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Introduction Really broad subject Many different ways Method depends on: - The information you need - Time constraints - Availability of equipment - Your skills - The material Sample requirements: Electron transparency Stable under electron beam Conducting Non magnetic Safety first Basic lab safety instruments Know your material Polishing solutions may be poisonous Sample geometry PREPARING A SELF-SUPPORTING DISK FOR FINAL THINNING Making 100 - 200 um thick slice Ductile materials - Wafering saw or spark plasma erosion Brittle materials – razor blade or ultramicrotome Cutting the 3-mm disk from the slice Ductile – mechanical punch Brittle materials - spark erosion ultrasonic drilling, grinding drill Prethinning the disk to a few micrometers - Dimpling Chemicals or Tripod polisher Final thinning Electropolishing - Only for metals, fast, may change surface chemistry Ion milling - Variables are ion energy, angle of incidence, vacuum, initial surface topology, initial chemistry, initial orientation, initial crystallography of the surface, beam energy, and beam profile. SPECIMENS ON GRIDS/WASHERS Alternative for self-supporting samples Faster (on average) Sample may be crushed and put on grid Carbon film commonly used Ultramicrotomy Focused ion beam instrument (FIB) SEM with built-in ion mill Accurate but expensive Cleaving Used for layered materials - Graphite, mica Storing samples • Dry and inert atmosphere • Old samples may be polished again Summary