB1
Small signal bandwidth (-3 dB)
1.7 MHz
Input FIFO size
4,095 samples
Scan list
memory
Data
transfers
PCI/PCIe/PXI/PXIe
devices
USB
devices
Overvoltage protection (AI <0..79>, AI SENSE, AI
SENSE 2)
4,095
entries
DMA (scatter-gather), interrupts,
programmed I/O
USB Signal Stream,
programmed I/O
Device on
±25 V for up to four AI pins
Device off
±15 V for up to four AI pins
Input current during overvoltage
condition
±20 mA max/AI
pin
1 For USB-6255 devices, channel AI <0..15> crosstalk to channel AI <64..79> is -67 dB; applies to channels with 64-channel separation, for example, AI ( x) and AI (x + 64).
Settling Time for Multichannel Measurements
NI 6250/6251/6254/6259
±60
±15
ppm ppm
of
Range
of
Step Step
(±4 (±1
LSB LSB
for for
Full Full
Scale Scale
Step) Step)
±10 V,
±5 V,
1 µs
±2 V,
1.5
µs
±1 V
±0.5
V
±0.2
V,
±0.1
V
NI
6255
Range
2 µs 8
±60 ppm of Step (±4 LSB for Full Scale Step)
±10 V, ±5 V, ±2 V, ±1 V
1.3 µs
±0.5 V
1.8 µs
±0.2 V, ±0.1 V
1.5
2
µs µs
µs
±15 ppm of Step (±1 LSB for Full Scale Step)
1.6 µs
2.5 µs
3 µs
8 µs
Typical Performance Graphs
43
5/18
www.ni.com
Analog Triggers
Number of
triggers
Sourc
e
1
NI 6250/6251
AI <0..15>, APFI 0
NI
6254/6259
NI
6255
AI <0..31>, APFI
<0..1>
AI <0..79>,
APFI 0
Start Trigger, Reference Trigger, Pause Trigger, Sample Clock,
Convert Clock, Sample Clock Timebase
Functions
Source level
AI
<0..79>
±full
scale
±10
V
APFI <0..1>
Resolution
10 bits, 1 in 1,024
Analog edge triggering, analog edge triggering with hysteresis, and
analog window triggering
Modes
Bandwidth (-3 dB)
AI <0..79>
3.4 MHz
APFI
<0..1>
Accura
cy
APFI <0..1>
characteristics
3.9
MHz
±1
%
Input impedance
10 kΩ
Coupling
DC
Protection
Power
on
Power
off
±30
V
±15
V
Analog Output
44
Number of
channels
NI
6250/6254
0
6/18
www.ni.com
NI 6251/6255
2
NI 6259
4
DAC
resolution
DN
L
Monotonic
ity
16
bits
±1
LSB
16 bit
guaranteed
Accuracy
Refer to the AO Absolute Accuracy Table
Maximum update rate
1 channel
2.86 MS/s
2
channels
3
channels
4
channels
Timing
accuracy
Timing
resolution
2.00
MS/s
1.54
MS/s
1.25
MS/s
50 ppm of sample
rate
50
ns
Output coupling
DC
Output impedance
0.2 Ω
Output current
drive
±5
mA
Overdrive
current
Power-on
state
20
mA
±5
mV2
Power-on glitch
1.5 V peak for 1.5 s
Output FIFO
size
Data
transfers
8,191 samples shared among
channels used
PCI/PCIe/PXI/PXIe devices
DMA (scatter-gather), interrupts, programmed I/O
USB devices
USB Signal Stream, programmed I/O
Output range
±10 V, ±5 V, ±external reference on APFI <0..1>
Overdrive protection
±25 V
AO waveform modes:
Non-periodic waveform
Periodic waveform regeneration mode from onboard FIFO
Periodic waveform regeneration from host buffer including
Settling time, full scale step 15 ppm (1 LSB)
dynamic update
2 µs
Slew
rate
Glitch energy at midscale transition,
±10 V range
20
V/µs
Magnitude
10 mV
Duratio
1
n
µs
For all USB-6251/6259 Screw Terminal devices, when powered on, the analog output signal is not defined until after
USB configuration is complete.
2
External Reference
APFI <0..1>
characteristics
Input
impedance
Couplin
g
10
kΩ
D
C
Power
on
Power
off
Rang
e
±30
V
±15
V
±11
V
Protection
Slew rate
20 V/µs
45
7/18
www.ni.com
Calibration (AI and AO)
Recommended warmup time
Calibration
interval
15
minutes
2
years
AI Absolute Accuracy Table
Nominal Range
Positive
Full Scale
Residual
Gain Error
(ppm of
Reading)
Negative
Full Scale
10
5
2
1
0.5
0.2
0.1
-10
-5
-2
-1
- 0.5
- 0.2
- 0.1
Gain
Tempco
(ppm/°C)
60
70
70
80
90
130
150
13
13
13
13
13
13
13
Reference
Tempco
Residual
Offset Error
(ppm of
Range)
1
1
1
1
1
1
1
Offset Tempco
(ppm of
Range/°C)
20
20
20
20
40
80
150
Absolute
INL
Error
(ppm
of
Range)
21
21
24
27
34
55
90
Random
Noise,
σ (µVrms)
60
60
60
60
60
60
60
280
140
57
32
21
16
15
Accuracy at
Full Scale1 (µV)
1,920
1,010
410
220
130
74
52
Sensitivity2
(µV)
112.0
56.0
22.8
12.8
8.4
6.4
6.0
Accuracies listed are valid for up to two years from the device external calibration.
AbsoluteAccuracy = Reading · (GainError) + Range · (OffsetError) + NoiseUncertainty
GainError = ResidualAIGainError + GainTempco · (TempChangeFromLastInternalCal) + ReferenceTempco · (TempChangeFromLastExternalCal)
OffsetError = ResidualAIOffsetError + OffsetTempco · (TempChangeFromLastInternalCal) + INL_Error
1
Absolute accuracy at full scale on the analog input channels is determined using the following assumptions:
TempChangeFromLastExternalCal = 10 °C
TempChangeFromLastInternalCal = 1 °C
number_of_readings
=
100
CoverageFactor = 3 σ
For example, on the 10 V range, the absolute accuracy at full scale is as follows:
GainError = 60 ppm + 13 ppm · 1 + 1 ppm · 10
GainError = 83 ppm
OffsetError = 20 ppm + 21 ppm · 1 + 60 ppm
OffsetError = 101 ppm
AbsoluteAccuracy = 10 V · (GainError) + 10 V · (OffsetError) + NoiseUncertainty AbsoluteAccuracy = 1920 µV
2 Sensitivity is the smallest voltage change that can be detected. It is a function of noise.
AO Absolute Accuracy Table
Nominal Range
Positive
Negative
Residual Gain
Error (ppm of
Full Scale
Full Scale
Reading)
Gain
Tempco
(ppm/°C)
Reference
Tempco
Residual
Offset Error
Offset
Tempco (ppm
INL
Error (ppm
(ppm of
of Range/°C)
of Range)
Absolute Accuracy at
Full
Scale1 (µV)
Range)
10
-10
75
17
1
40
2
64
2,080
5
-5
85
8
1
40
2
64
1,045
8/18
46
www.ni.com
1 Absolute
Accuracy at full scale numbers is valid immediately following internal calibration and assumes the device is operating
within 10 °C of the last external calibration.
Accuracies listed are valid for up to two years from the device external calibration.
AbsoluteAccuracy = OutputValue · (GainError) + Range · (OffsetError)
GainError = ResidualGainError + GainTempco · (TempChangeFromLastInternalCal) + ReferenceTempco ·
(TempChangeFromLastExternalCal)
OffsetError = ResidualOffsetError + AOOffsetTempco · (TempChangeFromLastInternalCal) + INL_Error
Digital I/O/PFI
Static Characteristics
Number of
channels
NI
6250/6251/625
NI
5
6254/6259
24 total, 8 (P0.<0..7>), 16 (PFI <0..7>/P1, PFI
<8..15>/P2)
48 total, 32 (P0.<0..31>), 16 (PFI <0..7>/P1, PFI
<8..15>/P2)
Direction control
Each terminal individually programmable as input or output
Pull-down resistor
50 kΩ typ, 20 kΩ min
Ground reference
D GND
Input voltage protection3
±20 V on up to two
pins
Stresses beyond those listed under Input voltage protection may cause permanent
damage to the device.
3
Waveform Characteristics (Port 0 Only)
Terminals
used
NI 6250/6251/6255
Port 0 (P0.<0..7>)
NI 6254/6259
Port 0 (P0.<0..31>)
Port/sample size
NI
6250/6251/625
NI
5
6254/6259
Up to 8
bits
Up to 32
bits
Waveform generation (DO) FIFO
2,047 samples
Waveform acquisition (DI)
FIFO
DI Sample Clock
frequency
PCI/PCIe/PXI/PXIe
devices
2,047
samples
0 to 10 MHz4
0 to 1 MHz system
dependent4
USB devices
DO Sample Clock frequency
PCI/PCIe/PXI/PXIe devices
Regenerate from FIFO
0 to 10 MHz
Streaming from
memory
0 to 1 MHz system
dependent4
USB devices
Regenerate from FIFO
0 to 10 MHz
Streaming from
memory
0 to 1 MHz system
dependent4
Data transfers
PCI/PCIe/PXI/PXIe devices
DMA (scatter-gather), interrupts, programmed I/O
USB
devices
USB Signal Stream,
programmed I/O
Any PFI, RTSI, AI Sample or Convert Clock, AO Sample Clock, Ctr n
Internal Output, and many other signals
DO or DI Sample Clock source5
4 Performance can be dependent on bus latency and volume of bus activity.
5
The digital subsystem does not have its own dedicated internal timing engine. Therefore, a sample clock must be provided from another subsystem
on the device or an external source.
PFI/Port 1/Port 2 Functionality
Functionality
Static digital input, static digital output, timing input, timing output
Timing output
sources
Many AI, AO, counter, DI, DO timing
signals
9/18
47
www.ni.com
Debounce filter settings
125 ns, 6.425 µs, 2.56 ms, disable; high and low transitions; selectable per input
Recommended Operation Conditions6
Level
Min
Input high voltage (VIH)
2.2 V
Input low voltage (VIL)
0V
Output high current (IOH)
P0.<0..31>
PFI <0..15>/P1/P2
Output low current (IOL)
P0.<0..31>
PFI <0..15>/P1/P2
Max
5.25 V
0.8 V
—
—
-24 mA
-16 mA
—
—
24 mA
16 mA
Electrical Characteristics
Level
Min
—
Positive-going threshold (VT+)
Negative-going threshold (VT-)
Delta VT hysteresis (VT+ - VT-)
Max
2.2 V
0.8 V
—
0.2 V
—
IIL input low current (Vin = 0 V)
—
-10 µA
IIH input high current (Vin = 5 V)
—
250 µA
Digital I/O Characteristics6
6
On earlier versions of the USB-6251 Screw Terminal (part numbers 194929A/B/C-0x) and the USB-6259 Screw Terminal (part numbers
194021B/C-0x), the digital I/O characteristics of P0.<16..31> match the characteristics of PFI <0..15>. Refer to the November 2006 version of the
NI 625x Specifications (part number 371291G-01) for more details.
General-Purpose Counter/Timers
Number of counter/timers
2
Resoluti
on
32
bits
10/18
48
www.ni.com
Counter measurements
Edge counting, pulse, semi-period, period, two-edge separation
Position measurements
X1, X2, X4 quadrature encoding with Channel Z reloading; two-pulse encoding
Output
applications
Internal base
clocks
External base clock
frequency
Pulse, pulse train with dynamic updates, frequency division,
equivalent time sampling
80 MHz, 20 MHz, 0.1
MHz
0 MHz to 20
MHz
Inputs
Gate, Source, HW_Arm, Aux, A, B, Z, Up_Down
Routing options for inputs
Any PFI, RTSI, PXI_TRIG, PXI_STAR, analog trigger, many internal signals
FIF
O
Data
transfers
2
samples
Base clock accuracy
50 ppm
PCI/PCIe/PXI/PXIe devices
Dedicated scatter-gather DMA controller for each counter/timer;
interrupts, programmed I/O
USB
devices
USB Signal Stream,
programmed I/O
Frequency Generator
Number of channels
1
Base clocks
10 MHz, 100 kHz
Divisor
s
Base clock
accuracy
1 to
16
50
ppm
Output can be available on any PFI or RTSI terminal.
Phase-Locked Loop (PLL)
Number of
PLLs
Reference
signal
1
PXI_STAR, PXI_CLK10, RTSI
<0..7>
80 MHz Timebase; other signals derived from 80 MHz Timebase including 20 MHz and
100 kHz Timebases
Output of PLL
External Digital Triggers
Sourc
e
Polarit
y
Any PFI, RTSI, PXI_TRIG,
PXI_STAR
Software-selectable for most
signals
Analog input function
Start Trigger, Reference Trigger, Pause Trigger, Sample Clock, Convert Clock, Sample
Clock Timebase
Analog output
function
Counter/timer
functions
Start Trigger, Pause Trigger, Sample Clock, Sample
Clock Timebase
Gate, Source, HW_Arm, Aux, A, B, Z,
Up_Down
Digital waveform acquisition (DI) function
Sample Clock
Digital waveform generation (DO) function
Sample Clock
Device-To-Device Trigger Bus
PCI/PCIe devices
RTSI <0..7>7
PXI/PXIe devices
PXI_TRIG <0..7>, PXI_STAR
USB devices
None
Output
10 MHz Clock; frequency generator output; many
selections
internal signals
Debounce filter
125 ns, 6.425 µs, 2.56 ms, disable; high and low transitions;
settings
selectable per input
7 In other sections of this document, RTSI refers to RTSI <0..7> for PCI/PCIe devices or PXI_TRIG
<0..7> for PXI/PXIe devices.
Bus Interface
PCI/PXI devices
3.3 V or 5 V signal environment
PCIe devices
Form
factor
Slot
compatibility
x1 PCI Express, specification v1.0a
compliant
x1, x4, x8, and x16 PCI
Express slots 8
11/18
49
www.ni.com
PXIe devices
Form factor
x1 PXI Express peripheral module, specification rev 1.0 compliant
Slot
compatibility
x1 and x4 PXI Express or PXI Express
hybrid slots
USB devices
USB 2.0 Hi-Speed or full-speed9,10
DMA channels (PCI/PCIe/PXI/PXIe devices)
6, analog input, analog output, digital input, digital output, counter/timer 0, counter/timer 1
USB Signal Stream (USB devices)
4, can be used for analog input, analog output, digital input, digital
output, counter/timer 0, counter/timer 1
All PXI-625x devices support one of the following
features:
May be installed in PXI Express hybrid slots
Table 1. PXI/SCXI Combo and PXI Express Chassis Compatibility
Or,
may be used to control SCXI in PXI/SCXI
M Serieschassis
Device
M Series Part Number
combo
PXI-6250
SCXI Control in PXI/SCXI Combo Chassis
PXI Express Hybrid Slot Compatible
191325D-04/191325E-04L
No
Yes
191325D-03/191325E-03L
No
Yes
191325D-13/191325E-13L
Yes
No
PXI-6254
191325D-02/191325E-03L
No
Yes
PXI-6255
193618A-01
No
Yes
191325D-01/191325E-01L
No
Yes
191325D-11/191325E-11L
Yes
No
191325C-0x 191325B-0x
Yes
No
PXI-6251
PXI-6259
Earlier versions of PXI-6251/ 6254/6259
All NI PXIe-625x devices may be installed in PXI Express slots or PXI Express hybrid slots.
8
Some motherboards reserve the x16 slot for graphics use. For PCI Express guidelines, refer to ni.com/pciexpress.
9 If you are using a USB M Series device in full-speed mode, device performance will be lower and you will not be able to achieve maximum sampling/update rates.
10 Operating on a full-speed bus may result in lower high-speed full-speed performance.
Power Requirements
Current draw from bus during no-load
condition11
PCI/PXI devices
+5 V
0.03 A
+3.3
V
0.725
A
+12 V
0.35 A
PCIe devices
+3.3 V
0.925 A
+12
V
PXIe
devices
0.35
A
+3.3 V
0.45 A
+12
V
Current draw from bus during AI and AO overvoltage
condition 11
0.5
A
PCI/PXI devices
+5 V
0.03 A
+3.3
V
+12
V
PCIe
devices
1.2
A
0.38
A
+3.3 V
1.4 A
+12
V
0.38
A
+3.3
V
0.48
A
PXIe devices
+12 V
0.71 A
Caution USB-625x devices must be powered with NI offered AC adapter or a National Electric Code (NEC) Class 2 DC source that meets the power requirements
for the device and has appropriate safety certification marks for country of use.
11 to 30 VDC, 20 W, locking or non-locking power jack with 0.080" diameter center pin,
USB power supply
requirements
11 Does not include P0/PFI/P1/P2 and +5 V
terminals.
5/16-32 thread for locking collars
12/18
50
www.ni.com
Power Limits
Caution Exceeding the power limits may cause unpredictable behavior by the device and/or PC/chassis.
PCI
devices
+5 V terminal
(connector 0)
+5 V terminal
(connector 1)
1 A max12
1 A max12
PCIe devices
Without disk drive power connector installed
+5 V terminals
combined
0.35 A
max12
P0/PFI/P1/P2 and +5 V terminals combined
0.39 A max
With disk drive power connector installed
1 A max12
+5 V terminal
(connector 0)
1 A max12
+5 V terminal (connector 1)
P0/PFI/P1/P2
combined
PXI/PXIe
devices
0.39 A
max
+5 V terminal (connector 0)
1 A max12
+5 V terminal (connector 1)
1 A max12
P0/PFI/P1/P2 and +5 V terminals
combined
2A
max
+5 V terminal
1 A max12
P0/PFI/P1/P2 and +5 V terminals
combined
2A
max
USB devices
Power supply fuse
2 A, 250 V
12
Has a self-resetting fuse that opens when current exceeds this
specification.
Physical Requirements
Printed circuit board dimensions
NI PCI-6250/6251/6254/6255/6259
9.7 × 15.5 cm (3.8 × 6.1 in.)
NI PCIe6251/6259
NI PXI/PXIe6250/6251/6254/6255/6259
9.9 × 16.8 cm (3.9 × 6.6 in.) (halflength)
Standard 3U
PXI
NI USB-6251/6255/6259 Screw
Terminal
26.67 × 17.09 × 4.45 cm (10.5 × 6.73 ×
1.75 in.)
NI USB-6251/6259 BNC
28.6 × 17 × 6.9 cm (11.25 × 6.7 × 2.7 in.)
Enclosure dimensions (includes connectors)
NI USB-6251/6255/6259 Mass
Termination
NI USB-6251/6255/6259
OEM
Weig
ht
18.8 × 17.09 × 4.45 cm (7.4 × 6.73 ×
1.75 in.)
Refer to the NI USB-622x/625x OEM User Guide
NI PCI-6250
142 g (5 oz)
NI PCI-6251
149 g (5.2 oz)
NI PCI6254
NI PCI6255
NI PCI6259
152 g (5.3
oz)
164 g (5.8
oz)
162 g (5.6
oz)
NI PCIe-6259
175 g (6.1 oz)
NI PXI6250
NI PXI6251/6254
212 g (7.5
oz)
222 g (7.8
oz)
NI PXI-6259
233 g (8.2 oz)
NI PCIe-6251
161 g (5.7 oz)
NI PXI-6255
236 g (8.3 oz)
13/18
51
www.ni.com
NI PXIe-6251
208 g (7.3 oz)
NI PXIe-6259
221 g (7.8 oz)
NI USB-6251 Screw
Terminal
NI USB-6255/6259 Screw
Terminal
NI USB-6251/6255/6259 Mass
Termination
1.2 kg (2 lb 10
oz)
1.24 kg (2 lb 11
oz)
816 g (1 lb 12.8
oz)
NI USB-6255/6259 OEM
172 g (6.1 oz)
NI USB-6251 OEM
140 g (4.9 oz)
I/O connector
NI PCI/PCIe/PXI/PXIe6250/6251
NI PCI/PCIe/PXI/PXIe6254/6255/6259
NI USB-6251 Screw
Terminal
NI USB-6255/6259 Screw
Terminal
NI USB-6251
BNC
1 68-pin
VHDCI
2 68-pin
VHDCI
64 screw
terminals
128 screw
terminals
21 BNCs and 30 screw
terminals
NI USB-6251 Mass Termination
1 68-pin SCSI
NI USB-6255/6259 Mass Termination
2 68-pin SCSI
NI USB-6259 BNC
32 BNCs and 60 screw terminals
Disk drive power connector (PCIe
devices)
Standard ATX peripheral connector (not
serial ATA)
USB-6251/6255/6259 Screw Terminal/USB-6251/6259 BNC screw terminal
wiring
16-28 AWG
Maximum Working Voltage13
NI 6250/6251/6254/6255/6259
channel-to-earth
11 V, Measurement
Category I
Caution Do not use for measurements within Categories II, III, or IV.
13
Maximum working voltage refers to the signal voltage plus the
common-mode voltage.
Environmental
Operating temperature
PCI/PXI/PXIe devices
0 to 55 °C
PCIe
devices
USB
devices
0 to 50
°C
0 to 45
°C
Storage temperature
-20 to 70 °C
Humidity
10 to 90% RH, noncondensing
Maximum
altitude
2,000
m
Pollution Degree (indoor use only)
2
Shock and Vibration (PXI/PXIe Devices Only)
30 g peak, half-sine, 11 ms pulse
(Tested in accordance with IEC-60068-2-27. Test profile developed in
accordance with MIL-PRF-28800F.)
Operational
shock
Random
vibration
5 to 500 Hz, 0.3 grms
Operating
5 to 500 Hz, 2.4 grms
Nonoperating
(Tested in accordance with IEC-60068-2-64. Nonoperating test profile exceeds the
requirements of MIL-PRF-28800F, Class 3.)
Safety
This product is designed to meet the requirements of the following standards of safety for electrical equipment for measurement, control, and
laboratory use:
52
IEC 61010-1, EN 61010-1
UL 61010-1, CSA 61010-1
Note For UL and other safety certifications, refer to the product label or visit ni.com/certification, search by model number or product line, and click
the appropriate link in the Certification column.
14/18
www.ni.com
Electromagnetic Compatibility
This product is designed to meet the requirements of the following standards of EMC for electrical equipment for measurement,
control, and laboratory use:
EN 61326 EMC requirements; Minimum
Immunity EN 55011 Emissions; Group
1, Class A
CE, C-Tick, ICES, and FCC Part 15 Emissions; Class A
CE Compliance
Note For EMC compliance, operate this device with shielded cables.
This product meets the essential requirements of applicable European Directives, as amended for CE marking, as follows:
73/23/EEC; Low-Voltage Directive (safety)
89/336/EEC; Electromagnetic Compatibility Directive (EMC)
Note Refer to the Declaration of Conformity (DoC) for this product for any additional regulatory compliance information. To obtain the DoC for this
product, visit ni.com/certification, search by model number or product line, and click the appropriate link in the Certification column.
Environmental Management
National Instruments is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our
products is beneficial not only to the environment but also to NI customers.
For additional environmental information, refer to the NI and the Environment Web page at ni.com/environment. This page contains the environmental regulations and directives with which NI
complies, as well as other environmental information not included in this document.
Waste Electrical and Electronic Equipment (WEEE)
At the end of their life cycle, all products must be sent to a WEEE recycling center. For more information about WEEE recycling centers and National Instruments WEEE initiatives, visit
ni.com/environment/weee.htm.
Back to Top
53
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Pinouts/Front Panel Connections
NI USB-6251 Screw Terminal
Pinout
54
16/18
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NI USB-6255 Screw Terminal Pinout
55
17/18
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NI USB-6259 Screw Terminal
Pinout
Back to
Top
©2008 National Instruments. All rights reserved. CVI, LabVIEW, Measurement Studio, National Instruments, NI, ni.com, NI CompactDAQ, NI SoftMotion, SCXI, and SignalExpress are trademarks of National Instruments. The mark
LabWindows is used under a license from Microsoft Corporation. Windows is a registered trademark of Microsoft Corporation in the United States and other countries. Other product and company names listed are trademarks or trade
names of their respective companies.
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roduct
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upport
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L
M35
SNIS159D – AUGUST 1999 – REVISED
w
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OCTOBER 2013
LM35 Precision Centigrade Temperature
Sensors
DESCRI
FEA
TURES• Calibrated Directly in ° Celsius
(Centigrade)
•
Linear + 10 mV/°C Scale
•
Factor 0.5°C Ensured Accuracy (at
•
+25°C)
• Rated for Full −55°C to +150°C
Range
• Suitable for Remote Applications
• Low Cost Due to Wafer-Level
Trimming Operates from 4 to 30 V
•
Less than 60-μA Current
•
Drain Low Self-Heating, 0.08°C in
Still • Air Nonlinearity Only ±¼°C
Typical
•
Low Impedance Output, 0.1 Ω for 1
mA Load
+VS
(4 V
PTION
The LM35 series are precision integratedcircuit temperature sensors, with an output voltage
linearly proportional to the Centigrade temperature.
Thus the LM35 has an advantage over linear
temperature sensors calibrated in ° Kelvin, as the
user is not required to subtract a large constant
not require
any external
or
voltage LM35
from does
the output
to obtain
convenient
calibration
to provide typical accuracies at
Centigrade trimming
scaling. The
of ±¼°C room temperature and ±¾°C over a to
full −55°C
by
+150°C
range.
Lowwafer
cost level.
is
trimming temperature
and calibration
at the
assured
The
low output impedance, linear output, and precise
inherent calibration of the LM35 make interfacing to
readout or control circuitry especially easy. The
device is used with single power supplies, or with
plus and minus supplies. As the LM35 draws only
60 μA from the supply, it has very low self-heating
of less than 0.1°C in still air. The LM35 is rated to
operate over a −55°C to +150°C temperature range,
while the LM35C is rated for a −40°C to +110°C
range (−10° with improved accuracy). The LM35
series is available packaged in hermetic TO
transistor packages, while the LM35C, LM35CA,
and LM35D are also available in the plastic TO-92
transistor package. The LM35D is also available in
an 8-lead surface-mount small- outline package and
a plastic TO-220 package.
+
VS
to 20 V)
OUTPUT
0 mV + 10.0
L
M35
M35
mV/°C
Figure 1. Basic Centigrade Temperature Sensor
(+2°C to +150°C)
V
L
OUT
R
1
t
Choose R1 = –VS / 50 µA VS
VOUT = 1500 mV at 150°C
VOUT = 250 mV at 25°C
VOUT = –550 mV at –55°C
Figure 2. Full-Range Centigrade Temperature
Sensor
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of
publication date. Products conform to specifications per the terms
of the Texas Instruments standard warranty. Production processing
does not necessarily include testing of all parameters.
57
Copyright © 1999–2013, Texas Instruments
Incorporated
L
M35
SNIS159D – AUGUST 1999 – REVISED
w
ww.ti.com
OCTOBER 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive
foam during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION
DIAGRAMS
METAL CAN PACKAGE
TO (NDV)
V
+
VS
SMALL-OUTLINE MOLDED
PACKAGE SOIC-8 (D)
TOP VIEW
OUT
G
t
ND
Case is connected to negative pin
(GND)
UT
1
2
8
7
N.C.
3
6
GND
4
5
N.C. = No
connection
PLASTIC PACKAGE
TO-220 (NEB)
PLASTIC
PACKAGE TO-92
(LP) BOTTOM VIEW
VS
VOUT
N.C.
+
VS
N
.C.
N
.C.
N
.C.
+ VO
GND
LM
35DT
+
VS
G
OUT
V
Tab is connectedND
to the negative pin
(GND).
NOTE: The LM35DT pinout is different
than the discontinued LM35DP
2
58
Submit Documentation
Feedback
Copyright © 1999–2013, Texas Instruments
Product Folder Links:
LM35
Incorporated
L
M35
SNIS159D – AUGUST 1999 – REVISED
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ABSOLUTE
OCTOBER 2013
MAXIMUM
MIN
RATINGS (1) (2)
U
Supply voltage
–0.2
35
MAX
Output voltage
–1
6
V
10
mA
Output current
Electrostatic discharge (ESD) susceptibility (3)
Storage temperature
Lead temperature
2500
TO Package
–60
180
TO-92 Package
–60
150
TO-220 Package
–65
150
SOIC-8 Package
–65
150
TO Package (soldering, 10 seconds)
V
°C
300
TO-92 and TO-220 Package (soldering, 10 seconds)
260
SOIC Package
220
Infrared (15 seconds)
Vapor phase (60 seconds)
°C
215
Specified operating temperature LM35, LM35A
range: TMIN to TMAX (4)
LM35C, LM35CA
LM35D
(
1
()
2
)(
3
)
(
4
)
V
NIT
–55
150
–40
110
0
100
°C
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions. See Note 1.
Human body model, 100 pF discharged through a 1.5-kΩ resistor.
Thermal resistance of the TO-46 package is 400°C/W, junction to ambient, and 24°C/W junction to case. Thermal resistance of the TO92 package is 180°C/W junction to ambient. Thermal resistance of the small outline molded package is 220°C/W junction to ambient.
Thermal resistance of the TO-220 package is 90°C/W junction to ambient. For additional thermal resistance information see table in the
APPLICATIONS section.
ELECTRICAL
L
(1) (2)
CHARACTERISTICS
PARAM
ETER
TEST
CONDITIONS
TA = 25°C
Accuracy (5)
TA = –10°C
±0.5
±0.4
TA = TMIN
±0.4
Sensor gain
(average slope)
TMIN ≤ TA ≤ TMAX
(
1
)
(
2
)
(
(3
5
)
)(
6
4
)(
7
)
±0.2
TA = TMAX
TMIN ≤ TA ≤ TMAX
Line regulation (7)
TESTED
M35A
LIMIT (3)
DESIGN
LIMIT (4)
±0.3
Nonlinearity (6)
Load regulation (7)
0 ≤ IL ≤ 1 mA
TYP
L
TYP
TESTED
M35CA
LIMIT (3)
±0.2
±0.5
±0.3
±1
±0.4
±1
±1
±0.35
±1.5
±0.15
+10 +9.9,
+10
+
±0.4
TA = 25°C
T
IN
≤ T ≤ MT
A
M
AX25°C
TA =
4 V ≤ VS ≤ 30 V
±0.01
±0.4
±3
±0.05
±0.02
±0.3
+9.9,
°C
mV/°C
+10.1
±1
10.1
±0.5
°C
±1
±0.4
±0.18
UNITS
DESIGN (MAX.)
(4)
LIMIT
±1
±0.5
±0.01
±0.1
±3
mV/mA
±0.05
±0.02
±0.1
mV/V
Unless otherwise noted, these specifications apply: −55°C ≤ TJ ≤ 150°C for the LM35 and LM35A; −40°C ≤ TJ ≤ 110°C for the
LM35C and LM35CA; and 0°C ≤ TJ ≤ 100°C for the LM35D. VS = 5 Vdc and ILOAD = 50 μA, in the circuit of Figure 2. These
specifications also apply from +2°C to TMAX in the circuit of Figure 1. Specifications in boldface apply over the full rated temperature
range. Specifications in boldface apply over the full rated temperature range.
Tested Limits are ensured and 100% tested in production.
Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
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3
L
M35
SNIS159D – AUGUST 1999 – REVISED
OCTOBER 2013
CHARACTERISTICS(1)(2)
ELECTRICAL
L
(continued)
PARAM
ETER
w
TEST
CONDITIONS
VS = 5 V, 25°C
TYP
TESTED
M35A
LIMIT (3)
56
67
VS = 30 V, 25°C
56.2
4 V ≤ VS ≤ 30 V, 25°C
TYP
TESTED
M35CA
LIMIT (3)
56
67
131
68
UNITS
DESIGN (MAX.)
(4)
LIMIT
91
56.2
133
0.2
S
Temperature
coefficient of
quiescent current
114
68
91.5
1
0.2
µA
116
1
0.5
2
0.5
2
+0.39
+0.5
+0.39
+0.5
µA
µA/°C
Minimum temperature In circuit of Figure 1, IL = 0
for rate accuracy
Long term stability
(8)
1.
DESIGN
LIMIT (4)
105.5
VS = 30 V
4 V ≤ V ≤ 30 V
L
105
VS = 5 V
Quiescent current (8)
Change of quiescent
current (7)
ww.ti.com
TJ = TMAX, for 1000 hours
+1.5
+2
±0.08
+1.5
+2
±0.08
°C
°C
Quiescent current is defined in the circuit of Figure
ELECTRICAL
L
(1) (2)
CHARACTERISTICS
PARAM
ETER
TEST
CONDITIONS
TA = 25°C
Accuracy, LM35,
LM35C (5)
TYP
TESTED
M35
LIMIT (3)
±0.4
±1
TA = –10°C
±0.5
T =T
±0.8
A
MAXTA
Accuracy, LM35D (5)
±1.5
±1.5
±1.5
±0.8
±1.5
±0.8
±2
±0.6
±0.9
±2
TA = TMIN
±0.9
±2
TMIN ≤ TA ≤ TMAX
±0.3
TMIN ≤ TA ≤ TMAX
+10 +9.8,
(
1
)
(
2
)
(
(3
5
)
)(
6
4
)(
7
)
±1
±0.5
TA = TMAX
Sensor gain
(average slope)
±0.5
±0.4
TA = 25°C
T
IN
≤ T ≤ MT
A
±0.2
±0.5
+10
+9.8,
AX25°C
TA =
4 V ≤ VS ≤ 30 V
±0.01
±0.4
±5
±0.1
±0.02
°C
°C
mV/°C
+10.2
±2
10.2
±0.5
M
°C
±1.5
+
Load regulation (7)
0 ≤ IL ≤ 1 mA
UNITS
DESIGN (MAX.)
LIMIT (4)
TA = 25°C
Nonlinearity (6)
Line regulation (7)
TYPLM35D
TESTED
LIMIT (3)
±0.4
±0.8
= TMIN
LM35C,
DESIGN
LIMIT (4)
±2
±0.5
±0.01
±0.2
±5
±0.1
±0.02
±0.2
mV/mA
mV/V
Unless otherwise noted, these specifications apply: −55°C ≤ TJ ≤ 150°C for the LM35 and LM35A; −40°C ≤ TJ ≤ 110°C for the
LM35C and LM35CA; and 0°C ≤ TJ ≤ 100°C for the LM35D. VS = 5 Vdc and ILOAD = 50 μA, in the circuit of Figure 2. These
specifications also apply from +2°C to TMAX in the circuit of Figure 1. Specifications in boldface apply over the full rated temperature
range. Specifications in boldface apply over the full rated temperature range.
Tested Limits are ensured and 100% tested in production.
Design Limits are ensured (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are
not used to calculate outgoing quality levels.
Accuracy is defined as the error between the output voltage and 10 mv/°C times the case temperature of the device, at specified
conditions of voltage, current, and temperature (expressed in °C).
Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated
temperature range of the device.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
4
60
Submit Documentation
Feedback
Copyright © 1999–2013, Texas Instruments
Product Folder Links:
LM35
Incorporated
L
M35
SNIS159D – AUGUST 1999 – REVISED
w
ww.ti.com
ELECTRICAL
CHARACTERISTICS(1)(2)
L
(continued)
PARAM
ETER
Quiescent current (8)
TEST
CONDITIONS
VS = 5 V, 25°C
TYP
TESTED
M35
LIMIT (3)
56
80
105
VS = 5 V
VS = 30 V, 25°C
56.2
4 V ≤ VS ≤ 30 V, 25°C
4 V ≤ V ≤ 30 V
Temperature
coefficient of
quiescent current
(
8
)
(
9
)
TYPLM35D
TESTED
LIMIT (3)
56
161
2
80
91
56.2
138
82
91.5
0.2
UNITS
DESIGN (MAX.)
(4)
LIMIT
µA
141
2
0.5
3
0.5
3
+0.39
+0.7
+0.39
+0.7
µA
µA/°C
Minimum temperature In circuit of Figure 1, IL = 0
for rate accuracy
Long term stability
DESIGN
LIMIT (4)
158
0.2
S
LM35C,
82
105.5
VS = 30 V
Change of quiescent
current (9)
OCTOBER 2013
TJ = TMAX, for 1000 hours
+1.5
±0.08
+2
+1.5
+2
±0.08
°C
°C
Quiescent current is defined in the circuit of Figure 1.
Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
Submit Documentation
Copyright © 1999–2013, Texas Instruments
Incorporated
Product Folder Links:
LM35
Feedback
61
5
Appendix E – Pictures
62
63
64
65
Appendix F – Bill of Materials
Item
Quantity
Part no.
Price per unit ($)
Total ($)
1
779695-01
2,135
2,135
Op-amp
6
TL074CN
.62
3.72
Microphones
5
2.28
11.40
NI USB-6259
Mass Term
Resistor 11K
POM-2246PC33-R
23
n/a
On hand
0
5
n/a
On hand
0
Resistor 1k ohms
5
n/a
On hand
0
Resistor 100
5
n/a
On hand
0
20
n/a
On hand
0
Capacitor 10µF
15
n/a
On hand
0
Capacitor 0.1µF
5
n/a
On hand
0
Capacitor 0.01µF
5
n/a
On hand
0
Power supply
1
n/a
On hand
0
ohms
Resistor 100K
ohms
Resistor 8.2k
ohms
66
References
A. Brutti, M Omologo, and P. Svaizer “Comparison Between Different Sound Localization
Techniques Based on a Real Data Collection”
B. Repp “The sound of Two Hands Clapping: An Exploratory Study”
D. Kim and Y. Chung “Accurate Position Detection Sound Source by LabView”
J. Allanach, J. Borodinsky, and B. Abraham “Impulse Noise Bearing and Amplitude
Measurement and Analysis System (BAMAS)”
J. Valin, F.Michaud, J Rouat, and D. Létourneau “Robust Sound Source Localization Using a
Microphone Array on a Mobile Robot”
K. Nakadai, H. Okuno, and H. Kitano “Real-time Sound Source Localization and Separation
for Robot Audition”
S. Beck, H. Nakasone, and K. Marr “An Introduction to Forensic Gunshot Acoustics”
67