Zynq-7000 All Programmable SoC PCB Design and Pin Planning Guide
... A via is a piece of metal making an electrical connection between two or more points in the Z space of a PCB. V ias carry signals or power between layers of a PCB. In current plated-through-hole (PTH) te chnology, a via is formed by plating the inner surface of a hole drilled thr ough the PCB. In cu ...
... A via is a piece of metal making an electrical connection between two or more points in the Z space of a PCB. V ias carry signals or power between layers of a PCB. In current plated-through-hole (PTH) te chnology, a via is formed by plating the inner surface of a hole drilled thr ough the PCB. In cu ...
Evaluation of Low-Inductance Capacitor Configurations for High
... capacitors depends on several parameters that are not part of a typical ESL measurement. The actual high-speed performance of an SMT capacitor is generally unrelated to its nominal ESL. Capacitors that have the lowest published ESL may not be the best capacitors to use in a particular application. I ...
... capacitors depends on several parameters that are not part of a typical ESL measurement. The actual high-speed performance of an SMT capacitor is generally unrelated to its nominal ESL. Capacitors that have the lowest published ESL may not be the best capacitors to use in a particular application. I ...
Virtex-6 FPGA PCB Design Guide www.BDTIC.com/XILINX UG373 (v1.2) June 10, 2010
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
7 Series FPGAs PCB Design Guide (UG483)
... About This Guide Xilinx® 7 series FPGAs include four FPGA families that are all designed for lowest power to enable a common design to scale across families for optimal power, performance, and cost. The Spartan®7 family is the lowest density with the lowest cost entry point into the 7 series portfol ...
... About This Guide Xilinx® 7 series FPGAs include four FPGA families that are all designed for lowest power to enable a common design to scale across families for optimal power, performance, and cost. The Spartan®7 family is the lowest density with the lowest cost entry point into the 7 series portfol ...
7 Series FPGAs PCB Design and Pin Planning Guide
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
Catalog information - Kriz
... withstand bank and system contingencies such as bank unbalance and system voltages higher than the rated maximum continuous operating voltage. ...
... withstand bank and system contingencies such as bank unbalance and system voltages higher than the rated maximum continuous operating voltage. ...
Virtex-4 PCB 设计指南
... complicated as the discrete components and devices mounted to them. The PCB designer has complete control over many aspects of the PCB. At the same time, current technology places constraints and limits on the geometries and resulting electrical properties. The following information is provided firs ...
... complicated as the discrete components and devices mounted to them. The PCB designer has complete control over many aspects of the PCB. At the same time, current technology places constraints and limits on the geometries and resulting electrical properties. The following information is provided firs ...
Virtex-5 FPGA PCB Designer’s Guide www.BDTIC.com/XILINX UG203 (v1.4) April 20, 2009
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
Dielectric Materials Model Questions:
... Unit – IV : Problems on Dielectric Materials 01/CR120 A parallel plate capacitor consists of two plates of area 500 sq.cm separated by a thin sheet of mica of thickness 0.075 mm. If the Є of mica ~ 6.5, then calculate the capacitance value. [Ans. 0.0383 μF] 02/BG162 Esti ...
... Unit – IV : Problems on Dielectric Materials 01/CR120 A parallel plate capacitor consists of two plates of area 500 sq.cm separated by a thin sheet of mica of thickness 0.075 mm. If the Є of mica ~ 6.5, then calculate the capacitance value. [Ans. 0.0383 μF] 02/BG162 Esti ...
Effects of sputter deposition parameters on stress in tantalum films
... Institute of Technology were stymied by adhesion failures of the Ta/Cu film stack. This work was undertaken to investigate the effect of stress in the films on adhesion and to develop a viable CMP process for Cu damascene technology. In depth studies of stress as a function of sputter deposition con ...
... Institute of Technology were stymied by adhesion failures of the Ta/Cu film stack. This work was undertaken to investigate the effect of stress in the films on adhesion and to develop a viable CMP process for Cu damascene technology. In depth studies of stress as a function of sputter deposition con ...
S230-30-4
... Each capacitor unit is constructed internally of smaller capacitors called elements or packs. These elements are constructed of aluminum foil electrodes and a dielectric of polypropylene film. The elements are arranged in a series and parallel combination (Figure 4) to achieve the voltage and kvar r ...
... Each capacitor unit is constructed internally of smaller capacitors called elements or packs. These elements are constructed of aluminum foil electrodes and a dielectric of polypropylene film. The elements are arranged in a series and parallel combination (Figure 4) to achieve the voltage and kvar r ...
Atlas ESR
... as it’s acronym implies, is the value of resistance that is effectively in series with an ideal capacitor. No capacitor is ideal of course, the detailed equivalent circuit of a typical capacitor is very complex. For many electrolytic capacitors however, the most important parameters regarding the ca ...
... as it’s acronym implies, is the value of resistance that is effectively in series with an ideal capacitor. No capacitor is ideal of course, the detailed equivalent circuit of a typical capacitor is very complex. For many electrolytic capacitors however, the most important parameters regarding the ca ...
2. Capacitors - Wikimedia Commons
... analogy clarifies a few aspects of capacitors: • The current alters the charge on a capacitor, just as the flow of water changes the position of the membrane. More specifically, the effect of an electric current is to increase the charge of one plate of the capacitor, and decrease the charge of the othe ...
... analogy clarifies a few aspects of capacitors: • The current alters the charge on a capacitor, just as the flow of water changes the position of the membrane. More specifically, the effect of an electric current is to increase the charge of one plate of the capacitor, and decrease the charge of the othe ...
product catalogue - amelec Electronic GmbH
... overvoltages (self-excitation phenomena). In case of wound rotor motor the reactive power of the capacitor bank must be increased by 5%. ...
... overvoltages (self-excitation phenomena). In case of wound rotor motor the reactive power of the capacitor bank must be increased by 5%. ...
Capacitance 3.0
... difference between them. But, in fact, this is not the case. The capacitance of a device depends only on its geometry and the insulating material between the plates. It is independent of the values of q and V. This must mean the ratio q/V remains constant even as the charge and potential difference ...
... difference between them. But, in fact, this is not the case. The capacitance of a device depends only on its geometry and the insulating material between the plates. It is independent of the values of q and V. This must mean the ratio q/V remains constant even as the charge and potential difference ...
Characterization of atomic layer deposition HfO2, Al2O3
... One of the most common methods to deposit MIM capacitor dielectric in the semiconductor industry is the PECVD method. The films deposited using this method typically result in relatively good electrical, physical, chemical, and thermal characteristics, have good film conformality, and can be deposit ...
... One of the most common methods to deposit MIM capacitor dielectric in the semiconductor industry is the PECVD method. The films deposited using this method typically result in relatively good electrical, physical, chemical, and thermal characteristics, have good film conformality, and can be deposit ...
Aalborg Universitet Yang, Yongheng; Ma, Ke; Wang, Huai; Blaabjerg, Frede
... is of significant frequency dependency, as it is demonstrated in the experimental measurements in Fig. 4, where the ESRs of a film capacitor and an electrolytic capacitor were measured under different frequencies. It can be observed in Fig. 4 that the ESR of either the film capacitor or the electrol ...
... is of significant frequency dependency, as it is demonstrated in the experimental measurements in Fig. 4, where the ESRs of a film capacitor and an electrolytic capacitor were measured under different frequencies. It can be observed in Fig. 4 that the ESR of either the film capacitor or the electrol ...
W A T K I N S - J O H N S O N C O M P A N Y Semiconductor
... a Magnetic (e.g., Iron) Core a LOW Resistance Wire • Applying to the Terminals a TIME VARYING Current Results in a “Back EMF” voltage at the connection terminals ...
... a Magnetic (e.g., Iron) Core a LOW Resistance Wire • Applying to the Terminals a TIME VARYING Current Results in a “Back EMF” voltage at the connection terminals ...
ipmhvc2016_Li_Jinyu
... internal capacitor elements, package cells and electric liquids. The vibration original excitation is electric force, which is actually applied on the internal elements. Then, vibration was transferring from the internal capacitor elements to the surface outside. Normally, surface vibration was cons ...
... internal capacitor elements, package cells and electric liquids. The vibration original excitation is electric force, which is actually applied on the internal elements. Then, vibration was transferring from the internal capacitor elements to the surface outside. Normally, surface vibration was cons ...
Metal-layer capacitors in the 65nm CMOS process and the
... for investigating gate leakage issue of thin-oxide MOS capacitor, the test devices of stand-alone PMOS and NMOS capacitors were also included in the test chip. Moreover, to investigate the impact of gate leakage issue in RC-based ESD-detection circuit, power-rail ESD clamp circuits with different ca ...
... for investigating gate leakage issue of thin-oxide MOS capacitor, the test devices of stand-alone PMOS and NMOS capacitors were also included in the test chip. Moreover, to investigate the impact of gate leakage issue in RC-based ESD-detection circuit, power-rail ESD clamp circuits with different ca ...
CA230005EN
... 4. Ease of Maintenance: Locating a partially failed capacitor unit in a fuseless bank is very easy, especially when compared to internally fused banks. A readily available, low voltage capacitance meter is used to isolate the string containing the faulted capacitor unit. From there, individual unit ...
... 4. Ease of Maintenance: Locating a partially failed capacitor unit in a fuseless bank is very easy, especially when compared to internally fused banks. A readily available, low voltage capacitance meter is used to isolate the string containing the faulted capacitor unit. From there, individual unit ...
Summary
... The power and ground planes of a PCB have some amount of inductance associated with them. The geometry of these planes determines their inductance. Since power and ground planes are by definition a planar structure, current does not just flow through them in one direction. It tends to spread out as ...
... The power and ground planes of a PCB have some amount of inductance associated with them. The geometry of these planes determines their inductance. Since power and ground planes are by definition a planar structure, current does not just flow through them in one direction. It tends to spread out as ...
power cApAciTors
... any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production ...
... any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production ...
Capacitance and Dissipation Factor Measurement of Chip
... significantly change according to the measurement temperature, voltage (AC, DC) and frequency. One of the reasons of such a failure to obtain a reasonable capacitance can be that your have not performed the measurement correctly using specified measurement conditions. Another reason may be an incorr ...
... significantly change according to the measurement temperature, voltage (AC, DC) and frequency. One of the reasons of such a failure to obtain a reasonable capacitance can be that your have not performed the measurement correctly using specified measurement conditions. Another reason may be an incorr ...
KEY COMPONENTS FOR POWER FACTOR CORRECTION IN
... adjacent equipment, e.g. damage, pollution, or staining. Hence when disposing of the capacitors, no liquids or toxic gasses need to be considered. The plant oil in our MKP(D) and MKP-UHD capacitors is biodegradable and does not cause any trouble either, be it in the unlikely event of leakage or duri ...
... adjacent equipment, e.g. damage, pollution, or staining. Hence when disposing of the capacitors, no liquids or toxic gasses need to be considered. The plant oil in our MKP(D) and MKP-UHD capacitors is biodegradable and does not cause any trouble either, be it in the unlikely event of leakage or duri ...
Tantalum capacitor
A tantalum electrolytic capacitor, a member of the family of electrolytic capacitors, is a polarized capacitor whose anode electrode (+) is made of tantalum on which a very thin insulating oxide layer is formed, which acts as the dielectric of the capacitor. A solid or liquid electrolyte which covers the surface of the oxide layer serves as the second electrode (cathode) (-) of the capacitor. Because of its very thin and relatively high permittivity dielectric layer, the tantalum capacitor distinguishes itself from other conventional and electrolytic capacitors in having high capacitance per volume (high volumetric efficiency) and lower weight.Most tantalum capacitors are available as SMD chip capacitors with a solid manganese dioxide or solid polymer electrolyte. A solid electrolyte ensures low ESR values and a stable electrical behavior over a broad temperature range. The high specific capacitance of tantalum capacitors makes them particularly suitable for passing or bypassing low-frequency signals up to some mega-hertz and storing large amounts of energy to support the power rails of highly integrated circuits. Especially the SMD version with its small size and weight make tantalum capacitors attractive for flat or small products. However, due to the cost of tantalum ore, tantalum electrolytic capacitors are considerably more expensive than comparable aluminum electrolytic capacitors.Special “wet” tantalum capacitors with non-solid electrolytes often have military approvals and are used in military or aerospace applications.Tantalum capacitors are polarized components. Reverse voltage or ripple currents higher than specified can destroy the dielectric and thus the capacitor. For safe operation of tantalum capacitors, special circuit design rules are specified from the manufacturers.