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WITH PURIFIED
DNA ORIGAMI
FROM NORTON
GROUP, CROSS
DESIGN
a
b
a2
WITH RECTANGULAR
ORIGAMI
CONSTRUCT (1.6nM
NOT PURIFIED) FROM
SEEMAN LAB WITH
20NM GOLD
NANOPARTICLES
ATTACHED VIA DNA
OLIGO TETHERS
WITH PURIFIED
DNA ORIGAMI
FROM NORTON
GROUP, CROSS
DESIGN - no
surface
decoration seen
the remainder of the chips not labeled a or
b or a2 are untreated, these areas were
never exposed to anything in our lab
sample iii SiNx
surface with CdS
wires ALD coated
with SiO2 with
APTES
sample iv SiNx
surface with CdS
wires ALD coated
with SiO2 NO
APTES
a
b
a2
iii – SiNx chip surface with CdS nanowires with 3nm of ALD SiO2 and APTES
checked construct on mica
a
WITH PURIFIED
DNA ORIGAMI
FROM NORTON
GROUP, CROSS
DESIGN
cantilever is 115um long
this wire is from the
same chip (iii), but
from an untreated
area, no surface
decoration seen
iii – SiNx chip surface with CdS nanowires with 3nm of ALD SiO2 and APTES
checked construct
on mica
b
WITH
RECTANGULAR
ORIGAMI
CONSTRUCT
(1.6nM NOT
PURIFIED) FROM
SEEMAN LAB WITH
20NM GOLD
NANOPARTICLES
ATTACHED VIA
DNA OLIGO
TETHERS
cantilever is 115um long
full-z scale overview
of wire above
iv – SiNx chip surface with CdS nanowires with 3nm of ALD SiO2 NO APTES
a2
WITH PURIFIED DNA
ORIGAMI FROM
NORTON GROUP, CROSS
DESIGN - NO surface
decoration seen,
apparently APTES is
important for origami to
CdS binding
this wire is from the
same chip (iv), but
from an untreated
area
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