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THE STERLING GROUP MISSION
VIETNAM 2013
Time: 14h00 – 15h00, September 10, 2013
Meeting room: C1-222, Hanoi University of Science and Technology, No. 1, Dai Co Viet Road, Hanoi
Lecturers’ biographies
Lecture abstracts
Prof. Steve J Bull (MA PhD FIMMM FInstP CEng)
Chairman of the Sterling Group
Cookson Group Chair of Engineering Materials
School of Chemical Engineering and Advanced Materials
Newcastle University
Merz Court, Newcastle upon Tyne, NE1 7RU, UK
Tel: +44 191 222 7913
Email: [email protected]
Title: Designing products using nanostructured materials and
coatings
Professor Steve Bull is Cookson Group Chair of Engineering Materials
in the School of Chemical Engineering and Advanced Materials at
Newcastle. He has over twenty five years experience in research on
structure-property relationships in thin films and coatings having spent
eight years at AEA Technology, Harwell running coating activities
before moving to Newcastle University in 1996. His current research is
focussed on the relationship between functional properties (e.g.
electrical or optical) and the mechanical response of sub-micron
multilayered and porous coating systems.
The properties of thin (submicron) layers are often critical in dictating
device performance in electronic and optical applications such as in
the microchips and displays in mobile phones. For instance plastic
deformation of thin metal lines used in semiconductor metallisation
can influence the reliability of microelectronic devices by controlling
failure modes such as stressmigration. Also, thin metal layers may be
used in the joining of ceramic components (e.g. copper in the
diffusion bonding of alumina insulators). One key issue is that the
properties of these metals may change during processing (e.g. by
rapid thermal annealing or during bonding) and a direct measurement
of their properties is required. Designing products based on these
coating requires engineering design methods that work at the
nanometre scale and high quality property data for the materials to be
used.
Audience: Students and academics with background in Chemical
Engineering, Mechanical Engineering, Manufacturing Engineering,
Electrical Engineering, Materials Engineering, Engineering Design,
Physics
His work combines property measurement at high spatial resolution with
theoretical analysis to understand and interpret the data generated. A
particular emphasis of recent work is the understanding of fracture
processes in multilayer coatings and the development of predictive
modelling approaches to provide data for design. He is currently
working on the fracture properties of solar control coatings on glass, Whereas relatively simple bulk characterisation tests can be adapted
stress generation and stress relaxation in semiconductor metallisation to test thin films for many electrical or optical properties it is much
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and lithium ion battery electrodes and strain control in strained more difficult to make mechanical measurements of such small
silicon/silicon germanium substrates for high speed microelectronic volumes of material. Nanoindentation is one of the few methods
devices.
available that can measure the elastic and plastic properties of
semiconductor metallisation at a scale of an individual device but
He has published over 180 papers in refereed journals and is regularly may be affected by the constraint from surrounding materials;
invited to present his work at International conferences.
measurements in a blanket thin film often give different results to
those obtained from an individual metallisation line.
This presentation will discuss how to accurately measure the
properties of very thin coatings and isolated submicron patterned
metal lines. It will also discuss the effects of testing thin bonding
layers edge-on, where constraint from the materials to be joined is
significant. The use of finite element modelling to assess the validity
of test data and for subsequent component design will be highlighted.
The talk will be illustrated with examples for a range of current
applications including copper metallisation in microchips, multilayer
coatings for solar control and self cleaning glass and flexible lighting
based on organic light emitting diodes (OLEDs).
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