AP7175 Description Pin Assignments
... R2 is placed close to device ground. Connect the ground of the R2 to the GND pin by using a dedicated trace. Connect the pin of the R1 directly to the load for Kelvin sensing. No high current should flow through the ground trace of feedback loop and affect reference voltage stability. For the packag ...
... R2 is placed close to device ground. Connect the ground of the R2 to the GND pin by using a dedicated trace. Connect the pin of the R1 directly to the load for Kelvin sensing. No high current should flow through the ground trace of feedback loop and affect reference voltage stability. For the packag ...
An Introduction to SAFETY ANALYZER
... and with another earthed object would suffer no adverse effects even if a fairly large earth leakage current were to flow. This is because the impedance to earth from the enclosure is much lower through the protective earth conductor than it is through the person. However, if the protective earth co ...
... and with another earthed object would suffer no adverse effects even if a fairly large earth leakage current were to flow. This is because the impedance to earth from the enclosure is much lower through the protective earth conductor than it is through the person. However, if the protective earth co ...
ZXTD617MC Features and Benefits Mechanical Data
... 3. For a dual device surface mounted on 28mm x 28mm (8cm2) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is measured when operating in a steady-state condition. The heatsink is split in half with the exposed collector pads connected to each half. 4. Same ...
... 3. For a dual device surface mounted on 28mm x 28mm (8cm2) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is measured when operating in a steady-state condition. The heatsink is split in half with the exposed collector pads connected to each half. 4. Same ...
The Role of Packaging in Microelectronics
... - where not only transistors, but other crucial components are integrated on a chip. ...
... - where not only transistors, but other crucial components are integrated on a chip. ...
ZXTD717MC Features and Benefits Mechanical Data
... 3. For a dual device surface mounted on 28mm x 28mm (8cm2) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is measured when operating in a steady-state condition. The heatsink is split in half with the exposed collector pads connected to each half. 4. Same ...
... 3. For a dual device surface mounted on 28mm x 28mm (8cm2) FR4 PCB with high coverage of single sided 2 oz copper, in still air conditions; the device is measured when operating in a steady-state condition. The heatsink is split in half with the exposed collector pads connected to each half. 4. Same ...
AAT4687-1 数据资料DataSheet下载
... Over-voltage or over-temperature fault reporting output pin. Open drain. FLT goes low when input voltage exceeds the over-voltage threshold or an over-temperature fault occurs. An external pull up resistor to VIO (6.5V max) should be added. Enable input pin, active low. An internal pull-down resisto ...
... Over-voltage or over-temperature fault reporting output pin. Open drain. FLT goes low when input voltage exceeds the over-voltage threshold or an over-temperature fault occurs. An external pull up resistor to VIO (6.5V max) should be added. Enable input pin, active low. An internal pull-down resisto ...
AL8806 Description Pin Assignments
... Dimming and On/Off Control Input. Leave floating for normal operation. (VCTRL = VREF = 2.5V giving nominal average output current IOUTnom = 0.1/RS) Drive to voltage below 0.4V to turn off output current Drive with DC voltage (0.5V < VCTRL < 2.5V) to adjust output current from 20% to 100% of IO ...
... Dimming and On/Off Control Input. Leave floating for normal operation. (VCTRL = VREF = 2.5V giving nominal average output current IOUTnom = 0.1/RS) Drive to voltage below 0.4V to turn off output current Drive with DC voltage (0.5V < VCTRL < 2.5V) to adjust output current from 20% to 100% of IO ...
LTM8048 - Linear Technology
... VIN pin, but if the BIAS pin is connected to an external voltage higher than 3.1V, bias power will be drawn from the external source, improving efficiency. VBIAS must not exceed VIN. The RUN pin is used to turn on or off the LTM8048, disconnecting the output and reducing the input current to 1μA or ...
... VIN pin, but if the BIAS pin is connected to an external voltage higher than 3.1V, bias power will be drawn from the external source, improving efficiency. VBIAS must not exceed VIN. The RUN pin is used to turn on or off the LTM8048, disconnecting the output and reducing the input current to 1μA or ...
36V H-Bridge Transformer Driver for Isolated Supplies General Description Benefits and Features
... oscillator or driven by an external clock to synchronize multiple MAX13256 devices and control EMI behavior. Regardless of the clock source being used, an internal flip-flop stage guarantees a fixed 50% duty cycle to prevent DC current flow in the transformer as long as the period of the clock is co ...
... oscillator or driven by an external clock to synchronize multiple MAX13256 devices and control EMI behavior. Regardless of the clock source being used, an internal flip-flop stage guarantees a fixed 50% duty cycle to prevent DC current flow in the transformer as long as the period of the clock is co ...
BD80C0AFPS
... 7. Inspection using the set board The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the assembly setup is grounded an ...
... 7. Inspection using the set board The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the assembly setup is grounded an ...
MAX8848Y/MAX8848Z High-Performance Negative Charge Pump EVALUATION KIT AVAILABLE
... drive up to 7 white LEDs with regulated constant current for display backlight applications. By utilizing an inverting charge pump and extremely low-dropout adaptive current regulators, these ICs achieve very high efficiency over the full 1-cell Li+ battery voltage range even with large LED forward ...
... drive up to 7 white LEDs with regulated constant current for display backlight applications. By utilizing an inverting charge pump and extremely low-dropout adaptive current regulators, these ICs achieve very high efficiency over the full 1-cell Li+ battery voltage range even with large LED forward ...
TPS61161-Q1 数据资料 dataSheet 下载
... With a 40-V rated integrated switch FET, the TPS61161 is a boost converter that drives up to 10 LEDs in series. The boost converter runs at 600-kHz fixed switching frequency to reduce output ripple, improve conversion efficiency, and allow for the use of small external components. The default white ...
... With a 40-V rated integrated switch FET, the TPS61161 is a boost converter that drives up to 10 LEDs in series. The boost converter runs at 600-kHz fixed switching frequency to reduce output ripple, improve conversion efficiency, and allow for the use of small external components. The default white ...
second break down
... Fig. 2: i- v characteristic of a schottky diode. Forward bias i-v characteristics of a schottky diode is similar to that of a p-n junction diode. However, these diodes are designed to have lower forward voltage drop, the difference being 0.3-04V for the same forward current density. In the reverse d ...
... Fig. 2: i- v characteristic of a schottky diode. Forward bias i-v characteristics of a schottky diode is similar to that of a p-n junction diode. However, these diodes are designed to have lower forward voltage drop, the difference being 0.3-04V for the same forward current density. In the reverse d ...
BD9873CP-V5
... This monolithic IC contains P+ isolation and PCB layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when a resistor and transistor ...
... This monolithic IC contains P+ isolation and PCB layers between adjacent elements in order to keep them isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements. For example, when a resistor and transistor ...
LT1769 - Constant-Current/Constant
... ripple current in the converter, so it must have adequate ripple current rating. Worst-case RMS ripple current will be equal to one half of the output charge current. Actual capacitance value is not critical. Solid tantalum capacitors such as the AVX TPS and Sprague 593D series have high ripple curr ...
... ripple current in the converter, so it must have adequate ripple current rating. Worst-case RMS ripple current will be equal to one half of the output charge current. Actual capacitance value is not critical. Solid tantalum capacitors such as the AVX TPS and Sprague 593D series have high ripple curr ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.