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IGBT
Highspeed5IGBTinTRENCHSTOPTM5technologycopackedwithRAPID1
fastandsoftantiparalleldiode
IKZ75N65EH5
650VDuoPackIGBTanddiode
Highspeedseriesfifthgeneration
Datasheet
IndustrialPowerControl
IKZ75N65EH5
Highspeedseriesfifthgeneration
Highspeed5IGBTinTRENCHSTOPTM5technologycopackedwithRAPID1
fastandsoftantiparalleldiode
FeaturesandBenefits:
HighspeedH5technologyoffering
•UltralowlossswitchingthankstoKelvinemitterpinin
combinationwithTRENCHSTOPTM5
•Best-in-classefficiencyinhardswitchingandresonant
topologies
•PlugandplayreplacementofpreviousgenerationIGBTs
•650Vbreakdownvoltage
•LowgatechargeQG
•IGBTcopackedwithRAPID1fastandsoftantiparalleldiode
•Maximumjunctiontemperature175°C
•QualifiedaccordingtoJEDECfortargetapplications
•Pb-freeleadplating;RoHScompliant
•CompleteproductspectrumandPSpiceModels:
http://www.infineon.com/igbt/
Applications
•Uninterruptiblepowersupplies
•Weldingconverters
•Midtohighrangeswitchingfrequencyconverters
•Solarstringinverters
Packagepindefinition:
•PinC&backside-collector
•PinE-emitter
•PinK-Kelvinemitter
•PinG-gate
Pleasenote:TheemitterandKelvinemitterpinsarenot
exchangeable.Theirexchangemightleadtomalfunction.
KeyPerformanceandPackageParameters
Type
IKZ75N65EH5
VCE
IC
VCEsat,Tvj=25°C
Tvjmax
Marking
Package
650V
75A
1.65V
175°C
K75EEH5
PG-TO247-4
2
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Testing Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
3
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
MaximumRatings
Foroptimumlifetimeandreliability,Infineonrecommendsoperatingconditionsthatdonotexceed80%ofthemaximumratingsstatedinthisdatasheet.
Parameter
Symbol
Value
Unit
Collector-emittervoltage,Tvj≥25°C
VCE
650
V
DCcollectorcurrent,limitedbyTvjmax
TC=25°Cvaluelimitedbybondwire
TC=100°C
IC
90.0
75.0
A
Pulsedcollectorcurrent,tplimitedbyTvjmax1)
ICpuls
300.0
A
Turn off safe operating area
VCE≤650V,Tvj≤175°C,tp=1µs1)
-
300.0
A
Diodeforwardcurrent,limitedbyTvjmax
TC=25°Cvaluelimitedbybondwire
TC=100°C
IF
95.0
85.0
A
Diodepulsedcurrent,tplimitedbyTvjmax1)
IFpuls
300.0
A
Gate-emitter voltage
TransientGate-emittervoltage(tp≤10µs,D<0.010)
VGE
±20
±30
V
PowerdissipationTC=25°C
PowerdissipationTC=100°C
Ptot
395.0
197.0
W
Operating junction temperature
Tvj
-40...+175
°C
Storage temperature
Tstg
-55...+150
°C
Soldering temperature,
wave soldering 1.6mm (0.063in.) from case for 10s
°C
260
Mounting torque, M3 screw
Maximum of mounting processes: 3
M
0.6
Nm
ThermalResistance
Parameter
Characteristic
Symbol Conditions
Max.Value
Unit
IGBT thermal resistance,
junction - case
Rth(j-c)
0.38
K/W
Diode thermal resistance,
junction - case
Rth(j-c)
0.46
K/W
Thermal resistance
junction - ambient
Rth(j-a)
40
K/W
1)
Defined by design. Not subject to production test.
4
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
ElectricalCharacteristic,atTvj=25°C,unlessotherwisespecified
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
650
-
-
VGE=15.0V,IC=75.0A
Tvj=25°C
Tvj=100°C
Tvj=150°C
-
1.65
1.82
1.90
2.10
-
-
1.35
1.33
1.30
1.70
-
3.2
4.0
4.8
V
75.0
3300.0
-
µA
StaticCharacteristic
Collector-emitter breakdown voltage V(BR)CES VGE=0V,IC=0.20mA
Collector-emitter saturation voltage VCEsat
V
V
Diode forward voltage
VF
VGE=0V,IF=75.0A
Tvj=25°C
Tvj=100°C
Tvj=150°C
Gate-emitter threshold voltage
VGE(th)
IC=0.75mA,VCE=VGE
Zero gate voltage collector current
ICES
VCE=650V,VGE=0V
Tvj=25°C
Tvj=175°C
-
Gate-emitter leakage current
IGES
VCE=0V,VGE=20V
-
-
100
nA
Transconductance
gfs
VCE=20V,IC=75.0A
-
104.0
-
S
V
ElectricalCharacteristic,atTvj=25°C,unlessotherwisespecified
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
4300
-
-
130
-
-
16
-
-
166.0
-
nC
-
13.0
-
nH
DynamicCharacteristic
Input capacitance
Cies
Output capacitance
Coes
Reverse transfer capacitance
Cres
Gate charge
QG
Internal emitter inductance1)
measured 5mm (0.197 in.) from
case
LE
VCE=25V,VGE=0V,f=1MHz
VCC=520V,IC=75.0A,
VGE=15V
pF
SwitchingCharacteristic,InductiveLoad
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
26
-
ns
-
11
-
ns
-
347
-
ns
-
15
-
ns
-
0.68
-
mJ
-
0.43
-
mJ
-
1.11
-
mJ
IGBTCharacteristic,atTvj=25°C
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
1)
Tvj=25°C,
VCC=400V,IC=37.5A,
VGE=0.0/15.0V,
RG(on)=10.0Ω,RG(off)=18.0Ω,
Lσ=30nH,Cσ=25pF
Lσ,CσfromFig.E
Energy losses include “tail” and
diode reverse recovery.
The internal emitter inductance does not affect the gate control circuitry if bypassed by using the emitter sense pin.
5
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
DiodeCharacteristic,atTvj=25°C
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
Tvj=25°C,
VR=400V,
IF=37.5A,
diF/dt=1500A/µs
dirr/dt
-
58
-
ns
-
1.02
-
µC
-
29.0
-
A
-
-2800
-
A/µs
SwitchingCharacteristic,InductiveLoad
Parameter
Symbol Conditions
Value
Unit
min.
typ.
max.
-
24
-
ns
-
13
-
ns
-
400
-
ns
-
15
-
ns
-
1.10
-
mJ
-
0.48
-
mJ
-
1.58
-
mJ
-
91
-
ns
-
2.58
-
µC
-
42.0
-
A
-
-1845
-
A/µs
IGBTCharacteristic,atTvj=150°C
Turn-on delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Turn-on energy
Eon
Turn-off energy
Eoff
Total switching energy
Ets
Tvj=150°C,
VCC=400V,IC=37.5A,
VGE=0.0/15.0V,
RG(on)=10.0Ω,RG(off)=18.0Ω,
Lσ=30nH,Cσ=25pF
Lσ,CσfromFig.E
Energy losses include “tail” and
diode reverse recovery.
DiodeCharacteristic,atTvj=150°C
Diode reverse recovery time
trr
Diode reverse recovery charge
Qrr
Diode peak reverse recovery current Irrm
Diode peak rate of fall of reverse
recoverycurrentduringtb
Tvj=150°C,
VR=400V,
IF=37.5A,
diF/dt=1500A/µs
dirr/dt
6
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
400
350
Ptot,POWERDISSIPATION[W]
IC,COLLECTORCURRENT[A]
100
10
1
300
250
200
150
100
50
not for linear use
0.1
1
10
100
0
1000
25
50
VCE,COLLECTOR-EMITTERVOLTAGE[V]
75
100
125
150
175
TC,CASETEMPERATURE[°C]
Figure 1. Forwardbiassafeoperatingarea
(D=0,TC=25°C,Tvj≤175°C,VGE=15V,tp=1µs,
ICmaxdefinedbydesign-notsubjectto
production test)
Figure 2. Powerdissipationasafunctionofcase
temperature
(Tvj≤175°C)
100
300
90
270
18V
80
240
15V
IC,COLLECTORCURRENT[A]
IC,COLLECTORCURRENT[A]
VGE = 19V
70
60
50
40
30
14V
210
180
7V
30
75
100
125
150
0
175
TC,CASETEMPERATURE[°C]
5V
90
10
50
8V
120
60
25
9V
150
20
0
11V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 3. Collectorcurrentasafunctionofcase
temperature
(VGE≥15V,Tvj≤175°C)
Figure 4. Typicaloutputcharacteristic
(Tvj=25°C)
7
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
300
300
270
17V
270
240
15V
240
11V
210
IC,COLLECTORCURRENT[A]
IC,COLLECTORCURRENT[A]
VGE = 19V
9V
180
8V
150
120
90
210
180
150
120
90
60
60
30
30
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
5.0
Tvj = 25°C
Tvj = 175°C
3
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 5. Typicaloutputcharacteristic
(Tvj=175°C)
6
7
8
9
10
1000
IC = 20A
IC = 37.5A
IC = 75A
2.00
1.75
t,SWITCHINGTIMES[ns]
VCEsat,COLLECTOR-EMITTERSATURATION[V]
5
Figure 6. Typicaltransfercharacteristic
(VCE=20V)
2.25
1.50
1.25
1.00
100
10
0.75
0.50
4
VGE,GATE-EMITTERVOLTAGE[V]
td(off)
tf
td(on)
tr
25
50
75
100
125
150
1
175
Tvj,JUNCTIONTEMPERATURE[°C]
0
25
50
75
100 125 150 175 200 225
IC,COLLECTORCURRENT[A]
Figure 7. Typicalcollector-emittersaturationvoltageas Figure 8. Typicalswitchingtimesasafunctionof
afunctionofjunctiontemperature
collectorcurrent
(VGE=15V)
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,RG(on)=10Ω,RG(off)=18Ω,dynamic
test circuit in Figure E)
8
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
1000
td(off)
tf
td(on)
tr
t,SWITCHINGTIMES[ns]
t,SWITCHINGTIMES[ns]
1000
100
10
100
10
td(off)
tf
td(on)
tr
1
0
10
20
30
40
1
50
25
RG,GATERESISTANCE[Ω]
Figure 9. Typicalswitchingtimesasafunctionofgate
resistance
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,IC=37.5A,dynamictestcircuitin
Figure E)
100
125
150
175
9
typ.
min.
max.
5.5
Eoff
Eon
Ets
8
E,SWITCHINGENERGYLOSSES[mJ]
VGE(th),GATE-EMITTERTHRESHOLDVOLTAGE[V]
75
Figure 10. Typicalswitchingtimesasafunctionof
junctiontemperature
(inductiveload,VCE=400V,VGE=0/15V,
IC=37.5A,RG(on)=10Ω,RG(off)=18Ω,dynamic
test circuit in Figure E)
6.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
7
6
5
4
3
2
1
1.5
1.0
50
Tvj,JUNCTIONTEMPERATURE[°C]
25
50
75
100
125
0
150
Tvj,JUNCTIONTEMPERATURE[°C]
0
25
50
75
100 125 150 175 200 225
IC,COLLECTORCURRENT[A]
Figure 11. Gate-emitterthresholdvoltageasafunction
ofjunctiontemperature
(IC=0.75mA)
9
Figure 12. Typicalswitchingenergylossesasa
functionofcollectorcurrent
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,RG(on)=10Ω,RG(off)=18Ω,
dynamic test circuit in Figure E)
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
3.5
1.8
Eoff
Eon
Ets
1.6
E,SWITCHINGENERGYLOSSES[mJ]
E,SWITCHINGENERGYLOSSES[mJ]
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Eoff
Eon
Ets
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10
20
30
40
0.0
50
25
RG,GATERESISTANCE[Ω]
Figure 13. Typicalswitchingenergylossesasa
functionofgateresistance
(inductiveload,Tvj=150°C,VCE=400V,
VGE=0/15V,IC=37.5A,dynamictestcircuitin
Figure E)
125
150
175
VCE = 130V
VCE = 520V
14
VGE,GATE-EMITTERVOLTAGE[V]
E,SWITCHINGENERGYLOSSES[mJ]
100
16
Eoff
Eon
Ets
1.25
1.00
0.75
0.50
0.25
0.00
200
75
Figure 14. Typicalswitchingenergylossesasa
functionofjunctiontemperature
(inductiveload,VCE=400V,VGE=0/15V,
IC=37.5A,RG(on)=10Ω,RG(off)=18Ω,dynamic
test circuit in Figure E)
1.75
1.50
50
Tvj,JUNCTIONTEMPERATURE[°C]
12
10
8
6
4
2
250
300
350
0
400
VCE,COLLECTOR-EMITTERVOLTAGE[V]
Figure 15. Typicalswitchingenergylossesasa
functionofcollectoremittervoltage
(inductiveload,Tvj=150°C,VGE=0/15V,
IC=37.5A,RG(on)=10Ω,RG(off)=18Ω,dynamic
test circuit in Figure E)
0
20
40
60
80
100 120 140 160 180
QG,GATECHARGE[nC]
Figure 16. Typicalgatecharge
(IC=75A)
10
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
C,CAPACITANCE[pF]
Zth(j-c),TRANSIENTTHERMALIMPEDANCE[K/W]
Cies
Coes
Cres
1E+4
1000
100
10
0
5
10
15
20
25
D = 0.5
0.1
0.1
0.05
0.02
0.01
single pulse
0.01
i:
1
2
3
4
5
6
ri[K/W]: 0.010336 0.078242 0.081139 0.196217 0.015938 1.8E-3
τi[s]:
2.8E-5
2.3E-4
2.3E-3
0.013145 0.113481 1.869237
0.001
1E-6
30
0.2
1E-5
VCE,COLLECTOR-EMITTERVOLTAGE[V]
1E-4
0.001
0.01
0.1
tp,PULSEWIDTH[s]
Figure 17. Typicalcapacitanceasafunctionof
collector-emittervoltage
(VGE=0V,f=1MHz)
Figure 18. IGBTtransientthermalimpedance
(D=tp/T)
Tvj = 25°C, IF = 37.5A
Tvj = 150°C, IF = 37.5A
100
90
trr,REVERSERECOVERYTIME[ns]
Zth(j-c),TRANSIENTTHERMALIMPEDANCE[K/W]
110
D = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
single pulse
0.01
80
70
60
50
40
30
20
10
i:
1
2
3
4
5
6
7
ri[K/W]: 3.1E-4 0.01435 0.09435 0.09881 0.22828 0.01967 2.0E-3
τi[s]:
1.0E-5 3.0E-5
2.2E-4
2.2E-3
0.01247 0.10291 1.85641
0.001
1E-6
1E-5
1E-4
0.001
0.01
0
1000
0.1
tp,PULSEWIDTH[s]
1500
2000
2500
3000
3500
4000
4500
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 19. Diodetransientthermalimpedanceasa
functionofpulsewidth
(D=tp/T)
Figure 20. Typicalreverserecoverytimeasafunction
ofdiodecurrentslope
(VR=400V)
11
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
3.5
100
Tvj = 25°C, IF = 37.5A
Tvj = 150°C, IF = 37.5A
90
3.0
Irr,REVERSERECOVERYCURRENT[A]
Qrr,REVERSERECOVERYCHARGE[µC]
Tvj = 25°C, IF = 37.5A
Tvj = 150°C, IF = 37.5A
2.5
2.0
1.5
1.0
80
70
60
50
40
30
20
0.5
10
0.0
1000
1500
2000
2500
3000
3500
4000
0
1000
4500
1500
2000
2500
3000
3500
4000
diF/dt,DIODECURRENTSLOPE[A/µs]
diF/dt,DIODECURRENTSLOPE[A/µs]
Figure 21. Typicalreverserecoverychargeasa
functionofdiodecurrentslope
(VR=400V)
Figure 22. Typicalreverserecoverycurrentasa
functionofdiodecurrentslope
(VR=400V)
-1
300
Tvj = 25°C, IF = 37.5A
Tvj = 150°C, IF = 37.5A
-2
240
-3
-4
-5
-6
-7
210
180
150
120
90
-8
60
-9
30
-10
1000
Tvj = 25°C
Tvj = 175°C
270
IF,FORWARDCURRENT[A]
dIrr/dt,DIODEPEAKRATEOFFALLOFIrr[A/ns]
0
4500
1500
2000
2500
3000
3500
4000
4500
diF/dt,DIODECURRENTSLOPE[A/µs]
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VF,FORWARDVOLTAGE[V]
Figure 23. Typicaldiodepeakrateoffallofreverse
recoverycurrentasafunctionofdiode
currentslope
(VR=400V)
Figure 24. Typicaldiodeforwardcurrentasafunction
offorwardvoltage
12
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
1.75
IF = 20A
IF = 37.5A
IF = 75A
VF,FORWARDVOLTAGE[V]
1.50
1.25
1.00
0.75
0.50
25
50
75
100
125
150
175
Tvj,JUNCTIONTEMPERATURE[°C]
Figure 25. Typicaldiodeforwardvoltageasafunction
ofjunctiontemperature
13
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
89:;<=>?:>
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87
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531161,
Rev.2.1,2014-10-31
IKZ75N65EH5
Highspeedseriesfifthgeneration
vGE(t)
90% VGE
a
a
10% VGE
b
b
t
iC(t)
90% IC
90% IC
10% IC
10% IC
t
vCE(t)
t
td(off)
tf
td(on)
t
tr
vGE(t)
90% VGE
10% VGE
t
iC(t)
CC
2% IC
t
vCE(t)
t2
E
off
=
t4
VCE x IC x dt
E
t1
t1
parasitic
relief
on
=
VCE x IC x dt
2% VCE
t3
t2
t3
t4
t
15
Rev.2.1,2014-10-31
IKZ75N65EH5
High speed series fifth generation
Revision History
IKZ75N65EH5
Revision: 2014-10-31, Rev. 2.1
Previous Revision
Revision
Date
Subjects (major changes since last revision)
1.1
2014-10-17
Preliminary data sheet
2.1
2014-10-31
Final data sheet
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Published by
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81726 München, Germany
© 2014 Infineon Technologies AG
All Rights Reserved.
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With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the
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including without limitation, warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon
Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems
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Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support,
automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life
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16
Rev. 2.1, 2014-10-31
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