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Two Devices on a Common Heat Sink • Thermal Model ECE 442 Power Electronics 1 T P (R JC ,1 R ) (P P )R T T P (R JC ,2 R ) (P P )R T J ,1 J ,2 D ,1 D ,2 CS ,1 CS ,2 D ,1 D ,1 ECE 442 Power Electronics D ,2 D ,2 SA SA A A 2 The heat sink Thermal Resistance T T P (R R P P JC ,1 T T P (R R P P JC ,2 J ,1 A D ,1 R ) CS ,1 SA D ,1 J ,2 A D ,2 D ,2 R ) CS ,2 SA D ,1 ECE 442 Power Electronics D ,2 3 If the two devices are identical 1 T T R R R 2 P J A SA JC CS D The heat sink needs to have half of the thermal resistance required for one device alone. If the devices are not identical, the required thermal resistance is the smaller of the two previously computed values. ECE 442 Power Electronics 4 Example • Specify a heat sink for two identical power devices with a maximum junction temperature of 150C to operate in an ambient temperature of 50C. The power dissipation in each device is 20W and the junction-to-case thermal resistance is 1.5C/W. The thermal resistance of the mica insulators is 0.5C/W. ECE 442 Power Electronics 5 1 T T R R R 2 P J A SA JC CS D 1 150 50 R 1.5 0.5 1.5C / W 2 20 SA One device would require RSA = 3.0C/W ECE 442 Power Electronics 6 Check the Junction Temperature Device #1 T P (R J ,1 D ,1 JC ,1 R ) (P P )R T CS ,1 D ,1 D ,2 SA T 20(1.5 0.5) (20 20)1.5 50 J ,1 T 150C J ,1 ECE 442 Power Electronics 7 A For N devices with Common Heat Sink For the nth device T J ,n P (R D ,n R ) R P T N JC ,n CS ,n T T P (R R P J ,n SA A D ,n SA n 1 JC ,n D ,n A R ) CS ,n N n 1 D ,n ECE 442 Power Electronics 8 For n Identical Devices 1 T T R R R n P J A SA JC CS D ECE 442 Power Electronics 9 Example • Repeat the previous example if there are three identical devices that dissipate 10W each. ECE 442 Power Electronics 10 1 T T R R R n P J A SA JC CS D 1 150 50 R 1.5 0.5 3 10 R 2.67C / W SA SA ECE 442 Power Electronics 11 Check the Junction Temperature Device #1 T P (R R ) (P P P )R T J ,1 D ,1 C ,1 CS ,1 D ,1 D ,2 D ,3 SA A T 10(1.5 0.5) (10 10 10)(2.67) 50 J ,1 T 150.1C / W J ,1 ECE 442 Power Electronics 12