Download 100% tin reflow process offers improved conductivity and reliability

100% TIN REFLOW PROCESS OFFERS
IMPROVED CONDUCTIVITY AND
RELIABILITY
Thomaston, Connecticut, May 23, 2005 – Using a
proprietary Reflow Metallization™ process
developed in-house, Summit Corporation of
America provides lead-free plating of strip and wire
for a variety of industrial applications including
connectors, lead frames, and electronic devices for
the telecommunications, appliance, automotive,
semiconductor, computer, and electronics industries.
A pioneer in lead-free reel-to-reel plating, Summit
can also plate any metal or combination of metals in
continuous strips, meeting the international
standards of the Lead-Free Legislation.
Summit’s Reflow process—plating pure tin over
copper or brass substrates--provides parts that are
metallurgically superior to conventionally plated
parts, extending the shelf life and solderability of
components. The process eliminates detrimental “tin
whiskering,” which can cause a multitude of
problems. Improved conductivity, corrosionresistance, insertion force, and malleability of
electrical connectors are additional benefits.
Summit’s Reflow Metallization™ process is
comparable in cost to other plating processes, but
eliminates the need costly organic brighteners or
leveling agents that are harmful to the environment.
The resultant low-stress, full-bright tin coating is
extremely durable, meeting the challenges of
thermal cycling and other types of environmental
factors. And as the need for reliability of electrical
and electronic components with lead-free processing
increases, the applications for these products will
continue to grow.
Summit Corporation of America is an ISO
9002/QS9000 certified and recognized precision
electroplater, and is supported with an A2LA
accredited laboratory.