Download High Density Plasma Sources for Advanced Surface

yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project

Document related concepts
no text concepts found
Product Information
High Density Plasma Sources for
Advanced Surface Processing
Functional principles of plasma sources
Plasma sources apply energy via electric and / or magnetic fields to free
electrons in a low pressure gas and to generate a plasma with defined
properties. Most plasma sources utilize RF or microwave frequencies for
excitation. MicroSystems offers three general types of plasma sources. These
sources are the basis of the MicroSys and AK platforms but are also available
as stand alone products (Tab. 1). Besides the sources described below,
MicroSystems also offers common parallel plate discharge arrangements
including dual frequency excitation.
Plasma sources by MicroSystems
Circular microwave plasma sources – ECR series
Fig. 1: MicroSystems PQ 160 mm ECR source
The PQ 160 ECR and PQ 250 ECR utilize a patented excitation principle. A λ/4 stub antenna feeds the microwave power
from the rear source side via a dielectric window. The microwave field gets superposed by a permanent magnetic field, which
generates conditions for an electron cyclotron resonance (ECR) in a torus like region around the antenna. These sources are
also available with a direct immersed metal antenna and give favorable performance in sputter etching of metals.
Linear microwave plasma sources – LPS series
The patented LPS type microwave sources consist of a partially transparent cylindrical waveguide which are fed from both
sides. The coaxial microwave guide is made of a substantial inner conductor and a quartz tube with circumambient plasma, so
that the preceding wave feeds the discharge. An integrated dual channel gas supply system provides for an optimized plasma
density and homogeneity along the source. These sources are preferably used in inline systems (LPS 1.0) or arranged in arrays
(LPS 2.1), and are the basis for the large area AK processing equipment of MicroSystems.
Inductively coupled RF plasma sources – ICP series
The ICP plasma sources of MicroSystems use patented excitation principle combining a circular coil which is fed by a RF
current combined with a set of ferrites for forming the resulting magnetic field. The magnetic field itself generates in front of a
coupling window a homogeneous and highly dense plasma. The ICP type sources (Fig. 1) are the major basis of the MicroSys
and MicroCluster equipment platforms.
PQ 160 ECR
PQ 250 ECR
Resonant microwave discharge with
stub antenna
LPS 1.0
LPS 2.1
Microwave excitation along
transparent microwave guide
ICP 200
ICP 400
Inductively coupled RF discharge with
planar coil arrangement
160 mm
250 mm
Max 1.3 m
200 mm
400 mm
DN 160
DN 250
Special - Wall mounted
Special 250
Special 450
13.56 MHz
4.00 MHz
1.2 kW
2.0 kW
Source Power
2.45 GHz
800 W
1.2 kW
2x 4 kWCW / 2x 10 kWP
Foced air / Water
Noble gases, N2, H2, O2, Halogen containing gases, Hydorcarbons, SiH4, NH3, N2O, Silicon-organic precursors, TMA
Meyer Burger (Germany) AG - BU MicroSystems
[email protected],
An der Baumschule 6-8, 09337 Hohenstein-Ernstthal, Germany, Phone: +49 3723 671 234
Technical data are subject to change / 12/2014
Related documents