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Integration of Front-End Electronics with the
Ceramic Detector
Ossy Siegmund,
Experimental Astrophysics Group,
Space Sciences Laboratory,
U. California at Berkeley
LAPPD Team meeting 6/10/2010
1
Anode Design for Ceramic Package has Pin Connections
High Voltage
connections
50Ω
structure
has 3.5mm
period
Complete
ground
plane back
surface
LAPPD Team meeting 6/10/2010
2
Anode interface Design for Ceramic Package
0.020” pins with
MoMnW - Ni brazed
into holes.
Spacing easily achieved
Reflections and
impedence mismatching?
Details can be
manipulated
LAPPD Team meeting 6/10/2010
3
Electronics interface Design for Ceramic Package
Crude
concept using
J-F Electronics
Scheme
Attach front end
chip array to
anode pins using
through hole
connections.
LAPPD Team meeting 6/10/2010
4
Bond circuit
ground planes to
back of anode.
Electronics interface Design for Ceramic Package
Through hole connections
on preamp boards
allow simple solder
connections. Ground
plane connection via
silver epoxy?
LAPPD Team meeting 6/10/2010
5
High Voltage Connections to Anode on Ceramic Package
High voltage
resistors
Cable to
HV supply
LAPPD Team meeting 6/10/2010
6