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Variation-Aware Design for Nanometer Generation LSI
Variation-Aware Design for Nanometer Generation LSI

... of variation among interconnects are also getting higher than before. Therefore, the design of LSIs for the nanometer generation (here, we will call processes of 90nm and below “nanometer generation” processes) requires consideration of the variations among interconnects as well as those among trans ...
Multiple State Electrostatically Formed Nanowire Transistors
Multiple State Electrostatically Formed Nanowire Transistors

... for MVL large-scale circuits to be suggested. Although this work focuses on utilizing the MSET for logic applications, it is clear that it can be used in many other fields as well. II. DEVICE OPERATION The basic MSET configuration closely resembles a split gate JFET with one important difference: th ...
DATA  SHEET PZTA44 NPN high-voltage transistor
DATA SHEET PZTA44 NPN high-voltage transistor

... Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result i ...
LECT7V23_printvers
LECT7V23_printvers

... We can get a good approximation for r by using the following relationship. o r =V /I o A C The V , the Early voltage, is another parameter we must be given. It is typically in the A range of 50-100[V]. Note also that I is the dc value of the collector current. C With this, we can get a pretty good m ...
2011 ieee subthreshold microelectronics conference
2011 ieee subthreshold microelectronics conference

... handheld and wireless devices by dramatically improving battery life and portability. Ubiquitous sensor networks, RFID tags, implanted medical devices, portable biosensors, handheld devices, and space-based applications are among those that would benefit from extremely low power circuits. One of the ...
Active Pixel Sensor Arrays in 90/65nm CMOS
Active Pixel Sensor Arrays in 90/65nm CMOS

3.1 ELECTRICAL AND ELECTRONICS ENGINEERING MATERIALS
3.1 ELECTRICAL AND ELECTRONICS ENGINEERING MATERIALS

... Basic Electrical Measurements by Melville B. Staut. Electrical Measurement and Measuring Instruments by JB Gupta, SK Kataria and Sons, New Delhi Electrical Measurement and Measuring Instruments by ML Anand, SK Kataria and Sons, New ...
Power Optimization for Ripple Carry Adder with Reduced
Power Optimization for Ripple Carry Adder with Reduced

... Addition process can be used as a basic block for combination of all arithmetic setups. The binary adder becomes an essential hardware component. Even though many researches related with the binary adder structures are selected, their studies showed their comparative performance, area, power analysi ...
ppt - EC - Unit 1 - Transistor, UJT, SCR
ppt - EC - Unit 1 - Transistor, UJT, SCR

IOSR Journal of VLSI and Signal Processing (IOSR-JVSP)
IOSR Journal of VLSI and Signal Processing (IOSR-JVSP)

Supplementary Material for  Phosphorene: A Unexplored 2D Semiconductor with a
Supplementary Material for Phosphorene: A Unexplored 2D Semiconductor with a

... effective Schottky barrier for holes. In the ON-State, e.g. at Vbg=-30 V, both conduction and valence bands are pushed upwards, leaving a reduced Schottky barrier width, which facilitates the hole injection from the contact metal in a thermally assisted tunneling process. In contrast to this, in the ...
Electron Devices – UNIT 5 Monolithic ICs (DOC)
Electron Devices – UNIT 5 Monolithic ICs (DOC)

... Being the base layer of the IC, the P-type is silicon is first built for the IC. A silicon crystal of Ptype is grown in dimensions of 250mm length and 25mm diameter. The silicon is then cut into thin slices with high precision using a diamond saw. Each wafer will precisely have a thickness of 200 mi ...
L12a_4345_Sp02
L12a_4345_Sp02

... This problem can be avoided by placing each transistor in its own tank or well, but this wastes a lot of area resulted in the end with isolation diffusion. Therefore a P-bar or N-bar (another minority carrier guard ring) are more suitable for such fields. ...
High-voltage circuits for power management on 65 nm CMOS
High-voltage circuits for power management on 65 nm CMOS

... based on stacked low-voltage CMOS transistors are more efficient because of their full compatibility with scaled technologies (Serneels and Steyaert, 2008; Nam et al., 2012; Bradburn and Hess, 2010). High voltage circuits using stacked devices are a problem, when fast switching or high currents are ...
c-14-dbme-1st-year
c-14-dbme-1st-year

... State and explain Kirchhoff’s laws. Solve problems on D.C. Networks using Kirchhoff’s laws. Apply Kirchhoff’s laws to Wheatstone’s bridge Network. Explain Star and Delta configurations of resistances. Give transformation formulae from Star to Delta & Delta to Star (no derivation). Solve simple probl ...
Bipolar Transistors
Bipolar Transistors

AN-310 High-Speed CMOS (MM74HC) Processing AN- 310
AN-310 High-Speed CMOS (MM74HC) Processing AN- 310

... Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. ...
L38to40_BJT
L38to40_BJT

... • If so, then almost all injected holes are collected: IE ≈ IC are the “large” currents here (water passing through the hose). © 2012 Eric Pop, UIUC ...
ECE 340, Univ. Illinois Urbana
ECE 340, Univ. Illinois Urbana

DATA  SHEET PBSS4350T 50 V; 3 A NPN low V (BISS) transistor
DATA SHEET PBSS4350T 50 V; 3 A NPN low V (BISS) transistor

... Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result i ...
Automatic Switching: Transistor Project
Automatic Switching: Transistor Project

... X ...
AN11045 Next generation of NXP low VCEsat transistors: improved
AN11045 Next generation of NXP low VCEsat transistors: improved

... whereas the gate-source threshold voltage VGS(th) changes with a factor of about 4 mV/K to 6 mV/K. The same holds for the on-state resistance. The collector-emitter saturation resistance RCEsat decreases with about 0.4 %/K over temperature, the drain-source on-state resistance RDSon of a MOSFET incr ...
BC857BS - Nexperia
BC857BS - Nexperia

... Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result i ...
Thermodynamically Equivalent Silicon Models of Voltage
Thermodynamically Equivalent Silicon Models of Voltage

... Similar considerations of the transistor make clear that both the ion channel and the transistor operate under similar principles. This observation, originally recognized by Carver Mead (1989), allows us to implement the voltage dependence of the ion channel’s temporal dynamics, while at the same ti ...
Reliability in CMOS IC Design: Physical Failure Mechanisms and
Reliability in CMOS IC Design: Physical Failure Mechanisms and

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History of the transistor



A transistor is a semiconductor device with at least three terminals for connection to an electric circuit. The vacuum-tube triode, also called a (thermionic) valve, was the transistor's precursor, introduced in 1907.
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