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CHAPTER 5 P5.1. For each problem, restate each Boolean equation into a form such that it can be translated into the p and n-complex of a CMOS gate. a. Out ABC BD ABC BD A B C B D b. Out AB AC BC AB AC BC A B A C B C c. Out A B CD A AB C D A A B CD A A B CD A Vdd Vdd Vdd C Bb Ab Ab Ab A Bb Bb Cb Db Ab Bb Bb D A Cb B Bb Cb C Cb Db Ab A Bb Bb Cb Cb B A D Ab P5.2. C A B A B B C B A A A A Cin A B A B Cout B C B C Sum P5.3. First, convert the equation into its p and n-complex. Out A B C BC AB AB C BC AB AB C BC AB AB C BC AB AB C BC AB AB C B C Vdd Bb Ab A B Bb Cb Cb Bb Cb A Ab B Bb Cb P5.4. The truth table is given below in terms of voltages. The function is F A B A B F 0 0 Vdd 0 VDD 0 VDD 0 0 VDD VDD 0 The worse case VOH is VDD and the worse case VOL is 0V. P5.5. The first circuit is a NOR gate while the second is a NAND gate. The VOL and VOH calculated are for the worst-case scenario. To find this, assume only one transistor turns on, this just reduces to a pseudo-NMOS/PMOS inverter, so the other transistors are not important. a. The VOL for the pseudo-NMOS (in 0.18μm) is: VOL vSAT COX WP VGSP VTP I P ,SAT k N VDD VTN VGSP VTP ECP LP WN vSATWP LN COX VDD VTP 2 WN N COX LN 1 VDD VTN 2 NWN COX VDD VTP ECP LP VDD VTN vSATWP LN VDD VTP 2 NWN VDD VTP ECP LP VDD VTN vSATWP LN VDD VTP 0.1VDD 2 0.1VDD N VDD VTP ECP LP VDD VTN 8 10 0.2 10 0.2 10 1.8 0.5 4 6 4 2 0.1 1.8 270 1.8 0.5 24 0.2 1.8 0.5 0.14μm=1.4 Since the minimum width is 2λ, we make that the width. The VOH for the pseudo-PMOS (in 0.18μm) is: I N sat I P lin vSAT COX WN VGSN VTN VGSN VTN ECN LN P COX WP VSGP VTP VSDP V 2 vSAT COX WN VDD VTN P COX WP VDD 0 VTP 2 VDD VTN ECN LN 2 6 1.8 0.5 1.2 LN 1 EVCPSDPLP 0.2(10 )(8 10 ) 1.8 0.5 4 2 SDP LP 1 2 V DD VOH VDD VOH ECP LP VDD VOH 2 WP (70) 1.8 0.5 0.18 LP 1 0.18 4.8 0.18 2 2 2 WP 4.2 The pseudo-PMOS circuit will have bigger devices than the pseudo-NMOS. P5.6. The steps to solving this question are the same as the pseudo-NMOS question in Chapter 4. a. For VOH, recognize that VGS VT for operation so the output can only be as high as VDD VT . Since VSB 0 , body effect must be taken into account and the full equation is: V VOH VDD VT 0 VDD T0 1.2 0.4 0.2 2 0.88 VSB 2 F 2 F VOH 2 F VOH 0.88 F Iteration produces VOH=0.73V. b. For VOL, we must first recognize that the worst-case VOL occurs when only one of the pull-down transistors is on. Next we identify the regions of operation of the transistors. In this case, the pull-up transistor is always in saturation and the pulldown is most likely in the linear region since it will have a high input (high VGS) and a low output (low VDS). Then, we equate the two currents together and solve for VOL: I1 sat I 2 lin VDS 2 2 W1vsat COX VGS 1 VT 1 W2 N COX VGS 2 VT 2 2 VDS 2 DS 2 VGS 1 VT 1 ECN L L2 1 EVCN L (0.13)(104 )(8 106 ) 1.2 VOL 0.42 (1.2 VOL 0.42) 0.6 2 (1)(270) 1.2 0.4 VOL 2 VOL 1 VOL 0.6 Using a programmable calculator or a spreadsheet program, VOL = 0.205V. The dc current with the output low is: I DS W2 N COX VGS 2 VT 2 VDS2 2 VDS 2 DS 2 L2 1 EVCN L (1)(270)(1.6 106 ) 1.2 0.4 0.205 2 (0.205) 1 0.205 0.6 46.5 A The power with the output low is: P I DSVDD (46.5 A)(1.2V ) 55.8W P5.7. See Example 5.2 which is based on the NAND gate. This question is the same except that it addresses the NOR gate. With both inputs tied together, WN 8 WP 8 WN ECN LN WP ECP LP VS 8 1.2 2 8 4.8 VDD VTP VTN 1 1.8 0.5 2 0.5 1 2 0.77V In the SPICE solution, the reason why the results vary for input A and B is due to bodyeffect. P5.8. The solution is shown below. Notice that there is no relevance with the lengths and widths of the transistors when it comes to VOH, although they the do matter when calculating VOL. Vout VGG VT VGG Vout VT 0 1.8 0.5 0.3 Vout 2 F 2 F 1.8 0.88 0.88 2.51V P5.9. For tPLH, we need to size the pull-up PMOS appropriately. t PLH 0.7 RC 0.7 Reqp Wp 0.7 RSQ L t PLH L CLOAD W CLOAD 0.7 30k 2 50 10 12 100 10 84 15 For VOL: I P sat I P sat WP vsat COX VGS VT 2 VGS VT ECP L 4.2 10 8 10 1.6 10 1.2 0.4 4 WN N COX VOL VTN VOL 2 VOL LN 1 EVCNOLL WN 38.5 WN 77 LN 6 6 1.2 0.4 24 0.1 2 1.08mA WN (270)(1.6 106 ) 1.2 0.4 0.1 2 0.1 0.1 LN 1 0.6 W3 3 77 232 (3 stack ) W2 155 (2 stack ) P5.10. The circuit is shown below: t PLH 0.7 RC REQP WP 0.7 REQP L t PLH CLOAD 0.7 30 103 t PHL RC 0.7 REQN WN 0.7 REQN L t PHL L CLOAD WP 2 50 10 L CLOAD WN CLOAD 0.7 12.5 103 12 75 10 63 2 50 10 12 15 75 10 26.6 27 15 Because the number of transistors in series is more than one, we must multiply the widths by the appropriate number. Here, all the NMOS transistors will have a width of 54λ. The PMOS transistors will have widths of 126λ and 190λ, respectively. P5.11. We estimate the dc power and dynamic switching power for this problem. a. The circuit’s dc power can be computed by computing the dc current when the output is low. This is given by IDS=550uA/um x 0.1um=55uA. Then PDC=66uW when the output is low. 2 b. Its dynamic power can be calculated by simply using the equation Pdyn CVDD f. Therefore, Pdyn=(50fF)(VDD-VTN)(VDD)(100MHz)=4.4uW. P5.12. The pseudo-NMOS inverter has static current when the output is low. We can estimate it as: I P sat WP vsat COX VGS VT 2 VGS VT ECP L 0.110 8 10 1.6 10 1.2 0.4 4 6 6 1.2 0.4 24 0.1 2 25.6 A Then the average static power is Pstat =(25.6uA)(1.2)/2 =15.4uW. The dynamic power is Pdyn CVDDVswing f avg =(50fF)(1.2)(1.1)favg assuming that VOL is 0.1V. For the CMOS inverter, the static power is almost zero: Pstat=IsubVDD. It is far less than the pseudo-NMOS case. The dynamic power Pdyn CVDDVswing f avg =(50fF)(1.2)2favg is slightly larger than the pseudo-NMOS case. VOUT VOUT Subthreshold current Subthreshold current Short-circuit current Short-circuit current dc current Subthreshold current VIN VIN Pseudo-NMOS CMOS Inverter P5.13. Model development to compute sc. P5.14. The energy delivered by the voltage source is: Esource dv i t VDD dt VDD CL C dt CLVDD dt 0 0 Ecap dv i t vC dt CL C vC dt CL dt 0 0 VDD 0 VDD dv C 2 CLVDD 0 2 VDD vC dvC CL 2 As can be seen, only half the energy is stored in the capacitor. The other half was dissipated as heat through the resistor. P5.15. The average dynamic power does not depend on temperature if the frequency stays the same. However, the short-circuit current will increase as temperature increases. In addition, the subthreshold current increases as temperature increases. So the overall power dissipation will be higher. P5.16. The circuit is shown below. The delay should incorporate both Q and Qb settling in 400ps. All NMOS and PMOS devices are the same size in both NAND gates. 2L L t P t PHL t PLH 0.7 RUP CLOAD 0.7 RDOWN CLOAD 0.7CLOAD Reqp P Reqn N WP WN W 0.7CLOAD Reqp L 2 Reqn L W 0.7CLOAD Reqp L 2 Reqn L tP 0.7 100 1015 30 103 0.1 2 12.5 103 0.1 400 10 12 1μm P5.17. The small glitch in J propagates through the flop even though it is small. This is due to the fact that the JK-flop of Figure 5.20 has the 1’s catching problem. P5.18. The small glitch in J does not propagate through the flop since the edge-triggered configuration does not have a 1’s catching problem. P5.19. The positive-edge triggered FF is as follows: S R CK D 1 2 3 4 (a) With CK=D=0 and S=R=1, the outputs are Gate 1 2 3 4 5 6 Signal 0 1 1 1 1 0 (b) Now CK=0 Gate 1 2 3 4 Signal 0 1 0 1 5 6 Q Q 5 6 0 1