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Generation of distributed electrical and electro-thermal networks with TRADICA Yves Zimmermann CEDIC, Technical University of Dresden 4th European HICUM Workshop June 15/16, 2004 Bordeaux, France 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA OUTLINE • Introduction • Electro-thermal Characteristics • Self-heating Networks • Static Thermal Coupling • Transient Thermal Coupling • Distributed electrical networks • Available Model Complexities • Conclusion • Outlook Yves Zimmermann, CEDIC 1 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Introduction • Shrinking device sizes lead to increased influence of parasitic effects on electrical behavior. • Deep trenches confine the heat flow resulting in higher operating temperatures. • Multi-dimensional effects like avalanche breakdown are difficult to implement in compact models. • Need for accurate models for critical circuits and single devices Yves Zimmermann, CEDIC 2 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Electro-thermal Characteristics • Distinguish two different effects: 1. Self-heating (temperature rise due to power dissipation of a single heat source) and 2. Thermal coupling (temperature rise due to thermal interaction between several heat sources). • Heat source definition: Characteristic volume of integrated devices where heat is generated (e.g. BC-SCR of BJTs) Yves Zimmermann, CEDIC 3 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA PROBLEM-I • Transient thermal characteristic is of complex exponential nature and varies with emitter contact configuration (CBEBC (solid), CBEBEBC (dashed), CBEBEBEC (dotted)). BUT: Compact models use only simple thermal networks (parallel thermal resistance Rth and capacitance Cth)!!! Yves Zimmermann, CEDIC 4 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Self-heating Networks • Common simple „built-in“ network (single RC-element): -t ∆T(t) = P diss ⋅ R th 1 – exp -------------------- R ⋅ C th Pdiss th Rth Cth ∆T • Extended network (multiple RC-elements): Rth1 ∆T(t) = P diss ⋅ n ∑i = 1 thi Cth1 Pdiss Yves Zimmermann, CEDIC Rthn .............. -t R thi 1 – exp ----------------------- R ⋅ C thi Rth2 Cth2 Cthn ∆T 5 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA PROBLEM-II • Multi-emitter BJTs consist of several characteristic heat sources (one per emitter finger). • Temperature distribution across the devices is NOT homogeneous due to thermal coupling resulting in different operating temperatures at the fingers. BUT: Compact models use only ONE ∆T for whole structure!!! 45% Yves Zimmermann, CEDIC 6 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA PROBLEM-II • Thermal coupling (intra- and inter-device) characteristic is NOT covered by compact models. ∆T 1 ∆T 2 ∆T 3 ∆T 4 ∆T 5 dT [K] Heat sources for the multiple internal base-collector junctions 10 9 8 7 6 5 4 3 2 1 14 12 10 0 1 8 2 3 x [µm] Yves Zimmermann, CEDIC 6 4 5 4 6 7 y [µm] 2 8 0 7 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Static Thermal Coupling • Total temperature rises (∆T1, ∆T2) of two interacting sources can be expressed as a sum of both self-heating contributions (∆T11, ∆T22) using thermal coupling coefficients (c21, c12): ∆T 1 = ∆T 11 + c 21 ∆T 22 ∆T 2 = ∆T 22 + c 12 ∆T 11 • Representation using voltage controlled voltage sources (VCVS) [D.J.Walkey]: ∆T1 self-heating device 1 Pdiss1 Rth1 VCVS Yves Zimmermann, CEDIC ∆T2 ∆T11 c12∆T22 ∆T22 c21∆T11 Rth2 self-heating device 2 Pdiss2 VCVS 8 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Transient Thermal Coupling • Time-dependence of coupling coefficient (solid line) is of exponential nature and can be represented using one or multiple RC-elements (dashed line). ∆T 21 ( t ) -t ------------------c 21c ( t ) = = c 21 1 – exp ----------------------------------- ∆T 11 ( t ) R thc21 ⋅ C thc21 Yves Zimmermann, CEDIC 9 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Transient Thermal Coupling • Voltage controlled current sources (VCCS) drive the delay networks for the coupling coefficients. VCVSs add the coupled temperatures to the respective self-heating contributions. • -t ∆T 12 ( t ) = ∆T 22 ( t ) ⋅ c 1 – exp ----------------------------------- R 12 thc12 ⋅ C thc12 -t ∆T 21 ( t ) = ∆T 11 ( t ) ⋅ c 1 – exp ----------------------------------- R 21 thc21 ⋅ C thc21 ∆T1 Pdiss1 Rth1 ∆T2 Cth1 ∆T11 ∆T22 Cth2 ∆T12 VCVS1 VCVS2 c12∆T22 VCCS1 c21∆T11 Rth2 Pdiss2 ∆T21 VCCS2 attenuation of heat wave ∆T12 Rthc12 Cthc12 Cthc21 Rthc21 ∆T21 delay network Yves Zimmermann, CEDIC 10 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Distributed electrical network Finger-partitioning • Every finger is represented by one transistor model. • Distinguish three different types of transistor elements: 1. an outer element Tw containing the collector region 2. a center element Tc bounded by base contacts at each side (does not contain collector region) 3. an outer element Tn bounded by a base contact at one side (does not contain collector region) Tn Yves Zimmermann, CEDIC Tc Tw 11 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Distributed electrical network Finger-partitioning • External collector resistance is partitioned and pulled out of the transistor elements. • Transistor model parameters are calculated from technology data using the respective emitter area portion. rsu S C’n ∆rCx C’c1 ∆rCx S’ B Tn C’ck ∆rCx S’ C’w TcK C S’ S’ Tc1 Csu rCx1 Tw E Yves Zimmermann, CEDIC 12 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Distributed electrical network Finger-partitioning • External access to the thermal nodes ∆T enables contacting thermal (coupling) networks of arbitrary complexity. ∆Tn Pn ∆Tc1 RTH,n TnΣ Yves Zimmermann, CEDIC Pc1 Tw TcK Tc1 Tn E RTH,c1 Tc1Σ ∆Tw ∆TcK PcK RTH,cK Pw TcKΣ RTH,w TwΣ 13 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Distributed electrical network Emitter-partitioning • The equivalent circuit of one emitter is split into external elements and an internal transistor Qi, which is represented by a distributed network rsu S’ S CjS , C BCx CdS ijSC ijBCx Csu iTS ,, C BCx B* CEox C C’ B rBx rCx CjEp ijBEp Qi E’ rE E Yves Zimmermann, CEDIC 14 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Distributed electrical network Emitter-partitioning • The finger (internal transistor Qi) is partitioned and represented by several transistor models. • Distinguish three different types of transistor elements: 1. a generic element Tg bounded by another element in each direction bE/k bE/k lE/n Te Tel lE/n Teb Tg Tg lE/2 2. an edge element Te bounding to other elements on 2 sides 3. edge elements Tel and Teb bounding to other elements on 3 sides bE/k lE/n bE/2 Yves Zimmermann, CEDIC 15 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Distributed electrical network Emitter-partitioning • The internal base resistance is partitioned and pulled out of the transistor element model. • Thermal (coupling) networks can be contacted through access to the thermal nodes ∆T. r knz r kny r 2nz C’ Tkn r 2ny r 1nz T2n r 1ny C’ T1n E’ E’ r k3z B* r k3y Tk3 r 23y r k2z r k2y C’ r 23z r 22y QjCi QdC QjEi QdE B’ r 22z Tk2 ijBCi T23 r 12z T22 r 12y C’ iAVL iT ijBEi T12 E’ E’ C’ r k1z r k1y Tk1 r 31z r 31y r 21z T31 r 21y E’ C’ r 11z T21 r 11y T11 z E’ E’ E’ equivalent circuit of a transistor element (ideal 1-D Transistor model) E’ y Yves Zimmermann, CEDIC 16 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Available Model Complexities electrical representation self-heating („built-in“) self-heating (improved external) thermal coupling (inter-device) thermal coupling (intra-device) HICUM/L2 Cell/Device 1 TM per Device/ Cell X X HICUM/L4 Cell 1 TM per Device X X X HICUM/L4 Finger 1 TM per Finger X X X X HICUM /L4 Emitter 1 TM per Finger- subelement X X X X (TM = transistor model) Yves Zimmermann, CEDIC 17 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Conclusion • Partitioning of emitter fingers enables better simulation of avalanche breakdown. • Derived distributed models covering self-heating and thermal coupling effects. • Implemented scaling equations and extraction routines for the respective parameters. • The approach is based on „fast“ analytic expressions enabling efficient parameter generation. • Established automated network generation of different model complexities. Yves Zimmermann, CEDIC 18 4th European HICUM Workshop, Bordeaux, 2004 Generation of distributed electrical and electro-thermal networks with TRADICA Planned Activities - Outlook • Verification of distributed electrical and electro-thermal networks. • Development of scaling equations for substrate coupling. • Automated generation of distributed models covering substrate coupling. • Development of scaling equations for backend parasitics. • Implementation into existing model generation procedures. • Test and Verification. Yves Zimmermann, CEDIC 19