Survey
* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project
* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project
GaAs MMIC ● ● ● ● ● ● ● ● ● ● CGY 50 Single-stage, monolithic microwave IC (MMIC amplifier) Cascadable 50 Ω gain block Application range: 100 MHz to 3 GHz Third order intercept point 30 dBm typical at 1.8 GHz Gain: 8.5 dB typical at 1.8 GHz Low noise figure: 3.0 dB typical at 1.8 GHz Gain control dynamic range 20 dB Ion-implanted planar structure Chip all gold metallization Chip nitride passivation ESD: Electrostatic discharge sensitive device, observe handling precautions! Type Marking CGY 50 G2 1) Ordering Code (tape and reel) Circuit Diagram (Pin Configuration) Q68000-A8370 Package1) SOT-143 For detailed information see chapter Package Outlines. Semiconductor Group 1 07.94 CGY 50 Maximum Ratings Parameter Symbol Values Unit Drain voltage (DC) VD 5.5 V Peak drain voltage (DC + RF) VDp 7.5 Current control gate voltage VG – 3…0 Drain-gate voltage VDG 7.5 Input power1) PIN 16 dBm Total power dissipation, TS ≤ 82 ˚C2) Ptot 400 mW Channel temperature Tch 150 ˚C Storage temperature range Tstg – 40 … + 150 Rth chS ≤ Thermal Resistance Channel - soldering point2) 170 K/W Note: Exceeding any of the maximum ratings may cause permanent damage to the device. Appropriate handling is required to protect the electrostatic-sensitive MMIC against degradation due to excess voltage or excess current spikes. Proper ground connection of leads 1 and 3 (with minimum inductance) is required to achieve the guaranteed RF performance, stable operating conditions and adequate cooling. 1) 2) See application circuit. TS is measured on the source 1 lead at the soldering point to the pcb. Semiconductor Group 2 CGY 50 Electrical Characteristics at TA = 25 ˚C, VG = 0 V, VD = 4.5 V, RS = RL = 50 Ω, unless otherwise specified, (for application circuit see next page). Parameter Symbol Drain current ID Power gain f = 200 MHz f = 1800 MHz G Gain flatness f = 200 to 1000 MHz f = 800 to 1800 MHz ∆G Noise figure f = 200 to 1800 MHz Values Unit min. typ. max. – 60 75 dB – 7.5 10.0 8.5 – – – – 0.4 1.1 – 2 F – 3.0 4.0 Input return loss f = 200 to 1800 MHz RLIN 9.5 12 – Output return loss f = 200 to 1800 MHz RLOUT 9.5 12 – Third order intercept point, two-tone intermodulation test f1= 806 MHz, f2= 810 MHz, P0 = 10 dBm (both carriers) IP3 29 31 – 1 dB gain compression f = 200 to 1800 MHz P1dB – 16 – Gain control dynamic range f = 200 to 1800 MHz ∆G – 20 – Semiconductor Group 3 mA dBm dB CGY 50 Application Circuit f = 800 to 1800 MHz Legend of components C1, C2, C3, C4 Chip capacitors 100 pF Chip capacitors 1 nF L1, L2 Discrete inductor 1 µH or printed microstripline inductor D1 Z diode 5.6 V (type BZW 22 C5 V 6) Note: Operating conditions for PIN max: RG = RL = 50 Ω, C1 max = 220 pF, VD = 4.5 V; VG current limited < 2 mA. Semiconductor Group 4 CGY 50 Total power dissipation Ptot = f (TA; TS) Drain current ID = f (VD) VG = 0 Drain current ID = f (VG) VD = 4.5 V Semiconductor Group 5 CGY 50 Noise figure F = f (f) VD = 4.5 V, VG = 0, RS = RL = 50 Ω Noise figure F = f (VG)* VD = 4.5 V, RS = RL = 50 Ω f = 200 to 1800 MHz Third order intercept point IP3 = f (VD) f = 800 MHz, VG = 0, RS = RL = 50 Ω * The gate voltage VG refers to a typical drain current IDSS of 60 mA with the supplementary information of the ID values. The intermodulation ratio dIM can easily be determined. dIM = 2 (IP3 – P0) IP3 = Intercept point dIM = Intermodulation ratio P0 = Power level of each carrier in dBm Semiconductor Group 6 CGY 50 Power gain G = f (f) VD = 4.5 V, VG = 0, RS = RL = 50 Ω Semiconductor Group Power gain G = f (Pout) VD = 4.5 V, VG = 0, RS = RL = 50 Ω f = 800 MHz 7 CGY 50 Power gain G = f (VG)1) VD = 4.5 V, RS = RL = 50 Ω 1) Power gain G = f (VG)1) VD = 4.5 V, RS = RL = 50 Ω The gate voltage VG refers to a typical drain current IDSS of 60 mA with the supplementary information of the ID values. Semiconductor Group 8 CGY 50 S Parameters f S11 GHz MAG S21 ANG S12 S22 MAG ANG MAG ANG MAG ANG 3.30 3.20 3.17 3.09 3.00 2.90 2.81 2.70 2.60 2.50 2.42 2.33 2.24 2.16 2.07 2.01 1.94 1.87 1.81 1.75 164 158 150 142 134 126 118 111 103 96 94 83 77 71 65 60 54 49 43 38 0.14 0.14 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.12 0.12 0.12 0.12 0.13 0.13 0.13 0.13 0.14 0.14 0.15 5.0 0.0 – 2.0 – 3.0 – 4.0 – 5.0 – 5.0 – 6.0 – 5.0 – 5.0 – 4.0 – 4.0 – 3.0 – 3.0 – 2.0 – 2.0 – 2.0 – 1.0 – 1.0 – 1.0 0.05 0.05 0.08 0.01 0.12 0.14 0.16 0.17 0.18 0.19 0.20 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.20 – 144 – 133 105 91 81 74 68 62 56 51 46 42 39 36 33 30 29 28 27 27 VD = 4.5 V, VG = 0, Z0 = 50 Ω 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 0.25 0.27 0.21 0.20 0.19 0.18 0.18 0.17 0.17 0.17 0.18 0.18 0.19 0.20 0.21 0.22 0.23 0.24 0.26 0.28 – 31 – 34 – 44 – 54 – 65 – 77 – 93 – 103 – 119 – 130 – 141 – 152 – 163 – 172 179 172 162 153 148 142 S21 Semiconductor Group S22 9 CGY 50 S Parameters (continued) VD = 4.5 V, VG = 0, Z0 = 50 Ω S11 Semiconductor Group S12 10