Download Pressure Cure Oven (PCO)

Pressure Cure Oven (PCO)
CONFIDENTIAL
Introduction
 Pressure Cure Oven (PCO) or Autoclave is used to
minimize voiding and increase adhesion strength for
bonding processes typically used in die attach and
underfill applications
 PCO pressurizes air into a rigid vessel and heats & cools
with forced convection
¬ Heaters, heat exchangers and blowers are internal to
the pressure vessel
 When the curing process is complete, the pressure oven
automatically relieves its pressure to 1atm and cools
CONFIDENTIAL
PCO Introduction
 Viable applications for PCO
Die attach curing
Wafer laminating
Thermal compress bonding
Underfill curing
Via filling
Film & Tape bonding
CONFIDENTIAL
Introduction
Air bubbles
Solder ball
Substrate
 PCO is applied for curing die attach adhesive and
removing voids in adhesive or already soldered products
CONFIDENTIAL
Process Specification
•
•
•
•
•
•
•
Process time:
Generally 120 min or User’s spec
Operating temp:
60oC ~ 200oC
Maximum temp:
220oC
Operating pressure:
1 bar – 10 bar
Capacity:
24 Magazines (typical)
Cooling method:
PCW (17oC - 23oC)
Cooling water pressure:
25 – 40 psi
Representative Pressure/Temp Profiles (User Configurable)
Temp.
Rising
process
Curing
process
Cooling
process
Pressure.
10 bar
200℃
60℃
0
0
30min
90min
120min
Time
CONFIDENTIAL
20min
90min
110min
Time
System Dimensions
1,700㎜
2,200㎜
※ Wight: About 2.7 Ton
1,700㎜
CONFIDENTIAL
Chamber Dimensions
7
CONFIDENTIAL
Chamber with Shelves Extended
CONFIDENTIAL
System Air Flow
Heater module
Fan motor &
mechanical seal
Door inside cover
Return air
assistance damper
radiator
9
CONFIDENTIAL
Vacuum Module Option
• Vacuum Module (Optional)
Vacuum in/out line
Gauge
Vacuum pump
CONFIDENTIAL