• Study Resource
  • Explore
    • Arts & Humanities
    • Business
    • Engineering & Technology
    • Foreign Language
    • History
    • Math
    • Science
    • Social Science

    Top subcategories

    • Advanced Math
    • Algebra
    • Basic Math
    • Calculus
    • Geometry
    • Linear Algebra
    • Pre-Algebra
    • Pre-Calculus
    • Statistics And Probability
    • Trigonometry
    • other →

    Top subcategories

    • Astronomy
    • Astrophysics
    • Biology
    • Chemistry
    • Earth Science
    • Environmental Science
    • Health Science
    • Physics
    • other →

    Top subcategories

    • Anthropology
    • Law
    • Political Science
    • Psychology
    • Sociology
    • other →

    Top subcategories

    • Accounting
    • Economics
    • Finance
    • Management
    • other →

    Top subcategories

    • Aerospace Engineering
    • Bioengineering
    • Chemical Engineering
    • Civil Engineering
    • Computer Science
    • Electrical Engineering
    • Industrial Engineering
    • Mechanical Engineering
    • Web Design
    • other →

    Top subcategories

    • Architecture
    • Communications
    • English
    • Gender Studies
    • Music
    • Performing Arts
    • Philosophy
    • Religious Studies
    • Writing
    • other →

    Top subcategories

    • Ancient History
    • European History
    • US History
    • World History
    • other →

    Top subcategories

    • Croatian
    • Czech
    • Finnish
    • Greek
    • Hindi
    • Japanese
    • Korean
    • Persian
    • Swedish
    • Turkish
    • other →
 
Profile Documents Logout
Upload
Design of Gain Booster for Sample and Hold Stage of High Speed
Design of Gain Booster for Sample and Hold Stage of High Speed

AdvancedEndplate
AdvancedEndplate

Jercio(Shenzhen)Technology Co.,Ltd. 4th.Floor 2 Building NanFeng
Jercio(Shenzhen)Technology Co.,Ltd. 4th.Floor 2 Building NanFeng

Evaluates: MAX6469–MAX6476 MAX6470 Evaluation Kit General Description Features
Evaluates: MAX6469–MAX6476 MAX6470 Evaluation Kit General Description Features

LightingDisty(Jun2007)
LightingDisty(Jun2007)

Electrical circuits wyklad 3
Electrical circuits wyklad 3

3 A CMOS Smart Temperature Sensor With a Inaccuracy of 0.5 C From
3 A CMOS Smart Temperature Sensor With a Inaccuracy of 0.5 C From

FT2ER - TestMart
FT2ER - TestMart

Design And Verification of A PLL Based Clock And Data Recovery
Design And Verification of A PLL Based Clock And Data Recovery

Slide 1 Magnetism - Spring Branch ISD
Slide 1 Magnetism - Spring Branch ISD

Analogue-Theory-and-Circuit-Analysis
Analogue-Theory-and-Circuit-Analysis

... direction periodically, is called alternating current, abbreviated as ac. ...
Semi-conductors
Semi-conductors

HMC-APH634 - Micross Components
HMC-APH634 - Micross Components

... The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C ...
ARC FAULT CIRCUIT INTERRUPTER
ARC FAULT CIRCUIT INTERRUPTER

DC1639 - LTC6360 High Speed Op Amp with True Zero Output
DC1639 - LTC6360 High Speed Op Amp with True Zero Output

an area efficient 64-bit square root carry
an area efficient 64-bit square root carry

... benchmarks from application-specific DSP to generalpurpose processors [1]. In particular, carry-propagation adder (CPA) is frequently part of the critical delay path limiting the overall system performance due to the inevitable carry propagation chain. For example, the delay of a fast CPA for conver ...
Supplementary Material for  Phosphorene: A Unexplored 2D Semiconductor with a
Supplementary Material for Phosphorene: A Unexplored 2D Semiconductor with a

Concepts Addressed in Lesson - Union
Concepts Addressed in Lesson - Union

Chapter 1 - UniMAP Portal
Chapter 1 - UniMAP Portal

Corporate Presentation - Central Semiconductor
Corporate Presentation - Central Semiconductor

Stability Conditions for a Digital Discrete-Time Non-Foster Circuit Element
Stability Conditions for a Digital Discrete-Time Non-Foster Circuit Element

Undergraduate Admissions & College of Engineering
Undergraduate Admissions & College of Engineering

Chapter 1 Variables and Circuit Elements
Chapter 1 Variables and Circuit Elements

Twitter - Texas Instruments
Twitter - Texas Instruments

... to increase in contact resistance, so several pins are needed. Many digital boards consist of many layers and hundreds or thousands of nets. The addition of one more net is seldom an issue, but the addition of several connector pins almost always is. If this cannot be done, then it will be necessary ...
Logic Simulation Simulation Defined Simulation
Logic Simulation Simulation Defined Simulation

... Time Wheel (Circular Stack) max ...
< 1 ... 105 106 107 108 109 110 111 112 113 ... 304 >

Integrated circuit



An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small plate (""chip"") of semiconductor material, normally silicon. This can be made much smaller than a discrete circuit made from independent electronic components. ICs can be made very compact, having up to several billion transistors and other electronic components in an area the size of a fingernail. The width of each conducting line in a circuit can be made smaller and smaller as the technology advances; in 2008 it dropped below 100 nanometers, and has now been reduced to tens of nanometers.ICs were made possible by experimental discoveries showing that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using discrete electronic components. The integrated circuit's mass production capability, reliability and building-block approach to circuit design ensured the rapid adoption of standardized integrated circuits in place of designs using discrete transistors.ICs have two main advantages over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance is high because the IC's components switch quickly and consume little power (compared to their discrete counterparts) as a result of the small size and close proximity of the components. As of 2012, typical chip areas range from a few square millimeters to around 450 mm2, with up to 9 million transistors per mm2.Integrated circuits are used in virtually all electronic equipment today and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the low cost of integrated circuits.
  • studyres.com © 2025
  • DMCA
  • Privacy
  • Terms
  • Report