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100% TIN REFLOW PROCESS OFFERS IMPROVED CONDUCTIVITY AND RELIABILITY Thomaston, Connecticut, May 23, 2005 – Using a proprietary Reflow Metallization™ process developed in-house, Summit Corporation of America provides lead-free plating of strip and wire for a variety of industrial applications including connectors, lead frames, and electronic devices for the telecommunications, appliance, automotive, semiconductor, computer, and electronics industries. A pioneer in lead-free reel-to-reel plating, Summit can also plate any metal or combination of metals in continuous strips, meeting the international standards of the Lead-Free Legislation. Summit’s Reflow process—plating pure tin over copper or brass substrates--provides parts that are metallurgically superior to conventionally plated parts, extending the shelf life and solderability of components. The process eliminates detrimental “tin whiskering,” which can cause a multitude of problems. Improved conductivity, corrosionresistance, insertion force, and malleability of electrical connectors are additional benefits. Summit’s Reflow Metallization™ process is comparable in cost to other plating processes, but eliminates the need costly organic brighteners or leveling agents that are harmful to the environment. The resultant low-stress, full-bright tin coating is extremely durable, meeting the challenges of thermal cycling and other types of environmental factors. And as the need for reliability of electrical and electronic components with lead-free processing increases, the applications for these products will continue to grow. Summit Corporation of America is an ISO 9002/QS9000 certified and recognized precision electroplater, and is supported with an A2LA accredited laboratory.