Schneider...what do the markings on circuit breakers mean?
... 1. Line and load designation – Circuit breakers marked with “line” and “load” designations are not suitable for reverse connection. Circuit breakers with interchangeable trip units must be marked “line” and “load” unless there is no risk of shock when changing the trip unit. 2. Interrupting ratings ...
... 1. Line and load designation – Circuit breakers marked with “line” and “load” designations are not suitable for reverse connection. Circuit breakers with interchangeable trip units must be marked “line” and “load” unless there is no risk of shock when changing the trip unit. 2. Interrupting ratings ...
Low Inductance Capacitor Array
... amp current transient with a rise time of 1nSec, and the PDS must remain within 5% of a 1.8V power supply. The amount of inductance allowed is estimated to be: L=1.8V*0.05*(1nSec/20A)=4.5pH [11] Given this is a mounted inductance (hence the ESL of the capacitor must be below4.5pH); it is difficult t ...
... amp current transient with a rise time of 1nSec, and the PDS must remain within 5% of a 1.8V power supply. The amount of inductance allowed is estimated to be: L=1.8V*0.05*(1nSec/20A)=4.5pH [11] Given this is a mounted inductance (hence the ESL of the capacitor must be below4.5pH); it is difficult t ...
Evaluates: MAX6956 MAX6956 Evaluation Kit General Description Features
... directory) using the Browse button. During device driver installation, Windows may show a warning message indicating that the device driver Maxim uses does not contain a digital signature. This is not an error condition and it is safe to proceed with installation. Refer to the USB_Driver_Help.PDF do ...
... directory) using the Browse button. During device driver installation, Windows may show a warning message indicating that the device driver Maxim uses does not contain a digital signature. This is not an error condition and it is safe to proceed with installation. Refer to the USB_Driver_Help.PDF do ...
Zynq-7000 All Programmable SoC PCB Design Guide (UG933)
... application specific, they are not documented in this user guide. The dimensions of the AP SoC package, in combination with PCB manufacturing limits, define most of the geometric aspects of the PCB structures described in this section, both directly and indirectly. This significantly constrains the ...
... application specific, they are not documented in this user guide. The dimensions of the AP SoC package, in combination with PCB manufacturing limits, define most of the geometric aspects of the PCB structures described in this section, both directly and indirectly. This significantly constrains the ...
AN2764, Improving the Transient Immunity Performance of
... MCU performance when subjected to transients. These design considerations include the composition of ESD suppression devices on I/O pins, the design and layout of I/O pin structures, and any dedicated EMC circuitry. ESD devices, which are normally designed to prevent damage during part handling and ...
... MCU performance when subjected to transients. These design considerations include the composition of ESD suppression devices on I/O pins, the design and layout of I/O pin structures, and any dedicated EMC circuitry. ESD devices, which are normally designed to prevent damage during part handling and ...
Institutionen för systemteknik Department of Electrical Engineering USB 2.0 Audio device Examensarbete
... When developing electronic devices the components used in a project must have some kind of representation on the actual PCB. This is done via so called footprints. A footprint contains information of including pads/vias used as electrical terminals between the component and the interconnections on t ...
... When developing electronic devices the components used in a project must have some kind of representation on the actual PCB. This is done via so called footprints. A footprint contains information of including pads/vias used as electrical terminals between the component and the interconnections on t ...
Varying a component
... 2) Ignore the connections labeled OS1 and OS2. In practical lab situations, an adjustable resistor (potentiometer) can be connected between these terminals to “zero” the op amp (to set the output to 0V when the input is 0V). This is somewhat like zeroing your bathroom scale. ...
... 2) Ignore the connections labeled OS1 and OS2. In practical lab situations, an adjustable resistor (potentiometer) can be connected between these terminals to “zero” the op amp (to set the output to 0V when the input is 0V). This is somewhat like zeroing your bathroom scale. ...
Advantages of Solid-State Relays Over Electro
... SSR solution. In the case of analog line card design, where channel density is critical and available board space is limited, additional board area savings can ...
... SSR solution. In the case of analog line card design, where channel density is critical and available board space is limited, additional board area savings can ...
c30_mods.pdf
... and V2B is followed by a 470k resistor (R5) paralleled with a 470pf cap (C1), which make up an RC network. I recommend replacing C1 with a 390pf silver mica cap and R5 with a 390k resistor. With the other mods outlined here, those values give a tone which is bright enough for blues, yet has a strong ...
... and V2B is followed by a 470k resistor (R5) paralleled with a 470pf cap (C1), which make up an RC network. I recommend replacing C1 with a 390pf silver mica cap and R5 with a 390k resistor. With the other mods outlined here, those values give a tone which is bright enough for blues, yet has a strong ...
termination, layout, and routing
... solution is to flood the outer PCB layers—where no signal is present—with VDD. Standard characteristic impedance (ZO) of 50–60Ω is recommended for all traces. The 60Ω level also provides a good match to the sum of the output impedance of the controller/FPGA driver and any series resistors used; 60Ω ...
... solution is to flood the outer PCB layers—where no signal is present—with VDD. Standard characteristic impedance (ZO) of 50–60Ω is recommended for all traces. The 60Ω level also provides a good match to the sum of the output impedance of the controller/FPGA driver and any series resistors used; 60Ω ...
Hafler DH-500 Power Amplifier
... A power transformer of this size puts out a noticeable hum field, even though the special design of this transformer minimizes such radiation. If the amplifier is to be installed close to a record player, you should first check for freedom from hum pickup by the phono cartridge. Some cartridges are ...
... A power transformer of this size puts out a noticeable hum field, even though the special design of this transformer minimizes such radiation. If the amplifier is to be installed close to a record player, you should first check for freedom from hum pickup by the phono cartridge. Some cartridges are ...
MAX1385EVC16-MAX1385EVKIT.pdf
... Open-Loop System Checkout begins. Operate the GATE1/GATE2 sliders (Figure 3) while watching the current indicator to verify that the MAX1385 is connected to the target FETs. Once the gate control, temperature, and current-measurement connections have been verified, click the Start Calibration button ...
... Open-Loop System Checkout begins. Operate the GATE1/GATE2 sliders (Figure 3) while watching the current indicator to verify that the MAX1385 is connected to the target FETs. Once the gate control, temperature, and current-measurement connections have been verified, click the Start Calibration button ...
Virtex-4 PCB 设计指南
... Pads are small areas of copper in prescribed shapes. Anti-pads are small areas in prescribed shapes where copper is removed. Pads are used both with vias and as exposed outer-layer copper for mounting of surface-mount components. Anti-pads are used mainly with vias. Since plated through-hole vias ar ...
... Pads are small areas of copper in prescribed shapes. Anti-pads are small areas in prescribed shapes where copper is removed. Pads are used both with vias and as exposed outer-layer copper for mounting of surface-mount components. Anti-pads are used mainly with vias. Since plated through-hole vias ar ...
Physics – Measurements in Electricity 1 Use of
... • Always make sure that there is a resistor in the circuit connected in series with the ammeter. • Connecting an ammeter to a circuit with no resistor will damage the ammeter, as a very large current will flow through it. ...
... • Always make sure that there is a resistor in the circuit connected in series with the ammeter. • Connecting an ammeter to a circuit with no resistor will damage the ammeter, as a very large current will flow through it. ...
Effects of sputter deposition parameters on stress in tantalum films
... Figure 5: Generic hysteresis curve for voltage vs. reactive gas flow rate ......................... 9 Figure 6: Different process steps in the copper damascene process............................... 10 Figure 7: Schematic representation of typical CMP process ........................................ ...
... Figure 5: Generic hysteresis curve for voltage vs. reactive gas flow rate ......................... 9 Figure 6: Different process steps in the copper damascene process............................... 10 Figure 7: Schematic representation of typical CMP process ........................................ ...
APPLICATION NOTE AT02876: Atmel REB212BSMA Hardware User Manual Atmel MCU Wireless Introduction
... Analog ground pins are to be routed to the paddle underneath the IC. The trace width has to be similar to the pad width when connecting the pads, and increase, if possible, in some distance from the pad. This measure will decrease the parasitic inductance as far as possible. Each ground pin should b ...
... Analog ground pins are to be routed to the paddle underneath the IC. The trace width has to be similar to the pad width when connecting the pads, and increase, if possible, in some distance from the pad. This measure will decrease the parasitic inductance as far as possible. Each ground pin should b ...
Advanced Lithography.pdf
... made from a super ionic conductor such as silver sulfide . • When the template is contacted with metal, electrochemical etching can be carried out with an applied voltage. • proceeds as it selectively removes material from a the metal substrate with a controlled electrical potential, and concludes w ...
... made from a super ionic conductor such as silver sulfide . • When the template is contacted with metal, electrochemical etching can be carried out with an applied voltage. • proceeds as it selectively removes material from a the metal substrate with a controlled electrical potential, and concludes w ...
Evaluates: MAX7319 MAX7319 Evaluation Kit General Description Features
... 1.8V to 5.5V Supply As shipped from the factory, the V+ supply voltage is connected to the on-board 3.3V regulator by jumper JU2. To configure the EV kit to accept user-supplied power between 1.8V and 5.5V requires cutting traces and mounting additional components. The absolute maximum rating of the ...
... 1.8V to 5.5V Supply As shipped from the factory, the V+ supply voltage is connected to the on-board 3.3V regulator by jumper JU2. To configure the EV kit to accept user-supplied power between 1.8V and 5.5V requires cutting traces and mounting additional components. The absolute maximum rating of the ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.