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Appendix M
GLOSSARY
ANSI
American National Standards Institute. Founded in 1918 by five engineering societies and three government
agencies, the Institute remains a private, nonprofit membership organization supported by a diverse
constituency of private and public sector organizations. Web page: http://web.ansi.org
ASSEMBLY
A number of parts of subassemblies or any combination therefore joined together.
ASSEMBLY, DOUBLE-SIDED
A packaging and interconnecting structure with components mounted on both the primary and secondary sides.
ASSEMBLY, MULTILAYER PRINTED CIRCUIT
A multilayer printed circuit board on which separately manufactured components and parts have been added.
ASSEMBLY, MULTILAYER PRINTED WIRING
A multilayer printed wiring board on which separately manufactured components and parts have been added.
ASSEMBLY, PACKAGING AND INTERCONNECTING (P&IA)
The generic term for an assembly that has electronic components mounted on either one or both sides of a
packaging and interconnecting structure.
ASSEMBLY, PRINTED BOARD
An assembly of several printed circuit assemblies or printed wiring assemblies, or both.
ASSEMBLY, PRINTED CIRCUIT
A printed circuit board on which separately manufactured components and parts have been added.
ASSEMBLY, PRINTED WIRING
A printed wiring board on which separately manufactured components and parts have been added.
ASSEMBLY, SINGLE-SIDED
A packaging and interconnecting structure with components mounted only on the primary side.
BALL GRID ARRAY (BGA)
Surface mountable package with solder balls as leads attached to the bottom of the package.
BASE MATERIAL
The insulating material upon which the conductor pattern may be formed. The base material may be rigid of
flexible. It may be a dielectric sheet or insulated metal sheet.
BASIC DIMENSION
Theoretically exact location of a component feature, indicated by a symbol or a number in a box.
(The tolerance on a base dimension location)
BUMPERED QUAD FLAT PACK (BQFP)
Package with leads extending from four sides, in a gull wing lead form, that has plastic corners that stick out from
the package.
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CASTELLATION
Metalized features that are recessed on the edges of a chip carrier which are used to interconnect conducting
surfaces or planes within or on the hip carrier.
CERAMIC
Inorganic, nonmetallic material, such as alumina or beryllia.
CERAMIC LEADLESS CHIP CARRIER
Ceramic package having metalized contacts at it’s periphery instead of wire leads.
CERAMIC QUAD FLAT PACK
Ceramic package with leads extending from four sides in a gull wing form.
CERDIP
Dual In-line Package consisting of a leadframe encased with a ceramic shell.
CHIP
Non polarized surface mount capacitor, resistor or inductor with tinned conductive solder terminals at opposite
ends of the part.
CHIP CARRIER (CC)
A low-profile package whose chip cavity or mounting area occupies a major fraction of the package area and
whose terminals consist of metal pad surfaces (on the leadless versions) or leads formed around the sides and
under the package or out from the package (on leaded versions).
NOTES:
1. The body of the chip carrier, usually square or of low aspect ratio, is similar to that of a flatpack.
2. When leads extend out from the package, the preferred term is “flatpack” (see FP).
CHIP ON BOARD (COB)
Integrated circuit device mounted directly to the printed board and interconnected with wire bonds.
CID
Certified Interconnect Designer
CLAMPED PACKAGE (PRESS-PACK) (CP)
A package, for high-current devices, in the form of a cylinder with a plane, circular high-current terminal on each
end, intended to be clamped against or between two bus bars acting as heat sinks.
COEFFICIENT OF THERMAL EXPANSION (CTE)
The linear thermal expansion per unit change in temperature.
COMPONENT
A separable part of a printed board assembly which performs a circuit function (e.g. a resistor, capacitor,
transistor, etc.)
COMPONENT MOUNTING SITE
A location o a P&I structure that consists of a land pattern and conductor fan-out to additional lands for testing or
vias that are associated with mounting of a single component.
CONDUCTIVE PATTERN
The configuration or design of the conductive material on the base material. (includes conductors, lands, and
through connections when these connections are in integral part of the manufacturing process).
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CONDUCTOR
A single conductive path in a conductive pattern.
CONSTRAINING CORE
A supporting plane that is internal to a packaging and interconnecting structure.
COPLANARITY
Distance from the seating plane to the lead farthest from the seating plane.
COURTYARDS
The area required to place land patterns and their respective components in adjacent proximity without
interference or shorting.
CYLINDER OR CAN (CY)
A generally cylindrical package. It usually has terminals that exit from one end parallel to the central axis of the
package and mounts perpendicular to the seating plane.
DISK-BUTTOM (DB)
A low-profile package that looks like a disk or button. It usually has terminals that exit radially from the
periphery of the package like spokes of a wheel or from the disk center. Terminals may be formed into a variety
of shapes.
DIP
Dual In-line Package designed with leads for through-hole mounting. Lead pitch is 2.54mm (.100”)
DPAK
Motorola surface mount replacement for the TO-220 transistor package.
DUAL IN-LINE PACKAGE (DIP)
A component which terminates in two straight and parallel rows of pins or lead wires.
ESD
Electrostatic discharge, when a static charge moves from one surface to another.
FIBER OPTIC (FO)
A microcircuit package that has one or more fiber-optic connectors. Its terminals may exit from, or attach to, any
surface of the package and may be formed in a variety of lead shapes.
NOTE: The fiber-optic connectors are considered to be terminals.
FIDUCIAL
.040” round etch pad with a .080” min. solder mask clearance. Used as a bomb-site target for automated assembly
equipment alignment tools.
FIDUCIAL, GLOBAL
Are placed in three corners, generally next to the tooling holes, of a printed circuit board. They are used for
assembly equipment alignment tools.
FIDUCIAL, LOCAL
Are placed in 2 corners of fine pitch quad flat packages. They are used for assembly equipment alignment.
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FINE-PITCH TECHNOLOGY (FPT)
Surface mounted components with a lead or termination pitch of 0.63 mm or less.
FLANGE MOUNT (FM)
A package that has a flange-mounted heat sink that is an integral part of the package and provides mechanical
mounting to a packaging interconnect structure or cold plate. It usually has terminals that exit from, or attach to,
any surface of the package in a variety of forms.
FLAT PACK (FP)
Package with leads on 2 sides. A low-profile package whose leads project parallel to, and are designed primarily
to be attached parallel to, the seating plane. (Normally) Leads may be formed generally away from the package
body. If the leads are formed back towards the package body, the correct term is “Chip Carrier” (see CC).
NOTES:
1. The leads typically originate at either two or four sides of a package.
2. The body of the flatpack is similar to that of a chip carrier.
GRID ARRAY (GA)
A low-profile package whose terminals are located on one surface in a matrix of at least three rows and three
columns; terminals may be missing from some row-column intersections.
GAGE PLANE
A plane established above the seating plane to be used as a standard for measuring lead length.
GULL WING
Leads that formed with a bend that looks like a birds wing.
HEAT SINK
Heat conductive material used to transmit heat from the silicon chip to the external environment. Usually a heat
sink is made of metal, typically aluminum.
HEAT SLUG
Heat sink that is exposed to the external environment.
HEAT SPREADER
Heat sink that is internal to the package.
HEAT DISSIPATING QFP (HQFP)
Quad flat pack designed with a heat sink.
HEAT DISSIPATING SOP (HSOP)
Small-outline package designed with a heat sink.
HEAT DISSIPATING SSOP (HSSOP)
Shrink small-outline package designed with a heat sink.
IEEE
Institute of Electrical and Electronic Engineers. IEEE Standards Board, 445 Hoes Lane, Piscataway, New
Jersey 08855-1331 USA. 800-678-4333, www.ieee.org
INTEGRATED CIRCUIT (IC)
An assembly of miniature electronic components simultaneously produced in batch processing, on or within a
single substrate to perform an electronic circuit function.
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Appendix M
IN-LINE PACKAGE (IP or IL)
A rectangular package having one row or two or more parallel rows of leads designed primarily for insertion
mounting perpendicular to the seating plane.
IPC
The Institute for Interconnecting and Packaging of Electronic Circuits.
JEDEC
Joint Electronic Device Engineering Council.
J-LEAD
Leads formed into a J pattern.
JUMPER WIRE
An electrical connection that is a part of the original design, added between two points on a printed wiring board
after the intended conductive pattern is formed.
LAND
A portion of a conductive pattern usually, but not exclusively, used for the connection, or attachment, or both of
components.
LAND PATTERN
A combination of lands intended for the mounting, interconnection and testing of a particular component.
LEAD
External Solderable metal leg strip coming from the component.
LEAD FRAME
The metallic portion of the package that completes the electrical path from the internal package to the external.
LEADLESS CHIP CARRIER (LCC)
Package with metalized contacts at it’s periphery instead of wires.
LFBGA
Low-profile, fine-pitch ball grid array (.80mm pitch). Provide a minimal footprint and can benefit high bit-width
applications. LFBGA’s offer more power and ground pins than other packages, providing a clear advantage in
ground bounce. This package provides the most effective solution for performance issues such as high thermal
power dissipation, skew and pin-to-pin inductance. Small impedance variation between pins on the LFBGA
package results in lower Skew.
LONG-FORM PACKAGE (LF)
A cylindrical or elliptical tubular package having terminal end-caps or axial leads.
MASTER DRAWING
A document that shows the dimensional limits or grid locations applicable to any or all parts of a printed board
(rigid of flexible), including the arrangement of conductive and nonconductive patterns or elements.
MELF
Metal Electrode Face Bonded. Comes in a cylindrical package. Usually diodes and resistors.
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Appendix M
MICROELECTRONIC ASSEMBLY (MA)
An assembly of unpackaged microcircuits and/or packaged microcircuits, which may also include discrete
devices, so constructed on a packaging interconnect structure that for the purpose of specification, testing,
commerce, and maintenance, the package is considered to be an indivisible component.
MICROWAVE PACKAGE (MW)
A package specially designed to provide device operation at microwave frequencies.
MIXED MOUNTING TECHNOLOGY
A component mounting technology that uses both through-hole and surface mounting technologies on the same
packaging and interconnecting structure.
MOLD FLASH
Thin layer of mold compound that extends from the sides of the package onto the leads and/or between the leads
generated during encapsulation.
MQUAD
Quad flat pack style package with a metal shell as opposed to plastic. MQUAD is a trademark of Olin
Corporation, registered in the USA
MULTICHIP MODULE (MCM)
A module or package capable of supporting several chips on a package.
NOM
Abbreviation for nominal
NOMINAL
Average value for a given measurement
MRP
Manufacturing resource planning
PACKAGING AND INTERCONNECTING STRUCTURE (P&IS)
The generic term for a completely processed combination of substrates, metal planes or constraining cores, and
interconnection wiring used for the purpose of mounting components.
PIN GRID ARRAY (PGA)
Dual-in-line package consisting of a leadframe encased with a ceramic shell.
PITCH
Pin to pin or lead terminal to lead terminal spacing.
PLASTIC
A polymeric material used for encapsulation. Also known as mold compound.
PLASTIC FLANGE MOUNT (PFM)
Through-hole package with a tab for thermal heat dissipation.
PLASTIC LEADED CHIP CARRIER (PLCC)
Plastic package designed for surface mounting with J-lead configuration.
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Appendix M
PLASTIC QUAD FLAT PACKAGE (PQFP)
Plastic package with leads extending from four sides in a gull lead form.
PLATED-THROUGH HOLE (PTH)
A hole in which electrical connections is made between internal or external conductive patterns, or both, by the
plating of metal on the wall of the hole.
PRESS FIT (PF)
A round or elliptical package whose mechanical mounting area is presses into the packaging interconnect
structure or cold plate for purposes of thermal and electrical connection.
PRIMARY SIDE
That side of the packaging and interconnecting structure that contains the most or more complex component.
PRINTED BOARD
The general term of completely process printed circuit or printed wiring configurations. It includes rigid of
flexible, signal, double and multilayer boards.
PRINTED WIRING
The conductive pattern intended to be formed on a common base, to provide point-to-point connection of discrete
components, but no to contain printed components.
POST or STUD MOUNT (PM)
A package whose mechanical mounting device is a threaded stud, threaded hole, or post for mounting to the
packaging and interconnect structure or cold plate.
QUAD FLAT PACK (QFP)
Package with leads extending from four sides in a gull lead form.
QUARTER SMALL OUTLINE PACKAGE (QSOP)
Package with leads extending from 2 sides in a gull lead form. Lead pitch is .635mm (.025 inches).
REGISTRATION
The degree of conformity of the position of a pattern, or a portion thereof, with its intended position or with that
of any other conductor layer of a board.
SEATING PLANE
A plane generated, when the package is at rest, between the bottom of leads and the contact surface.
SECONDARY SIDE
That side of the packaging and interconnecting structure that is opposite of the primary side.
SHRINK DUAL-IN-LINE PACKAGE (SDIP)
Package designed with leads for through-hole mounting. Lead pitch is 1.78mm (.070 inches).
SMALL OUTLINE (SO)
A low-profile rectangular surface-mount component package. Its chip (die) is bonded to an inner land contact
area, primarily a lead frame.
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Appendix M
SPECIAL-SHAPE PACKAGE
A miniature component package whose devices require a special shape. Its terminals may project from one or
more surfaces.
STATIC ELECTRICITY
An electrical charge that has accumulated or built up on the surface of a material.
STATIC ELECTRICITY CONTROL
A technique where materials and systems are employed to eliminate/discharge static electricity buildup by
providing continuos discharge paths.
SUPPORTED HOLE
A hole in a printed board that has its inside surface plated or otherwise reinforced.
SUPPORTING PLANE
A planar structure that is a part of a packaging and interconnecting structure to provide mechanical support,
thermo-mechanical constraint, thermal conduction and/or electrical characteristics.
THERMAL EXPANSION MISMATCH
The absolute difference in thermal expansion of two components.
UNCASED CHIP (UC)
An uncased microminiature chip (die). Usually the chip has bonding pads, bumps, ect. That are bonded to pads or
lands on a lead-frame, tape, or substrate.
VME
VMEbus is a computer architecture. The term ‘VME’ stands for VERSAmodule Eurocard. The term ‘bus’ is
a generic term describing a computer data path, hence the name VMEbus. For more information contact:
VITA = VMEbus International Trade Association, 7825 E. Gelding, Suite 104, Scottsdale, AZ 85260,
(480)951-8866, www.vita.com.
VERTICAL SURFACE-MOUNT PACKAGE
A surface-mount package intended to be mounted perpendicular to the seating plane. Terminals are located in
one or more parallel rows.
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